nVidia Goes For Raspberry Pi

nVidia has unveiled what it claims is “the world’s first mobile supercomputer”, a development kit powered by a Tegra K1 chip.

Dubbed the Jetson TK1, the kit is built for embedded systems to aid the development of computers attempting to simulate human recognition of physical objects, such as robots and self-driving cars.

Speaking at the GPU Technology Conference (GTC) on Tuesday, Nvidia co-founder and CEO Jen Hsun Huang described it as “the world’s tiniest little supercomputer”, noting that it’s capable of running anything the Geforce GTX Titan Z graphics card can run, but at a slower pace.

With a total performance of 326 GFLOPS, the Jetson TK1 should be more powerful than the Raspberry Pi board, which delivers just 24 GFLOPS, but will retail for much more, costing $192 in the US – a number that matches the number of cores in the Tegra K1 processor that Nvidia launched at CES in Las Vegas in January.

Described by the company as a “super chip” that can bridge the gap between mobile computing and supercomputing, the Nvidia Tegra K1, which replaces the Tegra 4, is based on the firm’s Kepler GPU architecture.

The firm boasted at CES that the chip will be capable of bringing next-generation PC gaming to mobile devices, and Nvidia claimed that it will be able to match the PS4 and Xbox One consoles’ graphics performance.

Designed from the ground up for CUDA, which now has more than 100,000 developers, the Jetson TK1 Developer Kit includes the programming tools required by software developers to develop and deploy compute-intensive systems quickly, Nvidia claimed.

“The Jetson TK1 also comes with this new SDK called Vision Works. Stacked onto CUDA, it comes with a whole bunch of primitives whether it’s recognising corners or detecting edges, or it could be classifying objects. Parameters are loaded into this Vision Works primitives system and all of a sudden it recognises objects,” Huang said.

“On top of it, there’s simple pipe lines we’ve created for you in sample code so that it helps you get started on what a structure for motion algorithm, object detection, object tracking algorithms would look like and on top of that you could develop your own application.”

Nvidia also expects the Jetson TK1 to be able to operate in the sub-10 Watt market for applications that previously consumed 100 Watts or more.

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Do Chip Makers Have Cold Feet?

It is starting to look like chip makers are having cold feet about moving to the next technology for chipmaking. Fabricating chips on larger silicon wafers is the latest cycle in a transition, but according to the Wall Street Journal chipmakers are mothballing their plans.

Companies have to make massive upfront outlays for plants and equipment and they are refusing, because the latest change could boost the cost of a single high-volume factory to as much as $10 billion from around $4 billion. Some companies have been reining in their investments, raising fears the equipment needed to produce the new chips might be delayed for a year or more.

ASML, a maker of key machines used to define features on chips, recently said it had “paused” development of gear designed to work with the larger wafers. Intel said it has slowed some payments to the Netherlands-based company under a deal to help develop the technology.

Gary Dickerson, chief executive of Applied Materials said that the move to larger wafers “has definitely been pushed out from a timing standpoint”

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Will Google Use Intel Inside?

It seems that Intel has elbowed its way under the bonnet of the high profile Nexus 8 tablet. Word on the street is that the Moorefield chip which is said to make a top speed of around 2.33 GHz, when the wind is behind it, has kicked Qualcomm’s tried and tested Snapdragon chip out of the Nexus range.

The move would give the Nexus 8, some good GPU power thanks to the PowerVR G6430 graphic engine. Google may unveil the actual tablet during the Google I/O event as well as the next big upgrade to the Android software dubbed lollipop. Still it is starting to look like Intel may really become a force to be reckoned with in mobile after all.

However, we should point out that Nexus 8 CPU rumors are nothing new. There was talk of Intel, Qualcomm and even Nvidia over the past couple of months – but we are still not entirely certain what’s under the bonnet.

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Is Ethernet For Autos?

The most ubiquitous local area networking technology used by large companies may be packing its bags for a road trip.

As in-vehicle electronics become more sophisticated to support autonomous driving, cameras, and infotainment systems, Ethernet has become a top contender for connecting them.

