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Intel Looking Into Atomic Energy
May 25, 2016 by admin
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Shortly after cancelling two generations of Atom mobile chips, Intel putting its weight behind future low-power mobile technologies with a new research collaboration with a French atomic energy lab.
Fundamental research leading towards faster wireless networks, secure low-power technologies for the Internet of Things, and even 3D displays will be the focus of Intel’s collaboration with the French Alternative Energies and Atomic Energy Commission (CEA).
Intel and the CEA already work together in the field of high-performance computing, and a new agreement signed Thursday will see Intel fund work at the CEA’s Laboratory for Electronics and Information Technology (LETI) over the next five years, according to Rajeeb Hazra, vice president of Intel’s data center group.
The CEA was founded in 1945 to develop civil and military uses of nuclear power. Its work with Intel began soon after it ceased its atmospheric and underground nuclear weapons test programs, as it turned to computer modeling to continue its weapons research, CEA managing director Daniel Verwaerde said Thursday.
That effort continues, but the organization’s research interests today are more wide-ranging, encompassing materials science, climate, health, renewable energy, security and electronics.
These last two areas will be at the heart of the new research collaboration, which will see scientists at LETI exchanging information with those at Intel.
Both parties dodged questions about who will have the commercial rights to the fruits of their research, but each said it had protected its rights. The deal took a year to negotiate.
“It’s a balanced agreement,” said Stéphane Siebert, director of CEA Technology, the division of which LETI is a part.
Who owns what from the five-year research collaboration may become a thorny issue, for French taxpayers and Intel shareholders alike, as it will be many years before it becomes clear which technologies or patents are important.
Hazra emphasized the extent to which Intel is dependent on researchers outside the U.S. The company has over 50 laboratories in Europe, four of them specifically pursuing so-called exa-scale computing, systems capable of billions of billions of calculations per second.
Source-http://www.thegurureview.net/mobile-category/intel-look-to-atomic-energy-for-mobile-technologys-future.html
Intel Selling 3D Smartphone
January 18, 2016 by admin
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Intel has created a new smartphone with a 3D RealSense camera that can recognize objects and detect motion and gestures, much like a Kinect camera.
The smartphone is being made available as a reference device for anyone interested in discovering new uses for 3D cameras in handsets. The 3D camera is a smaller and more advanced version of the RealSense cameras in PCs and tablets.
For $399, users will get an Android smartphone with a 6-inch screen that can display images at a 2560 x 1440-pixel resolution. The RealSense ZR300 depth camera, which is placed at the edge of the phone, can capture 10 million points per second. The phone also has a 2-megapixel front camera and 8-megapixel rear camera.
The phone isn’t for daily use, but more for capturing 3D images, taking cool selfies and experimenting with the RealSense camera. It has only 3G connectivity, so aside from the camera features it isn’t very useful beyond making basic phone calls. It has an Intel Atom x7-Z8700 processor, which is in Microsoft’s Surface 3, so don’t expect long battery life. It has 64GB of storage, Bluetooth, Wi-Fi and an HDMI port.
Users can reserve the smartphone; Intel did not provide a shipping date. It will only ship to U.S. customers.
Source- http://www.thegurureview.net/mobile-category/intels-3d-smartphone-to-go-on-sale-for-399.html
3D Printer Goes Retail
December 3, 2013 by admin
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MakerBot, a 3D printer maker which opened two new retail stores last week, is among the companies trying to bring the cutting-edge digital manufacturing technology to Main Street consumers, but skeptics say the debut may be premature.
MakerBot, a unit of Stratasys Ltd, opened retail stores this week in Boston and in Greenwich, Connecticut, both of which are twice the size of MakerBot’s first store, 1,500 square feet in downtown Manhattan.
The company offers designs for more than 100,000 items through its “Thingiverse” online user community. The products range from knick-knacks like zombie sculptures to jewelry, sink drains and even medical devices. They are printed using its line of corn-based plastic fibers in more than a dozen colors.
“For most people 3D printing is futuristic science fiction. We’re here to make it real,” said CEO Bre Pettis, who cut the ribbon at the store on Boston’s fashionable Newbury Street using scissors made on one of MakerBot’s Replicator printers which start at $2,199.
Pettis, who has purchased splashy magazine ads to promote 3D printers as holiday gifts, believes there could soon be a 3D printer on every block in America.
Yet some technology experts say 3D printers may not be ready for prime time because they are still much less user friendly than most modern consumer electronics.
“There is so much hype,” said Pete Basiliere, an analyst at technology research firm Gartner. “People are getting a little bit misled as to how easy it is,” he said.
Some investors also are skeptical of 3D printing’s readiness for the market. Short-seller Citron this week published an article questioning the earnings of Germany’s voxeljet AG’s, and shares in the sector fell, including those of MakerBot parent Stratasys and rivals 3D Systems Corp and ExOne Co.
Chip Makers Going After Cars
October 14, 2013 by admin
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Chip makers including Broadcom and Renesas Electronics are putting more focus on in-car entertainment with faster processors and networks for wireless HD movies and navigation, aiming to keep drivers informed and passengers entertained.
With PC sales slipping and the mobile device market proving highly competitive, chip makers are looking for greener pastures in other sectors like in-car entertainment and information.
From Renesas comes the R-Car M2 automotive SoC (System-on-a-Chip), which has enough power to handle simultaneous high-definition navigation, video and voice-controlled browsing.
