Is Qualcomm Facing Another Security Flaw?
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FireEye has found a vulnerability in Qualcomm software packages which are under the bonnet of hundreds of Android phone models.
Google announced this week that it released an Android update to patch shedloads of vulnerabilities, but the advisory mentioned an information disclosure vulnerability in the Qualcomm tethering controller (CVE-2016-2060) that allows a malicious application to access user information.
FireEye said that this vulnerablity is “high severity,” but Google noted that it does not affect Nexus devices. The patch for the issue is not in the Android Open Source Project (AOSP) repository but might make it in the latest driver updates for affected devices.
The security outfit said that researchers informed Qualcomm about the vulnerability in January and the vendor developed a fix by early March, when it started reaching out to OEMs to let them know about the issue. Now it’s up to the device manufacturers to push out the patch to customers. So probably a long time then.
The flaw exists in an open source software package maintained by Qualcomm and is related to the Android network daemon (netd).
“The vulnerability was introduced when Qualcomm provided new APIs as part of the ‘network_manager’ system service, and subsequently the ‘netd’ daemon, that allow additional tethering capabilities, possibly among other things,” FireEye said.
The flaw has been confirmed to affect devices running Android 5.0 Lollipop and earlier, which currently account for roughly three-quarters of Android devices. Researchers noted that the affected Qualcomm software package is used in a variety of projects, including the popular CyanogenMod, and the vulnerable APIs appear to have been around since at least 2011.
The vulnerability can be exploited to escalate privileges to the built-in “radio” user, which has permissions that are normally not available to a third-party app. The most efficient way to exploit CVE-2016-2060 is via a malicious application that is granted the “ACCESS_NETWORK_STATE” permission.
Courtesy-Fud
Qualcomm Has A Snapdragon CPU For Cars
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Qualcomm has told the assorted throngs at CES about a new Snapdragon 820 Automotive family of products. It will come in two flavors – a standard 820A and an 820Am that adds an LTE modem.
The chip is designed for in-car navigation and infotainment systems running QNX, Linux, and Android. It has wireless capabilities and can connected to your phone. The LTE version will link to the Internet.
They can manage multiple displays to run the screen in your dashboard and an infotainment screen in the back seat. It also offers support for high-resolution 4K displays for when some company inevitably decides to cram a high-res, high-density screen into one of its cars.
The 820A chips are close cousins ofthe the Snapdragon 820 SoCs that will start shipping in phones later this year and use Qualcomm’s custom-made 64-bit Kryo CPU cores, an Adreno 530 GPU, a Hexagon 680 DSP all cooked up with a 14nm manufacturing process. They will also use the Snapdragon X12 LTE which can manage 600Mbps down and 150Mbps up when the wind is behind it and it is going downhill. There are all the usual 802.11ac Wi-Fi, Bluetooth, and other features.
Qualcomm said that it used a “modular approach” in designing the chip, which means that the cars infotainment system can be upgraded with hardware and software updates, thereby enabling vehicles to be easily upgraded with the latest technology.
Car makers could theoretically swap out the chip or the entire package without needing to worry about software changes. Qualcomm specifically mentions upgrading LTE connectivity over the lifetime of the car to keep up with the capabilities of cellular networks.
Qualcomm says the 820A family will begin sampling in Q1 of 2016.
Courtesy-Fud
Is Qualcomm Dropping Kryo?
The Blog site Fudzilla has confirmed that the Kryo core might be the last custom developed CPU core from Qualcomm, at least for now.
The next generation SoC from Qualcomm, let’s call it Snapdragon 8×0, will use ARM Cortex cores. Our industry sources are confident that company’s leadership has put a great deal of pressure on Qualcomm QTI to reduce the cost of R&D and custom CPU core costs an arm and a leg. Using Cortex Cores is cheaper than developing a custom ARM based CPU such as Kyro.
Creating a custom ARM based CPU core is intensive too and Qualcom still has to build a Modem, GPU, DSP, camera ISP, Video processing unit as well connectivity inside of the SoC to provide the differentiating factor to the competition. It just appears that the Core itself probably does not need looking at.
But the move will hardly help Qualcomm compete in hostile and aggressive mobile SoC manufacturers’ competition.
Apple and Samsung have their own CPU cores. Huawei uses Cortex architecture but has its own SoCs for the 100 million phones it sold this year. These are businesses that are either very hard or impossible for Qualcomm QTI SoCs to get. Every Samsung SoC manufactured and sold in Samsung phones is one less for Qualcomm.
MediaTek might be the winner in this case, as MediaTek makes rather unique processors that are designed to compete well against those who use close-to-reference Cortex ARM solutions. MediaTek is the only deca core in three cluster architecture but we still have to see it in action before we pronounce anyone winner or loser.
