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AMD’s Quantum Has Intel Inside
AMD’s Project Quantum PC system, with graphics powered by two of the new Fiji GPUs may have got the pundits moist but it has been discovered that the beast has Intel inside
KitGuru confirmed that the powerful tiny system, as shown at AMD’s own event, was based upon an Asrock Z97E-ITX/ac motherboard with an Intel Core i7-4790K ‘Devil’s Canyon’ processor.
Now AMD has made a statement to explain why it chose to employ a CPU from one of its competitor in what is a flagship pioneering gaming PC.
It told Tom’s Hardware that users wanted the Devil’s Canyon chip in the Project Quantum machine.
Customers “want to pick and choose the balance of components that they want,” and the machine shown off at the E3 was considered to be the height of tech sexiness right now.
AMD said Quantum PCs will feature both AMD and Intel CPUs to address the entire market, but did you see that nice Radeon Fury… think about that right now.
IT is going to be ages before we see the first Project Quantum PCs will be released and the CPU options might change. We would have thought that AMD might want to put its FinFET process ZEN CPUs in Project Quantum with up to 16 cores and 32 threads. We will not see that until next year.
TSMC Moving To 16FF+ Soon
TSMC’s 16nm FinFET process has barely gotten off the ground, but the foundry is already talking about 16nm FinFET Plus, which is due to launch by the end of the year.
The improved 16nm FinFET Plus (16FF+) node is supposed to deliver more efficiency and performance, making TSMC’s node more competitive compared to Samsung’s 14nm node. That is the general idea, but TSMC’s first generation 16nm node has failed to impress in terms of design wins.
TSMC president CC Wei said the new 16FF+ node already has 20 tapeouts, ten of which achieved satisfactory yield performance. Wei said the company expects up to 50 tapeouts by the end of the year. TSMC expects 16FF+ to enter commercial production in the second half of the year.
16FF+ is not the only FinFET node coming from TSMC over the next year. The company plans to introduce 16FFC for compact devices sometime in the second half of 2016. In addition, 10nm FinFET is expected to enter risk production by the end of 2015, reports Digitimes.
Can TSMC Beat Samsung?
TSMC has said that it is confident that it can beat Samsung Electronics in ramping up production on its 10nm lines.
Samsung disclosed during a recent technology forum in the US that the company plans to enter mass production of chips using its 10nm FinFET process by the end of 2016,.
But in a statement TSMC claimed it could the outfit said the way things are shaping up it could beat that time table. TSMC continued that in the 10nm FinFET race, Intel will be its major competitor.
We expect to hear a bit more about TSMC’s plans at its Taiwan Technology Symposium 2015 on May 28. At the upcoming event, the foundry is expected to talk about the progress and development of its FinFET manufacturing nodes.
TSMC chairman Morris Chang remarked earlier in 2015 that TSMC expects to gain a majority of market share in the FinFET segment in 2016.
Intel is also expected to release its first chips made using 10nm process technology as early as in the middle of 2016.
Broadcom Aquired?
It is starting to look Broadcom will get bought out by its rival Avago as deep throats within both outfits think a deal is close.
Avago is in advanced buyout talks to acquire Broadcom, which manufacturers chips for both the smartphone and broadband industries. The two companies are more or less the same size, but at the moment Broadcom is the weaker partner
It has been the subject of previous speculation regarding acquisitions. The company is among the largest maker of chips for mobile systems such as smartphones, tablets and wearables, Internet of things (IoT) devices and automotive technology products.
Such capabilities could give Avago greater traction in fast-growing markets like IoT and mobile devices.
Broadcom announced last year that it was closing its baseband cellular chip business after being unable to gain inroads against such competitors as Qualcomm. The company had $8.4 billion in revenue last year.
It seems everyone wants a lot more consolidation in the chip industry. Intel reportedly resumed buyout talks to acquire Altera earlier this month, with the parties eyeing a potential price that could reach $13 billion. Micron was tipped as a potential buyer of rival SanDisk.
