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Samsung Bring 15TB SSD To Market
Samsung has now officially announced and started to ship its new Samsung PM1633a line of solid state drives for Enterprise Storage Systems, which includes the highest capacity SSD ever made by Samsung, the 15.35TB PM1366a model.
Revealed back during the 2015 Flash Memory Summit in August last year, the now available Samsung PM1633a enterprise SSD series is based on a standard 2.5-inch form factor and features a 12Gbps Serial Attached SCSI (SAS) interface. It also uses Samsung new controller as well as Samsung’s own 3rd generation 256Gb 48-layer TLC V-NAND.
As noted, the Samsung PM1633a lineup is based on Samsung’s 256Gb V-NAND flash chips. The 256Gb dies are stacked in 16 layers to form a single 512GB package and by adding up a total of 32 NAND packages, you get the 15.36TB model. According to Samsung, the 3rd generation 256Gb V-NAND will provide both significant performance as well as reliability improvements compared to the PM1633 drive which used 2nd generation 32-layer 128Gb V-NAND flash.
The controller has also been upgraded to concurrently access large amounts of high-density NAND flash and the PM1633a 15.36TB model comes with no less than 16GB of cache.
When it comes to performance, the Samsung PM1633a provides sequential read and write performance of up to 1,200MB/s while random 4K performance is set at up to 200,000 IOPS for read and up to 32,000 IOPS for write. The new Samsung PM1633a enterprise SSD also offers high high reliability date with 1DWPD (drive writes per day), adding up to 15.36TB that can be written every day without failure, which is quite important in the enterprise market.
While the 15.36TB model of the Samsung P1633a is already shipping to select enterprise customers, Samsung is also promising a wide range of capacities, including 480GB, 960GB, 1.92TB, 3.84TB and 7.68TB. According to Samsung, enterprise managers can now fit twice as many drives in a standard 19-inch 2U rack compared to a 3.5-inch storage drive.
Unfortunately, Samsung did not reveal any details regarding the price but we doubt that such high capacity and performance will have a low price tag.
Courtesy-Fud
Micron Ships Hybrid Memory Cube
Micron Technology has announced that is is currently shipping 2GB Hybrid Memory Cube (HMC) engineering samples that represent a dramatic step forward in memory technology and are designed for applications that require high-bandwidth access to memory like data processing, data packet buffering or storage.
According to Micron, the Hybrid Memory Cube uses advanced through-silicon vias (TSVs)-vertical conduit that connect a stack of individual chips in order to combine high-performance logic with Micron’s DRAM. The current engineering sample features a 2GB memory cube that consists of four 4Gb DRAM dies. It provides 160GB/s of memory bandwidth while using up to 70 percent less energy per bit when compared to currently available technologies.
Micron expects 4GB HMC engineering samples to be available in early 2014 while volume production of both 2GB and 4GB HMC is scheduled to begin later in 2014.