For example, the BMW X5 automobile, released last year, used single-pair twisted wire, 100Mbps Ethernet to connect its driver-assistance cameras.

Paris-based Parrot, which supplies mobile accessories to automakers BMW, Hyundai and others, has developed in-car Ethernet. Its first Ethernet-connected systems could hit the market as soon as 2015, says Eric Riyahi, executive vice president of global operations.

Parrot’s new Ethernet-based Audio Video Bridging (AVB) technology uses Broadcom’s BroadR-Reach automotive Ethernet controller chips.

The AVB technology’s network management capabilities allows automakers to control the timing of data streams between specific network nodes in a vehicle and controls the bandwidth in order to manage competing data traffic.

Ethernet’s greater bandwidth could provide drivers with turn-by-turn navigation while a front-seat passenger streams music from the Internet, and each back-seat passenger watches streaming videos on separate displays.

“In-car Ethernet is seen as a very promising way to provide the needed bandwidth for coming new applications within the fields of connectivity, infotainment and safety,” said Hans Alminger, senior manager for Diagnostics & ECU Platform at Volvo, in a statement.

Ethernet was initially used by automakers only for on-board diagnostics. But as automotive electronics advanced, the technology has found a place in advanced driver assistance systems and infotainment platforms.

Many manufacturers also use Ethernet to connect rear vision cameras to a car’s infotainment or safety system, said Patrick Popp, chief technology officer of Automotive at TE Connectivity, a maker of car antennas and other automobile communications parts.

Currently, however, there are as many as nine proprietary auto networking specifications, including LIN, CAN/CAN-FD, MOST and FlexRay. FlexRay, for example, has a 10Mbps transmission rate. Ethernet could increase that 10 fold or more.

The effort to create a single vehicle Ethernet standard is being lead by Open Alliance and the IEEE 802.3 working group. The groups are working to establish 100Mbps and 1Gbps Ethernet as de facto standards.

The first automotive Ethernet standard draft is expected this year.

The Open Alliance claims more than 200 members, including General Motors, Ford, Daimler, Honda, Hyundai, BMW, Toyota, Volkswagen. Jaguar Land Rover, Renault, Volvo, Bosch, Freescale and Harman.

Broadcom, which makes electronic control unit chips for automobiles, is a member of the Open Alliance and is working on the effort to standardize automotive Ethernet.

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What Do Smaller Controllers Mean?

If you want a wearable Internet of Things, the electronics have to be as tiny and as energy efficient as possible. That’s why a new microcontroller by Freescale Semiconductor is noteworthy.

The company has produced the Kinetis KLO3 MCU, a 32-bit ARM system that is 15% smaller than its previous iteration but with a 10% power improvement.

Internet of Things is a buzzword for the trend toward network-connected sensors incorporated into devices that in the past were standalone appliances. These devices use sensors to capture things like temperatures in thermostats, pressure, accelerometers, gyroscopes and other types of MEMS sensors. A microcontroller unit gives intelligence and limited computational capability to these devices, but is not a general purpose processor. One of the roles of the microcontroller is to connect the data with more sophisticated computational power.

The Kinetis KLO3 runs a lightweight embedded operating system to connect the data to other devices, such as an app that uses a more general purpose processor.

Kathleen Jachimiak, product launch manager at Freescale, said the new microcontroller will “enable further miniaturization” in connected devices. This MCU is capable of having up to 32 KB of flash memory and 2 KB of RAM.

Consumers want devices that are light, small and smart. They also want to be able to store their information and send it to an application that’s either on a phone or a PC, Jachimiak said.

This microcontroller, at 1.6 x 2.0 mm, is smaller than the dimple on a golf ball, and uses a relatively new process in its manufacturing, called wafer level chip scale packaging. The process involves building the integrated package while the die is still part of a wafer. It’s a more efficient process and produces the smallest possible package, for a given die size.

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Ubuntu Cross-Platform Delayed

Ubuntu will not offer cross-platform apps as soon as it had hoped.

