However, Christopher Danely with Citigroup has bravely claimed that with its “Kaby Lake” family of processors, Intel remains a “step-function ahead of AMD Zen when Zen chips are released in Q416.”

He also doubts the benchmark stats that AMD presented to promote Zen’s capabilities relative to Intel’s microprocessors claiming that the AMD controlled benchmark compared an engineering sample of a Zen processor that has not been released yet against a three-month old Intel processor, with both chips clocked at 3.0 Ghz.

“We note the maximum speed for the Intel chip is 3.2 GHz. The result showed AMD completing the benchmark 2 per cent faster than Intel, implying higher CPU efficiency on a “clock for clock” basis. AMD kept both 8 core chips at the same clock speed of 3.0 Ghz, below the native clock speed of the Intel chip. The benchmark result showed the Zen Summit Ridge processor completing the Blender rendering benchmark in 48.07 seconds, 2 per cent ahead of Intel Broadwell-E chip’s time of 49.06 seconds. We note this is only one benchmark using a custom workload performed at an AMD event under controlled conditions, and therefore cannot be verified by third parties and does not represent expected results under all workloads, Danely said.

Instead he thinks that Chipzilla will benefit from its process technology lead while AMD’s manufacturing partner, Global Foundries, which has a “spotty track record.”

“After several of delays and eventually failing to develop 20nm and 14nm on its own, GlobalFoundries entered into a partnership agreement with Samsung in April 2014 to adopt Samsung’s 14nm FinFET process. Despite using the same tools, recipes, and materials as Samsung’s 14nm process, products built on GlobalFoundries’ 14nm did not appear until earlier this year, roughly a year after Samsung released its Exynos 7420 SoC built on its 14nm process,” Danely pointed out.

Since the partnership agreement with Samsung does not include 10nm or lower nodes, we think the technology gap between AMD and Intel will widen again once Intel migrates to 10nm next year.

Meanwhile Intel released its new Kaby Lake chips on an improved 14+nm process this month, featuring a 15 per cent performance improvement over its Skylake chips. Kaby Lake chips deliver up to 12 per cent faster productivity performance and 19 per cent faster web performance over comparable Skylake chips

“We expect independent benchmarks to show Intel’ performance is a step function ahead of AMD Zen when Zen chips are released in 4Q16,” he said.

Below you will find lots of rantings from Intel and AMD fanboys and we expect the language to be colourful. Those of a sensitive disposition might want to look away now.

Courtesy-Fud

Company co-CEO Mark Liu said that while the fourth quarter could be a bit rough as customers start their inventory adjustments, TSMC’s sales for the quarter will still outperform those for the third quarter.

Talking to Digitimes Lui said that smartphone demand was affected negatively by macroeconomic factors in the first half of 2016. But apparently smartphone chip clients are ordering again in the second half of the year.

TSMC previously estimated its 2016 revenues would grow 5-10 per cent. The foundry expects to meet the high end of the growth guidance, Liu said. In his speech at the CEO Forum of SEMICON Taiwan 2016. Liu claimed that the foundry industry growth is being driven by the markets for smartphones, HPC, automotive and IoT.

Apps like Pokemon G will require more silicon chips used in mobile devices that will be another growth driver in the future, Liu said.

Courtesy-Fud

Qualcomm offered $5.2 billion to $6 billion revenue guidance and it managed to make $6 billion. Non-GAAP diluted EPS was projected at $0.90 – $1.00 and Qualcomm actually managed to make $1.16.

The MSM chip shipments were guided at 175 million to 195 million while the company actually sold 201 million of these chips.

Total reported device sales was expected to be between $52 billion and  $60 billion and in reality Qualcomm scored $62.6 billion. Qualcomm shipped between 321 million to  325 million 3G/4G devices and estimated reported 3G/4G device average selling price was at $191 – $197.

There are a few reasons for such good results, the first being Samsung. The company chose Snapdragon 820 for some markets with its flagship phones. The Snapdragon 820 ended up in 115 devices and it looks like one of the strongest high end phone chips in a while.