The SoC is meant for use in mid-range systems. It features two ARM Cortex A-15 cores running at up to 1.5GHz and Renesas’ own SH-4A processor plus the PowerVR SGX544MP2 from Imagination Technologies for 3D graphics. This combination helps the M2 exceed the previous R-Car H1 with more than three times the CPU capacity and approximately six times better graphics performance.
Car makers that want to put a more advanced entertainment system in their upcoming models should go for the eight core R-Car H2 SoC, which was announced earlier this year. It is based on ARM’s big.LITTLE architecture, and uses four Cortex-A15 cores and another four Cortex-A7 cores.
The H2 will be able to handle four streams of 1080p video, including Blu-Ray at 60 frames per second, according to Renesas. Mass production is scheduled for the middle of next year, while the M2 won’t arrive in larger volumes until June 2015.
Broadcom on the other hand is seeking to drive better networking on the road. The company’s latest line of wireless chipsets for in-car connectivity uses the fast 802.11ac Wi-Fi wireless standard, which offers enough bandwidth for multiple displays and screen resolution of up to 1080p. Use of the 5GHz band for video allows it to coexist with Bluetooth hands-free calls on 2.4GHz, according Broadcom.
Broadcom has also implemented Wi-Fi Direct and Miracast. Wi-Fi Direct lets products such as smartphones, cameras and in this case in-car computers connect to one another without joining a traditional hotspot network, while Miracast lets users stream videos and share photos between smartphones, tablets and displays.
The BCM89335 Wi-Fi and Bluetooth Smart Ready combo chip and the BCM89071 Bluetooth and Bluetooth Smart Ready chip are now shipping in small volumes.
Samsung Plans To Go Low-End
February 13, 2012 by admin
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Samsung Electronics Co, the world’s top television maker, has seen TV sales firming up so far this year and plans to launch cheaper TVs, as demand for lower-end models increase, the head of its TV business said on Wednesday.
Demand for lower-end TVs has been increasing in recent months as major South Korean retailers such as E-Mart Co introduced flat-screen models that are as much as 40 percent cheaper through alliances with small local manufacturers.
“As long as there’s demand, we’re open to get into that segment,” Kim Hyun-suk, executive vice president of Samsung’s visual display division, told reporters.
“We’ve been preparing to introduce cheap models and have been studying to optimize production costs and retail prices. Those (cheap) models will be ready for sale in one or two months.”
Samsung, the most profitable TV maker, also introduced on Wednesday its highest-end premium set that it hopes will help boost profitability, as a fragile global economy threatens to sap demand growth this year after no growth in 2010.
The ES8000 model has voice, motion and face recognition functions, as well as 3D and Internet-enabled capabilities. The models, available in sizes of between 46 and 65 inches, will go on sale from this weekend in South Korea before a global launch in March.
Kim said Samsung’s TV sales so far this year have been stronger than a year ago and demand from China remained solid.
Adobe Patches Security Holes in Flash
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Adobe has released a security update for Flash Player in order to address several critical vulnerabilities, including one that is being exploited in the wild.
The Flash Player 10.3.183.10 for Windows, Mac and Linux, and Flash Player 10.3.186.7 for Android, contain patches for six security flaws.
One of them is a cross-site scripting (XSS) weakness that can be exploited to execute rogue actions on behalf of web sites or webmail providers if victims click on maliciously-crafted links.
“There are reports that this issue is being exploited in the wild in active targeted attacks designed to trick the user into clicking on a malicious link delivered in an email message,” Adobe warns in its security advisory.
XSS vulnerabilities are the result of improper user input validation and allow attackers to execute rogue code in the context of the current web site. For example, they can be leveraged to extract session cookies or load rogue forms into legitimate pages, which makes for very credible phishing attacks.
Adobe credits Google for reporting this cross-site scripting vulnerability, which is identified as CVE-2011-2444. This means it might have been detected in attacks against Gmail users.
Two other patched vulnerabilities allow for arbitrary code execution and are located in the AVM stack. One of them can also lead to a denial of service condition. Two remote code execution logic errors and a Flash Player security control bypass have also been addressed.
Users should deploy the new update as soon as possible because browser plug-ins like Java, Adobe Reader or Flash Player are amongst the most attacked pieces of software one can have on a computer. However, unlike Adobe Reader X (10.0) which features sandboxing technology, Flash Player doesn’t have any anti-exploitation mechanism built-in.
Flash Player 11 Launched With 3D Gaming
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Adobe Systems announced Flash Player 11 and Adobe Air 3 software Wednesday to assist developers in building more sophisticated applications with dozens of new features across smartphones and tablets as well as desktop computers.
The releases are Adobe’s biggest in two years, and will be available free of charge in early October, said Anup Murarka, Adobe’s director of product marketing. The related tools, Flash Builder and Flex, will support new features in Flash Player 11 and Adobe Air 3 by the end of the year.
The releases will enable delivery of 2D and 3D games over the Internet to various devices, Murarka said. Developers of enterprise applications will also find the 3D capabilities popular for data-centric apps. Enterprises, for example, will be able to build application dashboards to “visualize complex data sets” with 3D images, he said.
Developers will also be able to use the tools to more deeply integrate business software like Excel and Outlook in devices and to access hardware programming interfaces for functions such as Near-Field Communication being used more widely in smartphones, Murarka said.
The new versions will also help developers build more secure applications with the ability to leverage cryptographically secure random number generation, he said.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”