Over the last few months both have been busy with new releases. Nvidia has its GeForce GTX 950 and GTX 980 Ti, while AMD put its first HBM-powered cards in the Radeon R9 Fury X, Fury and the super-small R9 Nano into the shops.

According to JPR, overall GPU shipments are up quarter-over-quarter – with AMD’s overall GPU shipments up 15.8 per cent. But before AMD fanboys get all excited by a surprise return to form from AMD, JPR said that that NVIDIA “had an exceptionally strong quarter”. Nvidia saw an uptick of 21.3 per cent.

The PC market as a whole increased by 7.5 per cent quarter-over-quarter but decreased 9 per cent year-over-year. Nivida’s discrete GPU shipments were up 26.3 per cent according to JPR, while AMD’s discrete GPUs spiked by 33 per cent.

AMD’s mobile GPU shipments for notebooks increased by 17 per cent, while NVIDIA had 14 per cent.

Designed for demanding embedded needs, the processors incorporate the newest AMD 64-bit x86 CPU core (“Excavator”), plus third-generation Graphics Core Next GPU architecture, and better power management for reduced energy consumption.

AMD tells us that combined, these chips provide industry-leading graphics performance and key embedded features for next-generation designs. The SOC architecture enables simplified, small form factor board and system designs from AMD customers and a number of third party development platform providers.

What AMD brings to the party is its graphics and multimedia performance, including capability for hardware-accelerated decode of 4K video playback and support for the latest DDR4 memory.
Jim McGregor, principal analyst, TIRIAS Research said that AMDs push into x86 embedded platforms is paying off with an increasing number of customers and applications.

“There is a need for immersive graphics, high-quality visualization, and parallel computing in an increasing number of embedded applications. Across these fronts, the AMD Embedded R-Series SOC is a very compelling solution.”

Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that his outfit’s AMD Embedded R-Series SOC is a strong match for these needs in a variety of industries including digital signage, retail signage, medical imaging, electronic gaming machines, media storage, and communications and networking.

“The platform offers a strong value proposition for this next generation of high-performance, low-power embedded designs.”

The new AMD Embedded R-Series SOCs offer 22 percent improved GPU performance when compared to the 2nd Generation AMD Embedded R-Series APU2 and a 58 percent advantage against the Intel Broadwell Core i7 when running graphics-intensive benchmarks.

AMD released some of the specs for its integrated AMD Radeon graphics including:

Up to eight compute units4 and two rendering blocks

GPU clock speeds up to 800MHz resulting in 819 GFLOPS

•DirectX 12 support

Fully HSA Enabled

The AMD Embedded R-Series SOC was architected with embedded customers in mind and includes features such as industrial temperature support, dual-channel DDR3 or DDR4 support with ECC (Error Correction Code), Secure Boot, and a broad range of processor options.

It has a configurable thermal design power (cTDP) allows designers to adjust the TDPs from 12W to 35W in 1W increments for greater flexibility.

The SOC also has a 35 percent reduced footprint when compared to the 2nd Generation AMD Embedded R-Series APU, making it an excellent choice for small form factor applications.

AMD said that the range is the first embedded processor with dual-channel 64-bit DDR4 or DDR3 with Error-Correction Code (ECC), with speeds up to DDR4-2400 and DDR3-2133, and support for 1.2V DDR4 and 1.5V/1.35V DDR3.

Its dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB) and initiates trusted boot environment before starting x86 cores
It has a high-performance Integrated FCH featuring PCIe Gen3 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, and UART

The AMD Embedded R-Series SOC provides industry-leading ten-year longevity of supply. The processors support Microsoft Windows 7, Windows Embedded 7 and 8 Standard, Windows 8.1, Windows 10, and AMD’s all-open Linux driver including Mentor Embedded Linux from Mentor Graphics and their Sourcery CodeBench IDE development tools.

It will be interesting to see if AMD can make up the ground it has lost on PCs and higher ticket items. Most of the company still appears to be in a holding pattern until Zen arrives.

Courtesy-http://www.thegurureview.net/computing-category/will-amds-newest-soc-save-the-company.html

The new Mali-470 GPU has half the power consumption and two times the energy efficiency of the Mali-400, and is designed for next-generation wearables and IoT devices such as industrial control panels and healthcare monitors that rely on low-cost and low-power chips.

The Mali-470 supports OpenGL ES 2.0, used by Android and Android Wear, hinting that the GPU could also find its way into low-cost smartphones. If not, ARM promises that the chip will bring smartphone-quality visuals to wearable and IoT devices, supporting screen resolutions of up to 640×640 on single-core devices, and higher resolutions for multi-core configurations.

ARM envisions the new GPU paired with its efficient Cortex-A7 or A53 CPU designs for a low-power SoC.

“ARM scrutinises every milliwatt across the entire SoC to enable OEMs to optimize energy efficiency and open up new opportunities,” said Mark Dickinson, vice president and general manager of ARM’s multimedia processing group.

“Tuning efficiency is particularly relevant for devices requiring sophisticated graphics on a low power budget such as wearables, entry-level smartphones and IoT devices. The Mali-470 has been designed to meet this demand by enabling a highly capable user interface while being extremely energy efficient.”

ARM expects the first SoCs using the GPU be ready by the end of 2016, meaning that the chip will start showing up in devices the following year.

