Qualcomm Finally Fixed The Snapdragon 810

Qualcomm and TSMC have reportedly worked out overheating issues on the Snapdragon 810.

Qualcomm never publicly admitted that the chip experienced the problems to begin with, but the rumour mill has been in overdrive for a while. Leaked LG Flex 2 benchmarks also suggested that something could be wrong, since the chip failed to impress.

The problem apparently caused the Snapdragon 810 to overheat at peak clocks and throttle, compromising performance. Such problems surfaced in some mobile devices in the past, namely the Nexus 4, but were the result of poor design decisions, not chip faults.

The latest rumors from China suggest that Qualcomm and TSMC managed to resolve the throttling issue. The info was apparently leaked to a Chinese analyst by a TSMC insider, but the reports are rather vague. The source said the revised Snapdragon 810 is expected to go into volume production by mid-March.

If true, this means the “fixed” chip is still not available for integration and may have an effect on product launches over the next few weeks, namely on devices which are expected to launch at the Mobile World Congress next month.

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Qualcomm’s Snapdragon Goes WiGi

he WiGig standard has been around since 2009, but we haven’t really seen it hitting that many retail devices. Back at IDF 2014, Intel demonstrated WiGig 802.11ad video, peripherals, 4K video transfer and it promised that Skylake based laptops will come out of the box with the technology.

WiGig will let you transfer up to 7Gbpps of audio, video or data via 2.4, 5 or 6GHz bands and is as fast as eight-antenna 802.11ac and nearly 50 times faster than highest 802.11n rate. It is backward compatible with WiFi standards, but due to its high frequency it is limited to short distances, usually up to 10 meters, cannot really penetrate walls but it can propagate by reflecting off of walls, ceilings or objects using beam forming.

Now Qualcomm showcased this technology for the first time and promised it inside Snapdragon 810 based devices. Qualcomm demonstrated peer-to-peer connection and transfer of 4K video between two 20nm Snapdragon 810 based tablets. One of the tablets was the sync side and it was connected directly to a 4K TV and it was clear that you could play a content from one tablet and sync it to the second one.

WiGig’s 7Gbps translates to 875MB per second in the best case scenario. The Qualcomm demo shows a Plutonium MSM8994 based tablet hitting up to 187MB a second (1.5 Gbit per second) available for data transfer, with 4K multi-device streaming on the side. WiGig can possibly get to external storage, enabling faster NAS systems, future peripherals such as keyboard and mouse and on a longer run it can completely eliminate the necessity for docking stations. It will take some time but this is the grand idea.

It remains to be seen when we will be able to buy first Snapdragon 810 device with 802.11ad WiGig abilities. Qualcomm mentioned 2015 a number of times, but there’s nothing more specific than that. A potential problem for this standard might be the speed of flash storage that is used in tablets and phones today. According to Androbench, the HTC One M8 can sequentially read 92.29 MB/s, sequentially write only 17 MB/s, while Nvidia’s Shield tablet can sequentially read 67.75 MB/s, and write only 14.09 MB/s.

The performance gets even less impressive with smaller files, but with numbers we are getting from latest 2014 devices, the flash has to increase speed up to 10 times in order to be ready to write files at 150MB. For theoretical maximum of ridiculously fast 875 MB/s we need about 50 times faster memory that the 14-17MB/s write speed available in the current generation of high end mobile devices.

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Intel Buys Into Altera

Technology gossip columns are full of news that Intel and Altera have expanded their relationship. Apparently, Altera has been Intel’s shoulder to cry on as the chip giant seeks to move beyond the declining PC market and the breakup of the Wintel alliance. Intel took the break up very hard and there was talk that Alteria might be just a rebound thing.

Last year Intel announced that it would manufacture Altera’s ARM-based quad-core Stratix 10 processors, as part of its efforts to grow its foundry business to make silicon products for third parties. Now the two vendors are expanding the relationship to include multi-die devices integrating Altera’s field-programmable gate arrays (FPGAs) and systems-on-a-chip (SoCs) with a range of other components, from memory to ASICs to processors.

Multi-die devices can drive down production costs and improve performance and energy efficiency of chips for everything from high-performance servers to communications systems. The multi-die devices will take advantage of the Stratix 10 programmable chips that Intel is manufacturing for Altera with its 14-nanometer Tri-Gate process. Intel’s three-dimensional transistor architecture combined with Altera’s FPGA redundancy technology leads to Altera being able to create a highly dense and energy efficient programmable chip die that can offer better integration of components.

At the same time, Intel officials are looking for ways to make more cash from its manufacturing capabilities, including growing its foundry business by making chips for other vendors. CEO Brian Krzanich and other Intel executives have said they will manufacture third-party chips even if they are based on competing infrastructure, which is the case with Altera and its ARM-based chips.

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