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Will GDDR5 Rule In 2016
AMD over-hyped the new High Bandwidth Memory standard and now the second generation HBM 2.0 is coming in 2016. However it looks like most of GPUs shipped in this year will still rely on the older GDDR5.
Most of the entry level, mainstream and even performance graphics cards from both Nvidia and AMD will rely on the GDDR5. This memory has been with us since 2007 but it has dramatically increased in speed. The memory chip has shrunken from 60nm in 2007 to 20nm in 2015 making higher clocks and lower voltage possible.
Some of the big boys, including Samsung and Micron, have started producing 8 Gb GDDR5 chips that will enable cards with 1GB memory per chip. The GTX 980 TI has 12 chips with 4 Gb support (512MB per chip) while Radeon Fury X comes with four HMB 1.0 chips supporting 1GB per chip at much higher bandwidth. Geforce Titan X has 24 chips with 512MB each, making the total amount of memory to 12GB.
The next generation cards will get 12GB memory with 12 GDDR5 memory chips or 24GB with 24 chips. Most of the mainstream and performance cards will come with much less memory.
Only a few high end cards such as Greenland high end FinFET solution from AMD and a Geforce version of Pascal will come with the more expensive and much faster HMB 2.0 memory.
GDDR6 is arriving in 2016 at least at Micron and the company promises a much higher bandwidth compared to the GDDR5. So there will be a few choices.
Source-http://www.thegurureview.net/computing-category/will-gddr5-rule-in-2016.html
Will UMC Chip Shipments Drop In The Fall?
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Foundry UMC is expecting its shipments to fall by five percent in the fourth quarter of 2015, as a result of ongoing inventory adjustments within the industry supply chain.
Revenues for the last part of the year will be adversely affected by an about one per cent drop in wafer ASPs and capacity at its plants will slide to 81-83 per cent in the fourth quarter from 89% in the third.
UMC’s had already lowered capacity in the third quarter. At the beginning of the year it was running at 94 percent.
The company’s revenues decreased 7.1 per cent to $1.07 billion in the third quarter, with gross margin slipping below 20 per cent.
UMC net profits were down 62.9 per cent on quarter, as both operating and non-operating income eroded. This is bad news because in the first three quarters of 2015, UMC’s net profits increased 35.8 per cent from a year earlier.
However UMC is continuing to invest in new capital and will spend $1.8 billion.
CEO Po-Wen Yen said that the continuing IC inventory adjustment will dampen fourth quarter wafer shipments, but UMC continues on the path towards long-term growth.
“Throughout 2015, UMC engineers and Fab12A have worked tirelessly to bring several new 28nm product tape-outs into volume production. “UMC is working to bring a timely conversion of new 28nm requirements into production, which will strengthen our business.”
Courtesy-http://www.thegurureview.net/computing-category/will-umc-chip-shipments-drop-in-the-fall.html
Semiconductor Sales Still Down In 2015
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Semiconductor Sales Still Down In 2015 : :: TheGuruReview.net ::
Sales of semiconductors have remained sluggish during 2015 and look set to drop still further in 2016, according to new research from Gartner.
Last quarter, 2.5 percent growth was expected for 2015, but this has been revised down to a one percent drop in the market. 2016 remains predicted to see a 3.3 percent drop.
“We are continuing to see weakness in end-user electronics demand in response to an uncertain economic environment, which is putting a dampener on 2015 spending,” said Takashi Ogawa, research vice president at Gartner. “Next year we are anticipating DRAM manufacturers to respond to oversupply with dramatic reductions in their investment plans.”
The drop likely comes off the back of weak PC sales too, with Gartner last week revealing that, despite the release of Windows 10, sales of devices slumped 7.7 percent in the third quarter.
The future looks brighter, though, and figures for 2017, 2018 and 2019 show significant growth with the losses of 2015 more than recovered as soon as 2017.
A number of key companies, including Intel, have cut spending in the past quarter against a backdrop of slow demand for electronics. This has led in some cases to semiconductor plants significantly shrinking production to avoid a surplus of obsolete chips in the fast evolving industry.
