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Samsung Goes Star-ups
Samsung will put $1.1 billion towards venture capital funding of semiconductor firms.
The company said that it will commit the research and development funding through its Samsung Venture Americas branch and Catalyst Fund investment operations, according to multiple reports.
The investment is set to target semiconductor design and manufacturing. The company will look to fund startups that can assist its hardware units and will open a new R&D facility in Silicon Valley.
The announcement comes as Samsung is seeing its revenues hit record levels. The company reported quarterly profits of 7.5 billion to close out 2012 and sales from Samsung’s handset unit reached record levels.
Analysts believe that the company now controls nearly 23 percent of the smartphone market. The jump in hardware sales has brought with it a healthy appetite for components. Earlier this month Samsung passed Apple to become the world’s largest single user of semiconductor chips.
Samsung has recently stepped up its investment activities, with the firm buying storage vendor Nvelo and last week buying a small stake in Wacom, best known for its touchpad and stylus input technology. With the firm looking to invest in startups, it is perhaps looking to follow in Apple’s footsteps, which kickstarted its chip design efforts by buying PA Semiconductor and later Intrinsity, and invested in Imagination Technologies.
TSMC 20nm Processors In High Demand
TSMC believes demand for next-generation 20nm chips will be even higher than demand for current 28nm products.
Speaking in a conference call, TSMC CEO Morris Chang said the volume of 20nm SoCs built next year will be greater than 28nm volume in 2012 and by 2015 it should be greater than 28nm volume in 2013.
TSMC hopes to start 20nm production in the latter part of the year. The company is constructing two new facilities at Fab 15 and it hopes to start 20nm production in both simultaneously. We could be in for a quick ramp.
TSMC will offer only one version of the 20nm process, compared to four versions of the 28nm process. This should also allow it to ramp up volume production faster, reckons Xbit Labs.
TSMC To Boost 28nm Production
TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.
TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.
But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.
TSMC Makes Expansion Plans
TSMC is expected to spend $10 billion next year in capital works as Apple plans to contract the outfit to build its next-generation processors.
According to the Chinese-language Economic Daily News TSMC has informed the equipment suppliers of its decision to hike capital expenditure for 2013 to US$10 billion. This indicates that TSMC has overcome technical problem with 20nm process, which Apple’s next-generation processors are said to use.
It also suggests that Jobs’ Mob is speeding up its reduction of work it gives Samsung. Apple has reportedly sent around 200 design engineers to help TSMC get familiar with the company’s next-generation processor designs at TSMC’s facility in Central Taiwan Science Park.
Intel Preparing New SSDs
In addition to the recent price drop for its 320, 330 and 520 series SSDs, Intel is preparing a slight refresh scheduled to launch in Q3 and Q4 2012, according to the recently leaked roadmap at Chinese.VR-Zone.com.
The roadmap kicks off with a rather interesting entry-level 300 series that will apparently get a new 335 series update in Q3 2012. According to the roadmap, the 335 series will initially launch in 240GB capacity and get 80 and 180GB model update in Q1 2013. The new 335 series will most likely still be based on the same SF-2281 controller, be available in 2.5-inch form factor with the SATA 6Gbps interface, and will probably be paired up with a tweaked firmware and a new 20nm NAND flash memory.
Super Talent Outs New SSDs
Super Talent has announced a new line of SATA III SSDs, the Super Talent SuperNova. Aimed at the business market, SuperNova SSDs will be available in 128 and 256GB capcities.
Although it has not announced any details regarding the new SuperNova lineup in its official press release, Super Talent did note that SuperNova features high transfer speeds and “the most secure encryption” on the planet, as well as the proprietary RAISE technology that virtually eliminates unrecoverable read errors.
After some digging around we managed to find that SuperNova is based on Sandforce SF-2200 controller paired up with ONFI Synchronous MLC NAND chips that should provide enterprise level of reliability. The sequential performance is set at 555MB/s read and 525MB/s for write while random 4K performance is at 90K IOPS read and 85K IOPS write, for both 128 and 256GB models.
Adata Outs 40MB/s UHS microSD Card
Adata has launched a 32GB UHS-1 microSD card offering 40MB/s write bandwidth.
Adata, which recently has been making a big push in the solid-state disk (SSD) drive market, has announced its first microSD cards that support the UHS-1 specification. The firm’s Premier Pro cards come in 8GB, 16GB and 32GB capacities with the firm citing read bandwidth of 45MB/s and all important write bandwidth of 40MB/s.
The SD Card Association defined the UHS-I specification as part of its SD Version 3.01 standard, and while Adata’s new cards boast impressive speeds there is a lot of headroom left, with UHS-1 supporting bandwidths up to 104MB/s. Adata’s cards, roughly translated to the ‘X’ speed rating used on a number of memory cards, come out at 266X.
Ray Chu, product manager at Adata said, “These cards have the best read and write performance among all comparable products offered by the industry’s key players. When that is combined with the aggressive pricing options in store for this line, the result is going to be a bonanza for our customers worldwide.”
TI Chip Goes 1080p On Android Devices
Texas Instruments on Tuesday said its OMAP chip had been certified to unlock full 1080p movies from Netflix for Google’s Android 2.3 based devices, which includes smartphones and tablets.
TI’s on-chip security feature, called M-Shield, will be able to decode 1080p high-definition movie streaming from Netflix, stated Fred Cohen, director of the OMAP user experience team at TI. A security layer unlocks the encoded video, which can then be viewed on smartphones and tablets or TV sets connected through an HDMI (high-definition multimedia interface) port.
The purpose of having this technology is to provide end-to-end security for protected video content, Cohen said. Movie studios are making more high-definition 1080p content available and are adamant about protecting their product, which are considered premium content.
The on-chip feature minimizes the ability to copy content, as it is easy to take control of a rooted Android device, Cohen said. It’s easy for users to access memory where the stream is temporarily stored, and then write the movie to another device.
“You have to protect those devices,” Cohen said. “We have implemented a firewall.”
TI’s security technology is to provide a security layer so devices get access to high-definition movies, Cohen said.
Netflix provides different levels of security certification depending on features such as the video quality and resolution, Cohen said. Netflix did not return a request for comment on whether it was streaming 1080p video content to mobile devices, or whether chip makers required certification to unlock secure 1080p content.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”