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Is Samsung Readying A 10nm SoC?
Of course, it is that time of the year. Apple, Qualcomm, MediaTek and now Samsung will have 10nm SoCs ready for phones in early 2017. Of course Samsung wants to use its own 10nm SoC in the Galaxy S8 that is expected in late February 2017, but probably with a mix of 10nm Snapdragon too.
Samsung’s next generation Exynos’ name is very uninspired. You don’t call your much better chip just the Exynos 8895, but that might not be the final name.
The Korean giant went from Exynos 7420 for Galaxy S5 and first 14nm for Android followed a year after with Exynos 8890 still 14nm but witha custom Exynos M1 “Mongoose” plus Cortex-A53eight core combination.
The new SoC is rumored to come with a 4GHz clock. The same leak suggests that the Snapdragon 830 can reach 3.6 GHz which would be quite an increase from the 2.15Ghz that the company gets with the Snapdragon 820. Samsung’s Exynos 8890 stops at 2.6GHz with one or two cores running while it drops to 2.3 GHz when three of four cores from the main cluster run. Calls us sceptics for this 4GHz number as it sounds like quite a leap from the previous generation.
Let us remind ourselves that the clock speed is quite irrelevant as it doesn’t mean anything, and is almost as irrelevant as an Antutu score. It tells you the maximal clock of a SoC but you really want to know the performance per watt or how much TFlops you can expect in the best case. A clock speed without knowing the architecture is insufficient to make any analysis. We’ve seen in the past that 4GHz processors were slower than 2.5GHz processors.
The fact that Samsung continued to use Snapdragon 820 for its latest greatest Galaxy Note 7 means that the company still needs Qualcomm and we don’t think this is going to change anytime soon. Qualcomm traditionally has a better quality modem tailored well for USA, China, Japan and even the complex Europe or the rest of the world.
Courtesy-Fud
ARM Shows Off 10nm Chip
ARM’s collaboration with TSMC has finally born some fruit with the tapeout of a 10nm test chip to show off the company’s readiness for the new manufacturing process.
The new test chip contains ARM’s yet-to-be-announced “Artemis” CPU core which is named after a goddess who will turn you into deer and tear you apart with wild dogs if you ever see her. [The NDA must have been pretty tough on this chip.ed]
In fact things have been ticking along on this project for ages. ARM discloses that tapeout actually took place back in December last year and is expecting silicon to come back from the foundry in the following weeks.
ARM actually implemented a full four-core Artemis cluster on the test chip which should show vendors what is possible for their production designs. The test chip has a current generation Mali GPU implementation with 1 shader core to show vendors what they will get when they use ARM’s POP IP in conjunction with its GPU IP. There is also a range of other IP blocks and I/O interfaces that are used to validation of the new manufacturing process.
TSMC’s 10FF manufacturing process is supposed to increase density with scaling’s of up to 2.1x compared to the previous 16nm manufacturing node. It also brings about 11-12 per cent higher performance at each process’ respective nominal voltage, or a 30 per cent reduction in power.
ARM siad that comparing a current Cortex A72 design on 16FF+ and an Artemis core on 10FF on the new CPU and process can halve the dynamic power consumption. Currently clock frequencies on the new design are still behind the older more mature process and IP, but ARM expects this to improve as it optimizes its POP and the process stabilizes.
Courtesy-Fud
iPhone SE Goes With Qualcomm Inside
April 8, 2016 by admin
Filed under Consumer Electronics
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Contrary to our previous reports we got a tip that iPhone SE will continue using Qualcomm modems and not change to Intel.
The tear downs will start happening soon but our sources very close to the matter said with high certainly that all iPhone SE come with an updated Qualcomm modem.
Intel is still in the run but apparently Apple still felt confident to continue using Qualcomm even for this generation of the phone. A few analysts did suggested that iPhone 7 and beyond might get Intel LTE hardware, but not with iPhone SE.
Back in December, when we originally wrote that Intel got the iPhone SE deal, our sources did suggest that Apple can still change its mind if it doesn’t feel that Intel modem is ready. This might be the case, but in the future, we are quite confident that Apple will get a second LTE supplier at some point, just as it did with different manufacturing fabs.
Having two suppliers will drive the cost down, and for Apple every dollar or cent they save of components means millions more in its pocket. Apple claims “LTE up to 50 percent faster than iPhone 5s,” but it doesn’t give a real number. The iPhone 5S uses MDM9615 that was first introduced in 2011. This modem is at the technology range of Cat 4, X5 modem that Qualcomm ships in its entry level SoCs or as an external component.
We will have to wait for the first teardowns to appear as it is not easy to get to “ LTE up to 50 percent faster than iPhone 5s.” You would need a modem that is capable of 225 Mbps and the next of potential candidates for the iPhone SE is the MDM 20nm 9×35. Qualcomm calls this modem X7 these days, it use to call it Gobi back in late 2014 and this is a Cat 6, 300 Mbit per second download and 50 Mbit per second upload capable chip.