“In the DRAM market, weak end-market conditions combined with new foundries coming on line at Samsung and SK Hynix have created a weaker market than anticipated in our last forecast,” said Ogawa.
“As a result, we anticipate that DRAM manufacturers will move more quickly from investing in new capacity to a maintenance and upgrade existing capacity mode of operation.”
Meanwhile, NAND memory has actually moved to a small predicted growth of 0.1 percent against a 19.4 percent drop predicted last quarter. The rise of NAND thanks to alliances such as the one between SanDisk and HP has led Gartner to predict a 10 percent shift from DRAM to NAND in the next six months or so, while DRAM manufacturers will begin to slow investments around this time next year.
The news comes after reports that SanDisk is looking to consolidate its business by putting itself up for sale to another market player. WD and Micron are said to be likely buyers.
Source-http://www.thegurureview.net/computing-category/semiconductor-sales-still-down-in-2015.html
IBM and Intel Going GoFlo SOI
Soitec’s CEO and board chairman has raised an eyebrow or two when he said that the iPhone 6s has multiple RF chips built on silicon-on-insulator (SOI) substrates and that Intel and IBM are using the tech for their silicon photonics push.
According to EETimes Paul Boudre, who claimed that SOI is already being used by Apple and Intel even though neither company is broadcasting it. SOI appears to be on track to major market penetration even while the rest of the industry is talking FinFETs.
GlobalFoundries general manager Rutger Wijburg told the SEMICON Europa 2015 that his outfit’s 22-nanometer “22FDX” SOI platform delivers FinFET-like performance but at a much lower power point and at a cost comparable to 28-nanometer planar technologies.
The 300-millimeter $250 million FD-SOI foundry here in the “Silicon Saxony” area of Germany, builds on 20 years of GlobalFoundries’ investments in Europe’s largest semiconductor fabs.
GlobalFoundries said it will extend Moore’s Law by using fully-deleted silicon-on-insulator (FD-SOI) transistors on wafers bought from Soitec.
Many had thought that if GloFlo’s FD-SOI gamble paid off then it would be a while before FinFET would have a serious rival. But Boudre’s claims suggests that SOI is already being used.
Customers like Intel and OEMs supplying fully-deleted silicon-on-insulator (FD-SOI) RF transistors to Apple proves that SOI and Soitec are past the cusp of the growth curve, destined to ramp up exponentially.
The problem for Soitec is no one is really talking about it. Chipzilla is committed to the FinFET, because it is higher performance than FD-SOI, even though it is higher power too.
Boudre said that it was supplying SOI wafers to Intel for other applications that don’t require high-performance. For instance, our wafers are very good for their silicon photonics projects.
Apple is already using SOI for several radio frequency (RF) chips in their front-ends, because they use 20-times less power. The iPhone is still using gallium arsenide (GaAs) for its power amplifier (PA) because it needs the high-power device for good connections, but for other RF front-end chips, and in fact for all the chips that they want to keep “always on,” the lower power consumption of FD-SOI is pushing the smartphone makers to Soitec, Boudre said.
SOI wafers cost three-times as much as bulk silicon but the cost per die is less because of the simplified processing steps including fewer masks.
Normally GPS chips run on 0.8 volts and consume over 20 milliamps, so they must be turned off most of the time. But when they are made with SOI wafers, they can run on 0.4 volts and consume only 1 milliamp. The mobile device to leave them on all the time and new and more accurate location sensing and new kinds of location-based applications can be developed.
What is amusing then is that Intel’s reason for going with FinFETs was that SOI wafers were too expensive but it did find a use for it.
GlobalFoundries’ Saxony fab will offer four varieties of its 22FDX process.
FDX-ulp for the mainstream and low-cost smartphone market. This will use body-biasing to beat FinFETs on power, but equal them in performance.
FDX-uhp for networking applications using analogue integration to match FinFETs while minimizing energy consumption
FDX-ull for ultra-low power required by wearables and Internet of Things applications. This will have a 1 picoamp per micron leakage
DDX-rfa for radio frequency (RF) analogue applications delivering 50 percent lower power and reduced system costs for LTE-A cellular transceivers, high-order multiple-input/multiple-output (MIMO) WiFi combo chips and millimeter wave radar.
