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TSMC And Imagination Team Up
TSMC and Imagination Technologies announced the next step in their tech collaboration in an effort to develop Imagination’s next generation PowerVR 6-series GPUs.
The new GPUs are still not ready for prime time, but they should be used in future SoC designs, including those stamped out using TSMC’s 16nm FinFET process. The two companies will work to create new reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology.
As GPU muscle becomes more important for next generation SoCs, designers need more advanced and more complex processes, such as TSMC’s 16FinFET.
“Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products,” said Hossein Yassaie, CEO of Imagination.
TSMC VP Cliff Hou argued that the need for high performance mobile GPUs will drive silicon processes in the future, much in the same way CPU development pushed new processes in the nineties.
Samsung Goes Star-ups
Samsung will put $1.1 billion towards venture capital funding of semiconductor firms.
The company said that it will commit the research and development funding through its Samsung Venture Americas branch and Catalyst Fund investment operations, according to multiple reports.
The investment is set to target semiconductor design and manufacturing. The company will look to fund startups that can assist its hardware units and will open a new R&D facility in Silicon Valley.
The announcement comes as Samsung is seeing its revenues hit record levels. The company reported quarterly profits of 7.5 billion to close out 2012 and sales from Samsung’s handset unit reached record levels.
Analysts believe that the company now controls nearly 23 percent of the smartphone market. The jump in hardware sales has brought with it a healthy appetite for components. Earlier this month Samsung passed Apple to become the world’s largest single user of semiconductor chips.
Samsung has recently stepped up its investment activities, with the firm buying storage vendor Nvelo and last week buying a small stake in Wacom, best known for its touchpad and stylus input technology. With the firm looking to invest in startups, it is perhaps looking to follow in Apple’s footsteps, which kickstarted its chip design efforts by buying PA Semiconductor and later Intrinsity, and invested in Imagination Technologies.
TSMC 20nm Processors In High Demand
TSMC believes demand for next-generation 20nm chips will be even higher than demand for current 28nm products.
Speaking in a conference call, TSMC CEO Morris Chang said the volume of 20nm SoCs built next year will be greater than 28nm volume in 2012 and by 2015 it should be greater than 28nm volume in 2013.
TSMC hopes to start 20nm production in the latter part of the year. The company is constructing two new facilities at Fab 15 and it hopes to start 20nm production in both simultaneously. We could be in for a quick ramp.
TSMC will offer only one version of the 20nm process, compared to four versions of the 28nm process. This should also allow it to ramp up volume production faster, reckons Xbit Labs.
TSMC To Boost 28nm Production
TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.
TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.
But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.
TSMC Makes Expansion Plans
TSMC is expected to spend $10 billion next year in capital works as Apple plans to contract the outfit to build its next-generation processors.
According to the Chinese-language Economic Daily News TSMC has informed the equipment suppliers of its decision to hike capital expenditure for 2013 to US$10 billion. This indicates that TSMC has overcome technical problem with 20nm process, which Apple’s next-generation processors are said to use.
It also suggests that Jobs’ Mob is speeding up its reduction of work it gives Samsung. Apple has reportedly sent around 200 design engineers to help TSMC get familiar with the company’s next-generation processor designs at TSMC’s facility in Central Taiwan Science Park.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”