The introduction of the Snapdragon 821 will rekindle the fire and will make some additional sales for Samsung Galaxy Note 7 and a few other high end phones including some phones from LG and others. The 4G modem business is in good shape but one has to be careful as Qualcomm might lose some of the iPhone business to Intel. Everyone wants carrier aggregation capable modems these days, that is Cat 6 and up and Qualcomm offers this from Snapdragon 430 to the Snapdragon 820.

It is interesting to notice that while Apple iPhone sales were down, Qualcomm did better mainly as when Apple declines at   the high end, Qualcomm can make money from its high end Snapdragon chips.

We expect to see the announcement of Snapdragon 830 before the end of the year while devices shipping with the new chip in late Q1 2017 or early Q2 2017. As far as we know this might be the 10nm SoC but we will have to wait and see.

Qualcomm is investing heavily in improvements of 4G, current and future generations as well as a concentrated focus on 5G. From where we stand, Qualcomm still has the best chances to dominate the 5G market, especially due to the fact that 5G is an evolution of 4G with some new wave length and concepts added to it.

Last year’s loss of Samsung Galaxy S6 design win hurt a lot, and now the big customer is back, it seems that investing in a custom ARM Kryo core and dominating in Adreno graphics paid off.

Courtesy-Fud

Digitimes’ deep throats claimed TSMC is expected to achieve certification on its 10nm process in the fourth quarter of 2016, and deliver product samples to the customer for validation in the first quarter of 2017.

This means that TSMC could begin small-volume production for Apple’s A11 chips as early as the second quarter of 2017 and building the chips will likely start to generate revenues at TSMC in the third quarter. The A11-series processor will power the iPhone models slated for launch in the second half of 2017.

TSMC is expected to get two-thirds of the overall A11 chip orders from Apple.

The company is officially refusing to comment on Digitimes’ story, but it does fit into what we have already been told about Jobs’ Mob’s plans for next year.

For TSMC, Q1 2016 was marked by a reduction of demand for high-end smartphones, while smartphone demand in China and emerging markets had upward momentum. Beginning Q2 2016 and onward, the company expect to get back onto a growth trajectory and is projected to hit a 5 to 10 percent growth rate in 2016.

“Our 10-nanometer technology development is on track,” said company president and co-CEO Mark Liu during the company’s Q4 2015 earnings call. “We are currently in intensive yield learning mode in our technology development. Our 256-megabit SRAM is yielding well. We expect to complete process and product qualification and begin customer product tape-outs this quarter.”

“Our 7-nanometer technology development progress is on schedule as well. TSMC’s 7 nanometer technology development leverage our 10-nanometer development very effectively. At the same time, TSMC’s 7-nanometer offers a substantial density improvement, performance improvement and power reduction from 10-nanometer.

These two technologies, 10-nanometer and 7-nanometer, will cover a very wide range of applications, including application processors for smartphone, high-end networking, advanced graphics, field-programmable gate arrays, game consoles, wearables and other consumer products.”

In Q1 2016, TSMC reached a gross margin of 44.9 percent, an operating margin of 34.6 percent and a net profit margin of 31.8 percent respectively. Going forward into Q2 2016, the company is expecting revenue between ~$6.65 billion and ~$6.74 billion USD, gross margins between 49 and 51 percent, and operating profit margins between 38.5 and 40.5 percent, respectively.

Chips used for communications and industrial uses represented over 80 percent of TSMC’s revenue in FY 2015. The company was also able to improve its margins by increasing 16-nanometer production, and like many other semiconductor companies, is preparing for an expected upswing sometime in 2017.

In February, a 6.4-magnitude earthquake struck southern Taiwan where TSMC’s 12-inch Fab 14 is located, a current site of 16-nanometer production. The company expected to have a manufacturing impact above 1 percent in the region with a slight reduction in wafer shipments for the quarter.

