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No LTE On IBM’s SoC Until 2014
Intel is working on integrated LTE modems for its upcoming SoC designs, but CEO Paul Otellini claims they will not be ready for prime time until 2014.
In a recent conference call Otellini was directly asked about Intel’s plans for LTE integration and said “higher levels of integration” are expected next year. He went on to say that the first Intel-based phones with LTE should launch in early 2014, in time for the Mobile World Congress.
Otellini said Intel’s wireless team, formerly a business unit of Infineon, is making good progress in LTE.
“We believe we have a very competitive solution. The Infineon team is known for not necessarily being first to market, but being really good at engineering a very solid solution and being cost effective and cost competitive and I think that they are doing a very good job with respect to this product,” said Otellini.
Is Intel Really Catching ARM?
A new report suggests that Intel is close to matching ARM on power efficiency.
The study by Bernstein Research analysts said that the days of Intel being mocked because its power-hungry chips shortened the battery life of mobile devices could be over. Bernstein noted that the ARM camp has such a commanding lead in phones and tablets that Intel probably won’t make much of a dent in those markets for a couple of years — even with its energy-efficient chips.
But it said that both company’s chip types “are very close in terms of power efficiency and processing power.” It said that the fight between the ARM and Intel camps will heat up meaningfully as early as 2013, with likely damages on both sides and no winner. For its study, Bernstein compared Intel’s chip in a Motorola RAZR phone and a RAZR phone with an ARM chip. It also compared both chips in similar tablets outfitted with the Windows 8.
The bad news in the report for Intel was that ARM’s chips have become more powerful, making them “a very compelling choice” for consumers looking for low-end notebooks.
Intel Details 22nm SoC
Thanks to a long spate of bad luck over at AMD, Intel now finds itself in a rather safe market lead, at least in high-end and server markets. However, in the low-end and mobile, Intel has a lot of catching up to do.
ARM still dominates the mobile market and Intel is looking to take on the British chip designer with new 22nm SoCs of its own. Intel outlined its SoC strategy at the 2012 International Electron Devices Meeting in San Francisco the other day.
The cunning plan involves 3D tri gate transistors and Intel’s 22nm fabrication process, or in other words it is a brute force approach. Intel can afford to integrate the latest tech in cheep and cheerful 22nm Atoms, thus making them more competitive in terms of power efficiency.
Since Intel leads the way with new manufacturing processes it already has roughly a year of experience with 22nm chips, while ARM partners rely on 28nm, 32nm and more often than not, 40nm processes. Intel’s next generation SoCs will also benefit from other off-the-shelf Intel tech, such as 3D tri-gate transistors.