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Will Intel Release Skylake This Year?
Intel has confirmed that it will release Core M processors this year based on its new Skylake chip design.
Intel CEO Brian Krzanich said at the Goldman Sachs Technology and Internet conference that the the new Core M chips are due in the second half of the year and will also extend battery life in tablets, hybrids, and laptop PCs.
The new chips will mean much thinner tablets and mobile PCs which will make Apple’s Air look decidedly portly. Intel’s Core M chips, introduced last year, are based on the Broadwell but the Skylake chips should also improve graphics and general application performance.
The Skylake chips will be able to run Windows 10, as well as Google’s Chrome and Android OSes, Krzanich said. But most existing Core M systems run Windows 8.1, and Intel has said device makers haven’t shown a lot of interest in other OSes. So most Skylake devices will probably run Windows 10. Chipzilla is expected to give more details about the new Core M chips in June at the Computex trade show in Taipei.
Skylake systems will also support the second generation of Intel’s RealSense 3D camera technology, which uses a depth sensor to create 3D scans of objects, and which can also be used for gesture and facial recognition. The hope is that the combination of Skylake and a new Windows operating system will give the PC industry a much needed boost.
In related news, Intel announced that socketed Broadwell processors will be available in time for Windows 10.
Intel Investing Big In Isreal
Intel is investing a further $550 million in Israel, more specifically in the upgrade of its Fab 28 in Kiryat Gat.
According to Israel21c, this will bring the total scope of Intel investments in Israel to over $6 billion since 2006. The Kiryat Gat facility is likely to be one of the first Intel 10nm fabs.
Israeli Ministry of Economy official Ziva Eger said the investment will help create thousands of jobs and reinforce the country’s standing as a world leader in technology.
“The agreement signed today between the Industrial Cooperation Authority and Intel is another expression of Intel’s contribution by way of its purchase of equipment, new technologies and Israeli products developed together with Intel,” said CEO of Intel Israel Maxine Fassberg.
Fab 28 currently churns out 22nm silicon for Intel. The fab was passed over for the 14nm upgrade. A source familiar with the matter told us that Israel competes with Ireland for every node upgrade.
“We lost 14nm to Ireland and won 10nm,” the source said.
Israel is currently in a better position to offer incentives and subsidies for such investments, as Ireland’s ‘business-friendly’ tax policies are being scrutinized by the European Union.
Intel is expected to launch the first 10nm CPU in 2016, followed by 7nm parts a couple of years later.
Intel To Add Broadwell To NUC Series
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Intel is planning to update its rather successful NUC (Next Unit of Computing) series and as you can expect, they will come with Broadwell CPUs inside.
Intel isn’t hiding the external design of the new cases and there is a dominant yellow connector at the front of the new NUC, and this one should be providing charging power even when the device is turned off.
The board comes with either M2 storage or single SATA and there will be two different designs one exclusively for M2 drive and the second taller that will be able to take 2.5 inch SSD or HDD as well.
We will probably learn more details at CES 2015 that is about to start in less than three weeks from now, but the Broadwell in this small form factor will get a speed boost and some future prove technologies such as M2 SSD support.
We are running Core i5 4200 powered NUC with Windows 10 and it really works great powered by 240GB Kingston mS200 mSata SSD and Impact SO DIMM memory. These machines takes less than half an hour to assemble and boot into windows, including Windows 10 and make a perfect choice for the lovers of quiet computing.
The new version will obviously run at least slightly faster than the one we are testing and the marketing is excluding about “the one with the yellow USB connector”.
Intel’s Cherry Trail Coming In 2015
Bay Trail was quite a big deal when it started shipping in late 2013.
It was a tablet chip that enabled great design wins such as the affordable Asus T100TA and even in late 2014 Asus used the platform to create the EeeBook X205, a $199 netbook.
Both of these designs are based on Intel’s Bay-Trail M processor, a year old 22nm quad-core processor based on the Silvermont design. Some machines that are coming with LTE, both netbooks and tablets and there will be new chip coming in 2015. It is called LTE Advanced XMM7360 chip and supports LTE Cat 10,3 CA up to 450 Mbits download and upload.
Intel will also offer Morrefield quad cores for machines with lower TDP ratings, especially tablets, and at some point in 2015 it will introduce its 14nm Airmont core based Cherry Trail processor. Cherry Trail based on 14nm Airmont core was originally expected in late 2014, but it got pushed towards middle of 2015.
Intel is clearly encountering more obstacles moving from the 22nm to the 14nm manufacturing process, but considering that most ARM competitors still have to start commercially shipping its 20nm SoCs in significant volumes, Intel still has a manufacturing node advantage. If only Intel had as many design wins to go along with its cutting edge fabs, as the company has been struggling to ship 40milion tablets in 2014, as promised.
Braxton will replace Cherry Trail in 2016. Braxton is a tock architecture, another 14nm design based on the quad-core Goldmont core. When it comes to the Performance Media Internet Device (MID) market Intel has another chip planned in 2016. It calls it SoFIA MID and the chip comes in intels 14nm manufacturing process.
Value and Entry markets for Media Internet Device (MID) and phones includes four new SoFIA parts, but with all these new and exciting chips Intel has to compete against some advanced chips coming on line in 2015, including the Qualcomm Snapdragon 810 20nm, Nvidia Erista and more affordable Mediatek solutions such as the MT6795 A53-based octa-core and its successor.
Are Transparent Semiconductors Next?
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Scientist have emerged from their smoke filled labs with transparent thin-film organic semiconductors that could become the foundation for cheap, high-performance displays. Two university research teams have worked together to produce the world’s fastest thin-film organic transistors, proving that this experimental technology has the potential to achieve the performance needed for high-resolution television screens and similar electronic devices.
According to the latest issue of Nature Communications, engineers from the University of Nebraska-Lincoln (UNL) and Stanford University show how they created thin-film organic transistors that could operate more than five times faster than previous examples of this experimental technology.
Research teams led by Zhenan Bao, professor of chemical engineering at Stanford, and Jinsong Huang, assistant professor of mechanical and materials engineering at UNL used their new process to make organic thin-film transistors with electronic characteristics comparable to those found in expensive, curved-screen television displays based on a form of silicon technology.
At the moment the high tech method is to drop a special solution, containing carbon-rich molecules and a complementary plastic, onto a spinning platter made of glass. The spinning action deposits a thin coating of the materials over the platter. The boffins worked out that if they spun the platter faster and coated a tiny portion of the spinning surface, equivalent to the size of a postage stamp they could put a denser concentration of the organic molecules into a more regular alignment. The result was a great improvement in carrier mobility, which measures how quickly electrical charges travel through the transistor.