Canonical had raised hopes that its plan for Ubuntu to span PCs and mobile devices would be realised with the upcoming Ubuntu 14.04 release, providing a write-once, run-on-many template similar to that planned by Google for its Chrome OS and Android app convergence.

This is already possible on paper and the infrastructure is in place on smartphone and tablet versions of Ubuntu through its new Unity 8 user interface.

However, Canonical has decided to postpone the rollout of Unity 8 for desktop machines, citing security concerns, and it will now not appear along with the Mir display server this coming autumn.

This will apply only to apps in the Ubuntu store, and in the true spirit of open source, anyone choosing to step outside that ecosystem will be able to test the converged Ubuntu before then.

Ubuntu community manager Jono Bacon told Ars Technica, “We don’t plan on shipping apps in the new converged store on the desktop until Unity 8 and Mir lands.

“The reason is that we use app insulation to (a) run apps securely and (b) not require manual reviews (so we can speed up the time to get apps in the store). With our plan to move to Mir, our app insulation doesn’t currently insulate against X apps sniffing events in other X apps. As such, while Ubuntu SDK apps in click packages will run on today’s Unity 7 desktop, we don’t want to make them readily available to users until we ship Mir and have this final security consideration in place.

“Now, if a core-dev or motu wants to manually review an Ubuntu SDK app and ship it in the normal main/universe archives, the security concern is then taken care of with a manual review, but we are not recommending this workflow due to the strain of manual reviews.”

As well as the aforementioned security issues, there are still concerns that cross-platform apps don’t look quite as good on the desktop as native desktop versions and the intervening six months will be used to polish the user experience.

Getting the holistic experience right is essential for Ubuntu in order to attract OEMs to the converged operating system. Attempts to crowdfund its own Ubuntu handset fell short of its ambitious $20m target, despite raising $10.2 million, the single largest crowdfunding total to date.

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Did Intel Kill Bay Trail?

Intel has decided that some of its budget Bay Trail parts have been out evolved and flung them into a tar pit. According to CPU World the parts first appeared in September. Intel released budget Bay Trail systems on a chip for mobile and desktop markets, under Celeron and Pentium brands.

They were manufactured on 22nm technology, and featured such enhancements as greater number of CPU cores, higher clock speeds, beefed up graphics unit, not to mention an out-of-order microarchitecture, that improved per-clock CPU performance by up to 30 per cent faster compared to their predecessors. With this performance goodness it is a little surprising the Intel has decided that all the all Bay Trail SoCs will be discontinued in a matter of a few months. Details of the planned discontinuation were published this week by Intel in several Product Change Notification documents.

The Desktop Pentium J2850, along with mobile Celeron N2810 and Pentium N3510 are already End of Lifed and its last orders will be in two weeks, on February 11. The chips will ship until April 25, 2014. Also retired are mobile Celeron N2806, N2815, N2820, N2920, and Pentium N3520. Their EOL date is April 11, 2014, and they will ship until May 30, 2014. On August 22, 2014, Intel is going to discontinue Celeron J1750, J1850, N2805 and N2910. The “J” models are desktop processors, and the “N” are mobile ones. There is no word on Z-series Bay Trail-T parts, none appear to be EOL’d at this  time.

Furthermore, on the same date Intel will retire Core i7-3940XM Extreme Edition, and boxed and tray versions of Core i7-3840QM and i7-3740QM CPUs. The last shipment date for the Celerons and Core i7s is February 6, 2015.

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Qualcomm Acquires Patents From HP

Chip making giant Qualcomm Inc has purchased a patent portfolio from Hewlett-Packard Co, including those of Palm Inc and its iPaq smartphone, in a move that will bulk up HP’s offerings to handset makers and other licensees.

The portfolio comprises about 1,400 granted patents and pending patent applications from the United States and about 1,000 granted patents and pending patent applications from other countries, including China, England, Germany, Japan and South Korea.

The San Diego-based chipmaker did not say how much it paid for the patents.

The majority of Qualcomm’s profits come from licensing patents for its ubiquitous CDMA cellphone technology and other technology related to mobile devices. Instead of licensing patents individually, handset vendors, carriers and other licensees pay royalties to Qualcomm in return for access to a broad portfolio of intellectual property.