Courtesy-http://www.thegurureview.net/computing-category/ibm-and-intel-going-goflo-soi.html
AMD Increases FM2+ Lineup
AMD will expand its socket FM2+ chip lineup with three new parts – the A10-7890K and A8-7690K APUs, and the Athlon X4 880K CPU.
The new parts showed up on the compatibility list of socket FM2+ motherboards by BIOSTAR and it is not clear when they will be in the shops.
The architecture mentioned is “Kaveri,” but the silicon could be “Godavari” which is a Kaveri refresh.
The top of the range will be the A10-7890K, which has CPU clock speeds of 4.10 GHz out of the box. We do not know what the TurboCore frequency will be, but the current A10-7870K offers 3.90 GHz with 4.10 GHz TurboCore. The A8-7690K has a CPU clocks of 3.70 GHz. We are not sure what the iGPU clock speeds of the two chips.
The Athlon X4 880K is the most interesting. It has 4.00 GHz CPU clocks. The Athlon X4 FM2+ series lack integrated graphics that means that they are good for those who will buy discrete GPUs, on the FM2+ platform.
All three chips offer unlocked base-clock multipliers, enabling CPU overclocking.
Source-http://www.thegurureview.net/computing-category/amd-increases-fm2-lineup.html
Is Electricity In TSMC’s Future?
Contract chip-maker Taiwan Semiconductor Manufacturing Company (TSMC) is thinking of generating electricity in-house.
The cunning plan is to install electric generating equipment at its factories or even building its own power plant.
Apparently, the company’s electricity bill will go up by 50 per cent over the next ten years as it moves to more-advanced technologies.
Taiwan is already facing power shortage problems and TSMC is worried that its plans could be stuffed up.
TSMC has asked Taiwan’s Ministry of Economic Affairs (MOEA) and government-owned Taiwan Power Company (Taipower) about the feasibility of building its own power generators and related regulatory matters.
According to Digitimes companies can set up power generating equipment for use at their own factory sites, but the law has to be revised to allow TSMC to build its own power plant.
TSMC previously pointed out that it does not necessarily need nuclear power unless there is an alternative. We really hope that quote does not mean that TSMC is considering going nuclear.
Source-http://www.thegurureview.net/computing-category/is-electricity-in-tsmcs-future.html
More Details Uncovered On AMD’s ZEN Cores
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Our well informed industry sources have shared a few more details about the AMD’s 2016 Zen cores and now it appears that the architecture won’t use the shared FPU like Bulldozer.
The new Zen uses a SMT Hyperthreading just like Intel. They can process two threads at once with a Hyperthreaded core. AMD has told a special few that they are dropping the “core pair” approach that was a foundation of Bulldozer. This means that there will not be a shared FPU anymore.
Zen will use a scheduling model that is similar to Intel’s and it will use competitive hardware and simulation to define any needed scheduling or NUMA changes.
Two cores will still share the L3 cache but not the FPU. This because in 14nm there is enough space for the FPU inside of the Zen core and this approach might be faster.
We mentioned this in late April where we released a few details about the 16 core, 32 thread Zen based processor with Greenland based graphics stream processor.
Zen will apparently be ISA compatible with Haswell/Broadwell style of compute and the existing software will be compatible without requiring any programming changes.
Zen also focuses on a various compiler optimisation including GCC with target of SPECint v6 based score at common compiler settings and Microsoft Visual studio with target of parity of supported ISA features with Intel.
Benchmarking and performance compiler LLVM targets SPECint v6 rate score at performance compiler settings.
We cannot predict any instruction per clock (IPC improvement) over Intel Skylake, but it helps that Intel replaced Skylake with another 14nm processor in later part of 2016. If Zen makes to the market in 2016 AMD might have a fighting chance to narrow the performance gap between Intel greatest offerings.