An April report cited a note from Bernstein analyst Mark Newman. According to this report, Newman pointed to SanDisk’s current valuation as making it a prime takeover target for rival NAND chip maker Micron, as well as other players in the market.
ARM Sets New mBed Standard
ARM has bought in a new assurance standard to work with embedded devices.
The ARM mbed Enabled program aims to increase the deployment rate of Internet of Things (IoT) products and supporting technologies by giving partners the ability to label them as interoperable mbed-based devices.
Arm said that the accreditation program will cover solutions entering a broad range of developer markets; from silicon and modules to OEM products and innovative cloud services. Accreditation will be free of charge.
ARM Zach Shelby, vice president of IoT business marketing, said that ARM mbed Enabled accreditation will assure the diverse IoT ecosystem that they are using technologies backed up by an expert community of innovators,.
“This will also instill confidence in end markets where interoperability, trust and security standardisation is required to unlock commercial potential.”
Since the ARM mbed IoT Device Platform was announced in October 2014, the mbed Partner ecosystem has continued to grow from the initial 24 launch partners. Today, 8 new partners are being announced including Advantech, Athos, Captiva, Espotel, Maxim Integrated, MegaChips, SmeshLink, and Tieto.
AMD To Power Samsung’s Digital Media
AMD’s Embedded R-Series accelerated processing unit, previously codenamed “Bald Eagle,” is powering Samsung’s latest set-back-box digital media players.
Bald Eagle was designed for high performance at low power with broad connectivity but mostly for digital signage.
It seems that new Samsung SBB-B64DV4 is intended for demanding signage applications that transform Samsung SMART Signage Displays into digital tools for a wide range of business needs.
The chipmaker claimed that by using its Embedded R-Series APUs, Samsung SBB media players for digital signage can manage HD graphics performance and support multivideo stream capabilities up to two displays, in a power efficient and ultra-compact form factor.
Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that digital signage is a key vertical for the AMD Embedded business.
“The AMD Embedded R-Series APU enables leading digital signage providers to harness high levels of compute and graphics performance within a low-power design envelope. AMD Embedded Solutions help designers at Samsung achieve aggressive form factor goals and drive down system costs while providing the rich multimedia their digital signage customers’ demand,” he said.
The AMD Embedded RX-425BB APU combines an x86 CPU with an integrated, discrete-class AMD Radeon R6 graphics processing unit in a low-power configuration to minimize heat dissipation constraints and meet energy efficiency requirements.
The processor uses AMD’s latest Graphics Core Next architecture, created for advanced graphics applications and parallel processing capabilities.
Can MediaTek Take On Qualcomm?
While Qualcomm’s 20nm Snapdragon 810 SoC might be the star of upcoming flagship smartphones, it appears that MediaTek has its own horse for the race, the octa-core MT6795.
Spotted by GforGames site, in a GeekBench test results and running inside an unknown smartphone, MediaTek’s MT6795 managed to score 886 points in the single-core test and 4536 points in the multi-core test. These results were enough to put it neck to neck with the mighty Qualcomm Snapdragon 810 SoC tested in the LG G Flex 2, which scored 1144 points in the single-core and 4345 in the multi-core test. While it did outrun the MT6795 in the single-core test, the multi-core test was clearly not kind on the Snapdragon 810.
The unknown device was running on Android Lollipop OS and packed 3GB of RAM, which might gave the MT6795 an edge over the LG G Flex 2.
MediaTek’s octa-core MT6795 was announced last year and while we are yet to see some of the first design wins, recent rumors suggested that it could be powering Meizu’s MX5, HTC’s Desire A55 and some other high-end smartphones. The MediaTek MT6795 is a 64-bit octa-core SoC clocked at up to 2.2GHz, with four Cortex-A57 cores and four Cortex-A53 cores. It packs PowerVR G6200 graphics, supports LPDDR3 memory and can handle 2K displays at up to 120Hz.