The patents bought from HP, announced in a release on Thursday, cover technologies that include fundamental mobile operating system techniques.

They include those that HP acquired when it bought Palm Inc, an early player in mobile devices, in 2010 and Bitfone in 2006. HP tablets made using Palm’s webOS operating system failed to catch on.

“There’s nothing left at Palm that HP could get any use out of so it’s better to sell the patents, which are always valuable to Qualcomm,” said Ed Snyder, an analyst with Charter Equity Research. “They have to keep that bucket full.”

The new patents will not lead to increased royalty rates for existing Qualcomm licensees, a Qualcomm spokeswoman said.

Last year, HP sold webOS, which it received as part of the $1.2 billion Palm acquisition, to South Korea’s LG Electronics Inc.

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AMD Changes Kaveri

Since AMD officially launched its 4th generation A-Series Kaveri APUs and lifted the NDA veil from all press materials, we noticed that it has started to use a new term to define the structure of its new Kaveri APUs. As we reported last week, AMD is now talking about Compute Cores, which practically puts CPU and GPU cores on an equal footing, suggesting that there should not be any difference between them and that some tasks, previously limited to the CPU, can be done by the GPU as well.

If you take a look at the official AMD slide below which details the three new Kaveri APUs, the A10-7850K, A10-7700K and the A8-7600, you will notice that AMD lists the flagship as the APU with 12 Compute Cores or simply four CPU and eight GPU cores. Since the Kaveri APU is actually the first APU with HSA (Heterogeneous System Architecture) support, with hUMA, or equal memory access by both CPU and the GPU, heterogeneous queuing, which allows the GPU and CPU to have equal flexibility to create/dispatch work and an ability to talk about APU GFLOPS, or combined compute power of the entire APU, it makes sense for AMD to also talk about Compute Cores.

Of course, there are still some application specific tasks where the CPU or the GPU are much better, but, according to AMD, Kaveri is the first true APU, where the GPU is not just for gaming, it can actually do much more.

AMD Senior Manager Sasa Marinkovic, Technology lead for the Client Business Unit, said: “At AMD, we recognize that our customers often think of processors (CPUs) and graphics cards (GPUs) in terms of the number of cores that each product has. We have established a definition of the term “Compute Core” so that we are taking a consistent and transparent approach to describing the number of cores in our HSA-enabled APUs. A Compute Core can be either a CPU core or GPU core i.e. Kaveri can have up to 12 Compute Cores (4 CPU and 8 GPU).”

Although it does sound like a marketing gimmick, but actually is not due to HSA, it will definitely mark a new way for AMD to market/sell its APUs and it will definitely simplify the shopping experience for many casual buyers, more Compute Cores, more performance.

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Are Transparent Semiconductors Next?

Scientist have emerged from their smoke filled labs with transparent thin-film organic semiconductors that could become the foundation for cheap, high-performance displays. Two university research teams have worked together to produce the world’s fastest thin-film organic transistors, proving that this experimental technology has the potential to achieve the performance needed for high-resolution television screens and similar electronic devices.

According to the latest issue of Nature Communications, engineers from the University of Nebraska-Lincoln (UNL) and Stanford University show how they created thin-film organic transistors that could operate more than five times faster than previous examples of this experimental technology.

Research teams led by Zhenan Bao, professor of chemical engineering at Stanford, and Jinsong Huang, assistant professor of mechanical and materials engineering at UNL used their new process to make organic thin-film transistors with electronic characteristics comparable to those found in expensive, curved-screen television displays based on a form of silicon technology.

At the moment the high tech method is to drop a special solution, containing carbon-rich molecules and a complementary plastic, onto a spinning platter made of glass. The spinning action deposits a thin coating of the materials over the platter. The boffins worked out that if they spun the platter faster and coated a tiny portion of the spinning surface, equivalent to the size of a postage stamp they could put a denser concentration of the organic molecules into a more regular alignment. The result was a great improvement in carrier mobility, which measures how quickly electrical charges travel through the transistor.

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