The launch of the Mali-470 GPU comes just hours after ARM announced plans to pick up the product portfolio and other business assets of Carbon Design Systems, a supplier of cycle-accurate virtual prototyping solutions.

The deal will see Carbon’s staff transfer to ARM, where the chip firm will make use of the Massachusetts-based outfit’s expertise in virtual prototypes. This will enable ARM to iron out any bugs and make improvements to chips before they move to foundries for production.

ARM also said that Carbon will help the firm enhance its capability in SoC architectural exploration, system analysis and software bring-up.

Courtesy-TheInq

The outfit has been going through hell lately. Last month AMD ace CPU architect Jim Keller stepped away from the company after completing his work on Zen.

Rogers was one of AMD’s high-ranking technology and engineering corporate fellows, and been responsible for helping to develop the software ecosystem behind AMD’s heterogeneous computing products and the Heterogeneous System Architecture.

He was a public figure for AMD and active on the software development and evangelism side, frequently presenting the latest HSA tech and announcements for AMD at keynotes and conferences.

While he is not the only person working on the software side of HSA at AMD, Rogers’ role in its development is important. Rogers was a major contributor to the HSA Foundation, helping to initially found it in 2012. He served as the Foundation’s president until he left AMD.

It seems his defection was kept secret, and took place sometime this quarter and did not manage to leak.

According to his LinkedIn profile Phil Rogers is now Nvidia’s “Chief Software Architect – Compute Server” which is similar to what he was doing over at AMD. Nvidia is not a member of the HSA Foundation, but they are currently gearing up for the launch of the Pascal GPU family, which has some features that overlap well with Phil Rogers’ expertise.

Pascal’s NVLink CPU & GPU interconnect would allow tightly coupled heterogonous computing similar to what AMD has been working on. It makes a fair bit of sense for Nvidia to bring over a heterogeneous compute specialist makes a great deal of sense.

Rogers’ departure from AMD will have to be mentioned on the earnings call on the 15th. AMD’s Gregory Stoner will probably replace him. Stoner is AMD’s current Senior Director of Compute Solutions Technology and long-time Vice President of the HSA Foundation.

Source-http://www.thegurureview.net/computing-category/is-amd-losing-top-scientist-to-nvidia.html

The new parts showed up on the compatibility list of socket FM2+ motherboards by BIOSTAR and it is not clear when they will be in the shops.

The architecture mentioned is “Kaveri,” but the silicon could be “Godavari” which is a Kaveri refresh.

The top of the range will be the A10-7890K, which has CPU clock speeds of 4.10 GHz out of the box. We do not know what the TurboCore frequency will be, but the current A10-7870K offers 3.90 GHz with 4.10 GHz TurboCore. The A8-7690K has a CPU clocks of 3.70 GHz. We are not sure what the iGPU clock speeds of the two chips.

The Athlon X4 880K is the most interesting. It has 4.00 GHz CPU clocks. The Athlon X4 FM2+ series lack integrated graphics that means that they are good for those who will buy discrete GPUs, on the FM2+ platform.

All three chips offer unlocked base-clock multipliers, enabling CPU overclocking.

Source-http://www.thegurureview.net/computing-category/amd-increases-fm2-lineup.html

The cunning plan is to install electric generating equipment at its factories or even building its own power plant.

Apparently, the company’s electricity bill will go up by 50 per cent over the next ten years as it moves to more-advanced technologies.

Taiwan is already facing power shortage problems and TSMC is worried that its plans could be stuffed up.

TSMC has asked Taiwan’s Ministry of Economic Affairs (MOEA) and government-owned Taiwan Power Company (Taipower) about the feasibility of building its own power generators and related regulatory matters.

According to Digitimes companies can set up power generating equipment for use at their own factory sites, but the law has to be revised to allow TSMC to build its own power plant.

TSMC previously pointed out that it does not necessarily need nuclear power unless there is an alternative. We really hope that quote does not mean that TSMC is considering going nuclear.

Source-http://www.thegurureview.net/computing-category/is-electricity-in-tsmcs-future.html

According to TweakTown Nvidia is apparently dotting the “I” and working out where to put in the semi-colons for its Pascal GPU using TSMC’s 16nm FinFet node. AMD rumored has been wining and dining its old chums at GlobalFoundries to use its 14nm process for its Greenland GPU.

Although these sound like different technologies the “14nm and 16nm”  is difference how you measure a transistor. The outcome of both 14 and 16 should be a fairly same sized transistor with similar power features. TSMC calls its process 16nm FinFet, while Samsung and GloFo insist on calling it 14nm FinFet.

The dark satanic rumor mill suggests that the Greenland GPU, which has new Arctic Islands family micro-architecture, will have HBM2 memory. There will be up to 32GB of memory available for enthusiast and professional users. Consumer-oriented cards will have eight to 16GB of HBM2 memory. It will also have a new ISA (instruction set architecture).

It makes sense, AMD moved to HBM with its Fury line this year. Nvidia is expected to follow suit in 2016 with cards offering up to 32GB HBM2 as well.

Both Nvidia and AMD are drawn to FinFET which offers 90 percent more density than 28nm. Both will boost the transistors on offer with their next-generation GPUs, with 17 to 18 billion transistors currently being rumored.

Source- http://www.thegurureview.net/computing-category/are-both-amd-and-nvidia-readying-to-release-a-14nm-gpu.html