The fact that Apple continues the exclusive deal with Qualcomm is bad news for Intel, but we are sure that the team blue will keep working on getting inside of iPhone.
Courtesy-Fud
China Using Home Servers Admidst Cyber Concerns
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A Chinese firm has developed the country’s first homegrown servers, built entirely out of domestic technologies including a processor from local chip maker Loongson Technology.
China’s Dawning Information Industry, also known as Sugon, has developed a series of four servers using the Loongson 3B processor, the country’s state-run Xinhua News Agency reported Thursday.
“Servers are crucial applications in a country’s politics, economy, and information security. We must fully master all these technologies,” Dawning’s vice president Sha Chaoqun was quoted as saying.
The servers, including their operating systems, have all been developed from Chinese technology. The Loongson 3B processor inside them has eight cores made with a total of 1.1 billion transistors built using a 28-nanometer production process.
The Xinhua report quoted Li Guojie, a top computing researcher in the country, as saying the new servers would ensure that the security around China’s military, financial and energy sectors would no longer be in foreign control.
Dawning was contacted on Friday, but an employee declined to offer more specifics about the servers. “We don’t want to promote this product in the U.S. media,” she said. “It involves propriety intellectual property rights, and Chinese government organizations.”
News of the servers has just been among the ongoing developments in China for the country to build up its own homegrown technology. Work is being done on local mobile operating systems, supercomputing, and in chip making, with much of it government-backed. Earlier this year, China outlined a plan to make the country into a major player in the semiconductor space.
But it also comes at a time when cybersecurity has become a major concern for the Chinese government, following revelations about the U.S. government’s own secret surveillance programs. “Without cybersecurity there is no national security,” declared China’s Xi Jinping in March, as he announced plans to turn the country into an “Internet power.”
Two months later, China threatened to block companiesfrom selling IT products to the country if they failed to pass a new vetting system meant to comb out secret spying programs.
Dawning, which was founded using local government-supported research, is perhaps best known for developing some of China’s supercomputers. But it also sells server products built with Intel chips. In this year’s first quarter, it had an 8.7 percent share of China’s server market, putting it in 7th place, according to research firm IDC.
TSMC’s FinFet Coming In 2015?
TSMC has announced that it will begin volume production of 16nm FinFET products in the second half of 2015, in late Q2 or early Q3.
For consumers, this means products based on TSMC 16nm FinFET silicon should appear in late 2015 and early 2016. The first TSMC 16nm FinFET product was announced a few weeks ago.
TSMC executive CC Wei said sales of 16nm FinFET products should account for 7-9% of the foundry’s total revenue in Q4 2015. The company already has more than 60 clients lined up for the new process and it expects 16nm FinFET to be its fastest growing process ever.
Although TSMC is not talking about the actual clients, we already know the roster looks like the who’s who of tech, with Qualcomm, AMD, Nvidia and Apple on board.
This also means the 20nm node will have a limited shelf life. The first 20nm products are rolling out as we speak, but the transition is slow and if TSMC sticks to its schedule, 20nm will be its top node for roughly a year, giving it much less time on top than earlier 28nm and 40nm nodes.
The road to 10nm
TSMC’s 16nm FinFET, or 16FinFET, is just part of the story. The company hopes to tape out the first 10nm products in 2015, but there is no clear timeframe yet.
Volume production of 10nm products is slated for 2016, most likely late 2016. As transitions speed up, TSMC capex will go up. The company expects to invest more than $10bn in 2015, up from $9.6bn this year.
TSMC expects global smartphone shipments to reach 1.5bn units next year, up 19 percent year-on-year. Needless to say, TSMC silicon will power the majority of them.
Qualcomm Acquires Patents From HP
Chip making giant Qualcomm Inc has purchased a patent portfolio from Hewlett-Packard Co, including those of Palm Inc and its iPaq smartphone, in a move that will bulk up HP’s offerings to handset makers and other licensees.
The portfolio comprises about 1,400 granted patents and pending patent applications from the United States and about 1,000 granted patents and pending patent applications from other countries, including China, England, Germany, Japan and South Korea.
The San Diego-based chipmaker did not say how much it paid for the patents.
The majority of Qualcomm’s profits come from licensing patents for its ubiquitous CDMA cellphone technology and other technology related to mobile devices. Instead of licensing patents individually, handset vendors, carriers and other licensees pay royalties to Qualcomm in return for access to a broad portfolio of intellectual property.
The patents bought from HP, announced in a release on Thursday, cover technologies that include fundamental mobile operating system techniques.
They include those that HP acquired when it bought Palm Inc, an early player in mobile devices, in 2010 and Bitfone in 2006. HP tablets made using Palm’s webOS operating system failed to catch on.
“There’s nothing left at Palm that HP could get any use out of so it’s better to sell the patents, which are always valuable to Qualcomm,” said Ed Snyder, an analyst with Charter Equity Research. “They have to keep that bucket full.”