“Although the February 6 earthquake caused some delay in wafer shipments in the first quarter, we saw business upside resulting from demand increases in mid- and low-end smartphone segments and customer inventory restocking,” said Lora Ho, Senior Vice President and Chief Financial Officer of TSMC.

“We expect our business in the second quarter will benefit from continued inventory restocking and recovery of the delayed shipments from the earthquake.”

In fiscal year 2016, the company will spend between $9 and $10 billion on ramping up the 16-nanometer process node, constructing Fab 15 for 12-inch wafers in Nanjing, China, and beginning commercial production of the 10-nanometer FinFET process at this new facility. Samsung and Intel are also expected to start mass production of 10-nanometer products by the end of 2016.

During its Q4 2015 earnings call, company president and co-CEO Mark Liu stated the company is currently preparing and working on a 7-nanometer process node and plans to begin volume production sometime in 2018. Meanwhile, since January 2015, a separate research and development team at TSMC has been laying the groundwork for a 5-nanometer process which the company expects to bring into commercial production sometime in 1H 2020.

So far in Q1 2016, shipments of 16 and 20-nanometer wafers have accounted for around 23 percent of the company’s total wafer revenues.

Courtesy-Fud

It is starting to look sales teams for the pair are each trying to show that they can use the technology to reduce the most electricity consumption and production costs.

In its yearly result for 2015, TSMC made an announcement that it is planning to enter mass-production system of chips produced by 16-nano FinFET Compact (FFC) process sometime during 1st quarter of this year. TSMC had finished developing 16-nano FFC process at the end of last year. During the announcement TSMC talked up the fact that its 16-nano FFC process focuses on reducing production cost more than before and implementing low electricity.

TSMC is apparently ready for mass-production of 16-nano FFC process sometime during 1st half of this year and secured Huawei’s affiliate called HiSilicon as its first customer.

HiSilicon’s Kirin 950 that is used for Huawei’s premium Smartphone called Mate 8 is produced by TSMC’s 16-nano FF process. Its A9 Chip, which is used for Apple’s iPhone 6S series, is mass-produced using the 16-nano FinFET Plus (FF+) process that was announced in early 2015. By adding FFC process, TSMC now has three 16-nano processors in action.

Samsung is not far behind it has mass-produced Gen.2 14-nano FinFET using a process called LPP (Low Power Plus). This has 15 per cent lower electricity consumption compared to Gen.1 14-nano process called LPE (Low Power Early).

Samsung Electronics’ 14-nano LPP process was seen in the Exynos 8 OCTA series that is used for Galaxy S7 and Qualcomm’s Snapdragon 820. But Samsung Electronics is also preparing for Gen.3 14-nano FinFET process.

Vice-President Bae Young-chang of Samsung’s LSI Business Department’s Strategy Marketing Team said it will use a process similar to the Gen.2 14-nano process.

Both Samsung and TSMC might have a few problems. It is not clear what the yields of these processes are and this might increase the production costs.

Even if Samsung Electronics and TSMC finish developing 10-nano process at the end of this year and enter mass-production system next year, but they will also have to upgrade their current 14 and 16-nano processes to make them more economic.

Even if 10-nano process is commercialized, there still will be many fabless businesses that will use 14 and 16-nano processes because they are cheaper. While we might see a few flagship phones using the higher priced chips, it might be that we will not see 10nm in the majority of phones for years.

Courtesy-Fud

Legacy TCP/IP is seen as one of the slowing points for a lot of future IT – particularly 5G.  LTE was IP-based but it was hell on toast getting it to go and as networks get faster and more virtualised, the TCP/IP stack is failing to keep up.

At the moment Nokia and ARM are using 5G to drive other companies into looking at a
fully revamped TCP/IP stack, optimized for the massively varied use cases of the next mobile generation, for cloud services, and for virtualization and software-defined networking (SDN).