Courtesy-Fud
AMD Misses Again
Fabless chipmaker AMD has come up with a mixed set of results for the second quarter. The company managed to make as much cash as the cocaine nose jobs of Wall Street expected, but missed revenue expectations.
In fact its revenues were below the psychologically important billion figure at $942 million.
We knew it was going to be bad. Last week we were warned that the results would be flat. The actual figure was $942m, an 8.5 per cent sequential decline and a 34.6 per cent drop from the same period a year ago.
As you might expect, there are some measures of this not being AMD’s fault. The company is almost entirely dependent on PC sales. Not only have these fallen but don’t look like they are going to pick up for a while.
AMD’s Computing and Graphics division reported revenue of $379m, which was down 54.2 per cent, year-on-year. Its operating loss was $147m, compared to a $6m operating loss for last year’s quarter.
Lisa Su, AMD president and CEO, in a statement said that strong sequential revenue growth in AMD’s enterprise, embedded, and semi-custom segment and channel business was not enough to offset near-term problems in its PC processor business. This was due to lower than expected consumer demand that impacted sales to OEMs, she said.
“We continue to execute our long-term strategy while we navigate the current market environment. Our focus is on developing leadership computing and graphics products capable of driving profitable share growth across our target markets,” she added.
In the semi-custom segment, AMD makes chips for video game consoles such as the Nintendo Wii U, Microsoft Xbox One, and Sony PlayStation 4 consoles. That segment did reasonably well, up 13 percent from the previous quarter but down 8 percent from a year ago.
But AMD’s core business of processors and graphics chips fell 29 percent from the previous quarter and 54 percent from a year ago. AMD said it had decreased sales to manufacturers of laptop computers.
Figures like this strap a large target on AMD’s back with a sign saying “take me over” but AMD is not predicting total doom yet.
For the third quarter, AMD expects revenue to increase 6 percent, plus or minus 3 percent, sequentially, which is a fairly conservative outlook given the fact that Windows 10 is expected to push a few sales its way.
AMD supplies chips to the Nintendo Wii U, Microsoft Xbox One, and Sony PlayStation 4 consoles and these seem to be going rather well.
Is The Chip Market On The Rebound
Don’t let anyone fool you, the chipmarket is still not doing that well and there are a few problems to be sorted out before real money will be made.
FC Tseng, vice chairman for foundry VIS said that handset makers have too much inventory in their warehouses and the much hyped IoT market boom has not yet arrived.
In fact it is looking like 2015 will not be as good as 2014, which was pretty good at least as far as VIS was concerned.
Semiconductor demand for IoT applications will emerge, but no one has really worked out what the key drivers of IoT market growth will be, Tseng said.
Smartphones, devices such as watches, bracelets and glasses are all being identified as the popular applications when it comes to wearables and the Internet of Things.
VIS forecast that the global 2015 semiconductor market will increase 5 per cent in production value to $358 bn, while the foundry sector will grow by a larger 10 per cent on year to about S$50 bn.
VIS chairman and president Leuh Fang warned that the company has seen a low visibility of customer orders for the third quarter of 2015.
VIS reported record revenues and profits for 2014 and has been spending on capital expenditure like a mad thing in 2015.
TSMC Moving To 16FF+ Soon
TSMC’s 16nm FinFET process has barely gotten off the ground, but the foundry is already talking about 16nm FinFET Plus, which is due to launch by the end of the year.
The improved 16nm FinFET Plus (16FF+) node is supposed to deliver more efficiency and performance, making TSMC’s node more competitive compared to Samsung’s 14nm node. That is the general idea, but TSMC’s first generation 16nm node has failed to impress in terms of design wins.
TSMC president CC Wei said the new 16FF+ node already has 20 tapeouts, ten of which achieved satisfactory yield performance. Wei said the company expects up to 50 tapeouts by the end of the year. TSMC expects 16FF+ to enter commercial production in the second half of the year.
16FF+ is not the only FinFET node coming from TSMC over the next year. The company plans to introduce 16FFC for compact devices sometime in the second half of 2016. In addition, 10nm FinFET is expected to enter risk production by the end of 2015, reports Digitimes.