Qualcomm will have to focus on its strengths of its late 2016 successor to Snapdragon 810. The strengths of Qualcomm lay in superior modem performance and a great Adreno GPU. However they will lose an advantage of a custom core that might bring a bigger difference from the competition.
This is certainly not something we expected but it is happening.
Source-http://www.thegurureview.net/computing-category/is-qualcomm-dropping-kryo.html
Applied Materials Makes A Profit
Chip-equipment maker Applied Materials has surprised most of the cocaine nose jobs of Wall Street with a better-than-expected third-quarter profit. It appears that contract manufacturers are spending more on technology used to make smartphone and memory chips.
The company also forecast current-quarter adjusted profit largely above analysts’ average estimate. Chief Executive Gary Dickerson said that demand for DRAM chips is expected to grow in the current quarter.
Applied Materials, which also provides equipment to make flat panel displays and solar cells, forecast an adjusted profit of 25-29 cents per share for the fourth quarter. Wall Street was expecting a profit of 26 cents per share.
Applied Materials expects revenue growth of about 10 to 17 percent, implying revenue of $2.19 billion to $2.33 billion for the quarter. Analysts on average were expecting $2.28 billion. Applied Materials’ net income rose to $301 millionin the third quarter ended July 27, from $168 milliona year earlier. Revenue rose 14.7 percent to $2.27 billion.
Revenue in the company’s silicon systems business, which brings in about two-thirds of total sales, rose 16 percent to $1.48 billion.
Do Chip Makers Have Cold Feet?
It is starting to look like chip makers are having cold feet about moving to the next technology for chipmaking. Fabricating chips on larger silicon wafers is the latest cycle in a transition, but according to the Wall Street Journal chipmakers are mothballing their plans.
Companies have to make massive upfront outlays for plants and equipment and they are refusing, because the latest change could boost the cost of a single high-volume factory to as much as $10 billion from around $4 billion. Some companies have been reining in their investments, raising fears the equipment needed to produce the new chips might be delayed for a year or more.
ASML, a maker of key machines used to define features on chips, recently said it had “paused” development of gear designed to work with the larger wafers. Intel said it has slowed some payments to the Netherlands-based company under a deal to help develop the technology.
Gary Dickerson, chief executive of Applied Materials said that the move to larger wafers “has definitely been pushed out from a timing standpoint”
Chip Makers Going After Cars
October 14, 2013 by admin
Filed under Around The Net
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Chip makers including Broadcom and Renesas Electronics are putting more focus on in-car entertainment with faster processors and networks for wireless HD movies and navigation, aiming to keep drivers informed and passengers entertained.
With PC sales slipping and the mobile device market proving highly competitive, chip makers are looking for greener pastures in other sectors like in-car entertainment and information.
From Renesas comes the R-Car M2 automotive SoC (System-on-a-Chip), which has enough power to handle simultaneous high-definition navigation, video and voice-controlled browsing.
The SoC is meant for use in mid-range systems. It features two ARM Cortex A-15 cores running at up to 1.5GHz and Renesas’ own SH-4A processor plus the PowerVR SGX544MP2 from Imagination Technologies for 3D graphics. This combination helps the M2 exceed the previous R-Car H1 with more than three times the CPU capacity and approximately six times better graphics performance.
Car makers that want to put a more advanced entertainment system in their upcoming models should go for the eight core R-Car H2 SoC, which was announced earlier this year. It is based on ARM’s big.LITTLE architecture, and uses four Cortex-A15 cores and another four Cortex-A7 cores.
The H2 will be able to handle four streams of 1080p video, including Blu-Ray at 60 frames per second, according to Renesas. Mass production is scheduled for the middle of next year, while the M2 won’t arrive in larger volumes until June 2015.
Broadcom on the other hand is seeking to drive better networking on the road. The company’s latest line of wireless chipsets for in-car connectivity uses the fast 802.11ac Wi-Fi wireless standard, which offers enough bandwidth for multiple displays and screen resolution of up to 1080p. Use of the 5GHz band for video allows it to coexist with Bluetooth hands-free calls on 2.4GHz, according Broadcom.
Broadcom has also implemented Wi-Fi Direct and Miracast. Wi-Fi Direct lets products such as smartphones, cameras and in this case in-car computers connect to one another without joining a traditional hotspot network, while Miracast lets users stream videos and share photos between smartphones, tablets and displays.
The BCM89335 Wi-Fi and Bluetooth Smart Ready combo chip and the BCM89071 Bluetooth and Bluetooth Smart Ready chip are now shipping in small volumes.