Dubbed the OpenFastPath (OFP) Foundation, founded by Nokia Networks, ARM and industrial IT services player Enea. The cunning plan is to create an open source TCP/IP stack which can accelerate the move towards SDN in carrier and enterprise networks.

AMD, Cavium, Freescale, HPE and the ARM-associated open source initiative, Linaro are all on board with it.

The cunning plan is to create open but secure network applications, which harness IP packet processing. Some want very high throughput, others ultra-low latency others want both and it is probably going to require a flexible standard to make it all go

The standard would support faster packet forwarding, via low IP latency combined with high capacity, and so reduce deployment and management costs by making networks more efficient.

This appears to be based around getting TCP/IP out of the kernel and using them for packet processing involves a number of operations (moving packets into memory, then to the kernel, then back out to the interface) which could be streamlined to reduce latency.

Courtesy-Fud

Apparently the fruity cargo cult Apple has already signed up to adopt the technology, which means that the rest of the world’s press will probably notice.

According to the Commercial Times TSMC will have 85,000-100,000 wafers fabricated with the foundry’s in-house developed InFo packaging technology in the second quarter of 2016.

TSMC has disclosed its InFO packaging technology will be ready for mass production in 2016. Company president and co-CEO CC Wei remarked at an October 15 investors meeting that TSMC has completed construction of a new facility in Longtan, northern Taiwan.

TSMC’s InFo technology will be ready for volume production in the second quarter of 2016, according to Wei.

TSMC president and co-CEO Mark Liu disclosed the company is working on the second generation of its InFO technology for several projects on 10nm and 7nm process nodes.

Source-http://www.thegurureview.net/computing-category/tsmc-goes-fan-out-wafers.html

Over the last few months both have been busy with new releases. Nvidia has its GeForce GTX 950 and GTX 980 Ti, while AMD put its first HBM-powered cards in the Radeon R9 Fury X, Fury and the super-small R9 Nano into the shops.

According to JPR, overall GPU shipments are up quarter-over-quarter – with AMD’s overall GPU shipments up 15.8 per cent. But before AMD fanboys get all excited by a surprise return to form from AMD, JPR said that that NVIDIA “had an exceptionally strong quarter”. Nvidia saw an uptick of 21.3 per cent.

The PC market as a whole increased by 7.5 per cent quarter-over-quarter but decreased 9 per cent year-over-year. Nivida’s discrete GPU shipments were up 26.3 per cent according to JPR, while AMD’s discrete GPUs spiked by 33 per cent.

AMD’s mobile GPU shipments for notebooks increased by 17 per cent, while NVIDIA had 14 per cent.

In an address on day two of Microsoft’s Future Decoded event in London, Kevin Ashton showed examples of supposed IoT devices such as the wine bottle that tells you if you’re drunk and the toothbrush that tells you if you’ve brushed your teeth.

Describing Kickstarter as “where bad ideas go to get funded”, he talked about the true nature of IoT and its roots in machine-to-machine communication that’s neither accessed nor processed by humans.

“This information isn’t going on a spreadsheet or a pivot table,” he explained. “It’s a sensor on a device in the world sending data to another device which makes a decision which feeds out into the world.”

In short: “We don’t collect data. Machines collect data from sensors and we turn the world into data.”

The perfect example of this is the mobile phone. “We call a phone a phone for legacy reasons,” he said. “A phone is just an app on your device. You probably use Candy Crush or Angry Birds more than you use it for actual calls. What a smartphone actually is, is a wireless sensor platform.”

He said that historically the UK has been at the forefront of internet developments, so it’s only right that the country takes a leading role in the evolution of the IoT.

Citing self-driving cars as a good example of the IoT at work, he predicted that by 2030 such vehicles will be the norm, and that the question should not be “Are self-driving cars safe?” but “Are human-driven cars safe?”, pointing out that 3,000 people are killed on the roads every day by human-driven cars, and so far at least, there have been no serious accidents involving autonomous vehicles.

Courtesy-http://www.thegurureview.net/computing-category/are-some-iot-gadgets-pointless.html