The new patents will not lead to increased royalty rates for existing Qualcomm licensees, a Qualcomm spokeswoman said.
Last year, HP sold webOS, which it received as part of the $1.2 billion Palm acquisition, to South Korea’s LG Electronics Inc.
WD And Sandisk Join Forces
Western Digital and Sandisk have teamed up to create Western Digital’s first hybrid storage device that uses Sandisk’s iSSD and Western Digital’s Caviar Black hard drive.
Western Digital, which has dabbled in solid state disks (SSDs) for the enterprise market, has stayed away from hybrid drives that use relatively small SSDs to act as cache for hard drives. Now the firm has teamed with Sandisk to create its WD Black Solid State Hybrid drives with 500GB capacity.
Western Digital is pitching its hybrid drives at laptop makers, offering units with 5mm, 7mm and 9.5mm heights. The firm said Sandisk’s iSSD uses 19nm NAND flash and claimed it is the world’s “smallest and most advanced semiconductor manufacturing process”, a claim that Intel might question.
Kevin Conley, SVP and GM of client storage solutions at Sandisk said, “By combining SanDisk’s unparalleled flash memory expertise and technology with the hard drive know-how of Western Digital, WD Black SSHDs [solid state hard drives] offer outstanding hard drive-like capacity, and the slim form factor and the level of performance that you will only get with flash memory solutions.”
Seagate was first to introduce hybrid drives with its Momentus XT range, which offers an impressive performance boost over mechanical hard drives for certain workloads. The problem for Western Digital and Seagate is that hybrid drives are merely a stop-gap rather than a long term strategy, with SSD prices falling rapidly due to competition in the SSD industry as opposed to the hard drive industry, where Seagate, Western Digital and Toshiba have a comfortable ride.
TSMC Testing ARM’s Cortex A57
ARM and TSMC have manufactured the first Cortex A57 processor based on ARM’s next-gen 64-bit ARMv8 architecture.
The all new chip was fabricated on TSMC’s equally new FinFET 16nm process. The 57 is ARM’s fastest chip to date and it will go after high end tablets, and eventually it will find its place in some PCs and servers as well.
Furthermore the A57 can be coupled with frugal Cortex A53 cores in a big.LITTLE configuration. This should allow it to deliver relatively low power consumption, which is a must for tablets and smartphones. However, bear in mind that A15 cores are only now showing up in consumer products, so it might be a while before we see any devices based on the A57.
In terms of performance, ARM claims the A57 can deliver a “full laptop experience,” even when used in a smartphone connected to a screen, keyboard and mouse wirelessly. It is said to be more power efficient than the A15 and browser performance should be doubled on the A57.
It is still unclear when we’ll get to see the first A57 devices, but it seems highly unlikely that any of them will show up this year. Our best bet is mid-2014, and we are incorrigible optimists. The next big step in ARM evolution will be 20nm A15 cores with next-generation graphics, and they sound pretty exciting as well.
TSMC And Imagination Team Up
TSMC and Imagination Technologies announced the next step in their tech collaboration in an effort to develop Imagination’s next generation PowerVR 6-series GPUs.
The new GPUs are still not ready for prime time, but they should be used in future SoC designs, including those stamped out using TSMC’s 16nm FinFET process. The two companies will work to create new reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology.
As GPU muscle becomes more important for next generation SoCs, designers need more advanced and more complex processes, such as TSMC’s 16FinFET.
“Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products,” said Hossein Yassaie, CEO of Imagination.
TSMC VP Cliff Hou argued that the need for high performance mobile GPUs will drive silicon processes in the future, much in the same way CPU development pushed new processes in the nineties.
Is Non-Volatile Memory The Next Craze?
A report from analysts Yole Developpement claims that MRAM/STTMRAM and PCM will lead the Emerging Non-Volatile Memory (ENVM) market and earn a combined $1.6bn by 2018. If the North Koreans have not conquered America, by 2018 then MRAM/STTMRAM and PCM will surely be the top two ENVM on the market.
Yole’s Yann de Charentenay said that their combined sales will almost double each year, with double-density chips launched every two years. So far we have only had FRAM, PCM and MRAM to play with and they were available in low-density chips to only a few players. The market was quite limited and considerably smaller than the DRAM and flash markets which had combined revenues of $50bn+ in 2012, the report said. In the next five years the scalability and chip density of those memories will be greatly improved and will spark many new applications, says the report.
ENVM will greatly improve the input/output performance of enterprise storage systems whose requirements will intensify with the growing need for web-based data supported by cloud servers, the report said. Mobile phones will increase its adoption of PCM as a substitute to flash NOR memory in MCP packages thanks to 1GB chips made available by Micron in 2012, it added. The next milestone will be the higher-density chips, expected in 2015, will allow access to smart phone applications that are quickly replacing entry-level phones.