As we are just a few days from Mobile World Congress (MWC) 2015 which will kick off in Barcelona on March 2nd, we are quite sure that we will see more info as well as more benchmarks as a single benchmark running on an unknown smartphone might not be the best representation of performance, it does show that MediaTek certainly has a good chip and can compete with Qualcomm and Samsung.
Will AMD’s Kaveri Launch As Godavari?
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The new desktop refresh according to SweClockers is going to end up with A10-8850K branding. The new processor will get a 100MHz faster turbo clock and is based on the same 28nm manufacturing process. The base CPU clock for the A10-8850K is 3.7GHz, the same speed as the AMD A10-7850K, but the Turbo clock will jump to 4.1GHz with the new one. The A10-7850K has 4.0 GHz top turbo clock and 720 MHz GPU speed for its GCN Sea Island GPU.
The new A10-8850K will get the GPU to 856MHz. The memory speed supported stays at 2133MHz and the socket of choice remains FM2+. The TDP stays at 95W.
As you can see this is a small evolution and you can expect some cool parts for AMD on the desktop side in the latter part of 2016, some eighteen months from now, in 14nm.
AMD’s Carrizo Coming In The Second Quarter
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AMD released its earnings today and one cool question came up about the upcoming Carrizo mobile APU.
Lisa SU, the new AMD President and CEO, told MKM Partners analyst Ian Ing that Carrizo is coming in Q2 2015.
This is a great news and AMD’s Senior VP and outgoing general manager of computing and graphics group John Byrne already shared a few details about his excitement about Carrizo.
There are two Carrizo parts, one for big notebooks and All in Ones called Carrizo and a scaled down version called Carrizo L. We expect that the slower Carrizo-L is first to come but, Lisa was not specific. Carrizo-L is based on Puma+ CPU cores with AMD Radeon R-Series GCN graphics is intended for mainstream configurations with Carrizo targeting the higher performance notebooks.
Usually when a company says that something is coming in Q2 2015 that points to a Computex launch and this Taipei based tradeshow starts on June 2 2015. We strongly believe that the first Carrizo products will showcased at or around this date.
Lisa also pointed out that AMD has “significantly improved performance in battery life in Carrizo.” This is definitely good news, as this was one of the main issues with AMD APUs in the notebook space.
Lisa also said that AMD expects Carrizo to be beneficial for embedded and other businesses as well. If only it could have come a bit earlier, so let’s hope AMD can get enough significant design wins with Carrizo. AMD has a lot of work to do in order to get its products faster to market, to catch up with Intel on power and performance or simply to come up with innovative devices that will define its future. This is what we think Lisa is there for but in chip design, it simply takes time.
AMD’s Fiji GPU Goes High Bandwidth
New evidence coming from two LinkedIn profiles of AMD employees suggest that AMD’s upcoming Radeon R9 380X graphics card which is expected to be based on the Fiji GPU will actually use High-Bandwidth Memory.
Spotted by a member of 3D Center forums, the two LinkedIn profiles mention both the R9 380X by name as well as describe it as the world’s firts 300W 2.5D discrete GPU SoC using stacked die High-Bandwidth Memory and silicon interposer. While the source of the leak is quite strange, these are more reliable than just rumors.
The first in line is the profile of Ilana Shternshain, an ASIC Physical Design Engineer, which has been behind the Playstation 4 SoC, Radeon R9 290X and R9 380X, which is described as the “largest in ‘King of the hill’ line of products.”
The second LinkedIn profile is the one from AMD’s System Architect Manager, Linglan Zhang, which was involved in developing “the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.”
Earlier rumors suggest that AMD might launch the new graphics cards early this year as the company is under heavy pressure from Nvidia’s recently released, as well as the upcoming, Maxwell-based graphics cards.