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Flaw in Intel’s 320 Series SSD Confirmed
July 22, 2011 by admin
Filed under Around The Net
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There had been talk on the Internet in reference to the nasty bug discovered and reported on Intel’s support forums regarding the data loss on its recently released 320-series SSDs and today, Intel has finally and officially confirmed it.
The users have mentioned that under power failures, the drive reverts back to 8MB capacity and thus looses all the data stored on the drive. According to preliminary reports the drive tries to reconnect with the SATA port rather than to go for a proper shutdown.
New MacBook Includes Faster NAND Chip
The soon to be released new version of Apple’s MacBook Air, will feature NAND flash memory with up to 400Mbps performance, about one and a half times faster than its current technology, according to a recent report.
Unlike many notebooks, the MacBook Air has no hard drive or optical drive and instead uses a slim flash board for its internal mass storage device.
Citing an “Asian electronics component company person,” the blog site Macotakara stated that Apple will use flash memory chips that includes the new Double Data Rate (DDR) 2.0 interface. While the rumors could not be confirmed, the upgrade would come as no surprise, since Apple’s next MacBook Air, which originally used Toshiba’s Blade X-gale NAND flash board, has moved to using Samsung’s flash memory. The MacBook Air’s current Samsung flash sports read rates of 261Mbps and write rates of up to 209Mbps and is based on DDR 1.0 technology.
DDR 2.0 provides a tenfold increase over the 40Mbps Single Data Rate (SDR) NAND flash in widespread use today.
In May, Samsung announced that it was producing DDR 2.0 multilevel cell flash chips. Samsung’s flash chips are made using its smallest circuitry, only 20 nanometers wide. The chips boast a performance improvement of three times over its previous technology.
DDR NAND flash comes in two forms: Toggle Mode from Samsung and Toshiba; and ONFI NAND, from the Open NAND Flash Interface (ONFI) working group. The ONFI protocol is used by flash manufacturers, including Intel, Micron, SanDisk, Hynix and Spansion. In March, the ONFI working group announced its 3.0 specification for the DDR 2.0 interface, which also has up to 400Mbps throughput but with only half the number of pins, for a significant reduction in size.
Samsung Asks ITC To Ban Apple Products
July 6, 2011 by admin
Filed under Consumer Electronics
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Samsung requested that the U.S. International Trade Commission ban the importation of Apple’s iPhones, iPads and iPods, ratcheting up its fight with Apple.
The filing, dated Tuesday, states Apple’s iPhone, iPod digital music player and iPad tablet infringe on five of Samsung’s patents involving telecommunications standards and user interface inventions.
Samsung also filed a fresh patent lawsuit against Apple in a Delaware federal court on Wednesday.
The complaints are the latest salvo in a growing legal battle between the two electronics giants.
In April, Apple sued Samsung in a California federal court, claiming the South Korean firm’s Galaxy line of mobile phones and tablets “slavishly” copies the iPhone and iPad.
Samsung then countersued in California, and Apple last week filed another lawsuit in South Korea. An Apple spokesman could not be immediately reached on Wednesday.
As well as its own phones and tablets, Samsung manufactures microchips for Apple’s gadgets, a business that brought in about $5.7 billion in revenue for the South Korean company last year.
Before banning the importation of Apple’s popular devices, the ITC would first have to agree to look into Samsung’s allegations, a process that could be quite lengthy.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”
10-Inch Tablets For $299?
June 5, 2011 by admin
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Taiwan’s Micro-Star International unveiled two new Android-based tablets at Computex this week that appear much sleeker than the WindPad tablets it has manufactured in the past.
The WindPad Enjoy 10 and Enjoy 7, which are being shown in a location further away from the show floor, will start shipping to retailers at the end of July, priced at $299 for the 10-inch version and $199 for the 7-inch version, said MSI product manager Rory Chen.
The tablets on show here were running the 2.3 Gingerbread version of Android. MSI hopes to start using the 3.0 Honeycomb Android OS on the tablets later this year, but it’s unlikely to be available with the first devices that go on sale.
The Enjoy 10 isn’t as thin and light as the iPad 2, and a spec sheet shows the new tablets have no 3G option — only Bluetooth and Wi-Fi. It’s also behind the iPad in other areas such as memory and storage. But the Enjoy 10′s $299 price tag makes it considerably cheaper than Apple’s tablet, which starts at $499 for the Wi-Fi-only model.
Intel Is Still The Market Leader
Reports now show that Intel shipped 44 percent more Microprocessors than Samsung and Intel’s overall shipments grew 25 percent year-over-year. Meanwhile Samsung’s first quarter microprocessor grew by 15 percent. The report also noted that Toshiba and TSMC came in a respectful 3rd and 4t with 10 and 18 percent of year over year growth respectively. Texas Instruments came in 5th barely edging out Renesas which appears to be closing the gap on TI.
Super mobile chipmaker Qualcomm was 10th and showed a 22 percent growth year-over-year; while AMD ranked 12th, with 2 percent growth. One would have thought that AMD would have been one of the top five manufacturers.
Unfortunately Nvidia and Sony ended up at the bottom with ended up at the bottom with six and 14 percent drop in sales, respectively.
Is Intel Facing The Heat?
Analysts at Goldman Sachs are saying that chip maker Intel may be in a pickle as microprocessor shipments slow and it faces stiff competition. That said, analysts have advised stockholders to sell Intel as they downgraded the stock.
James Covello and Simon Schafer of GS said that there will be a surplus in chips due to plant expansion. Meanwhile the rest of the gang on Wall Street is forecasting a six percent year-over-year rise in Intel’s sales, amid expanding gross margins, Goldman says otherwise and that sales will be flat due to excess capacity.
Furthermore, Intel is expected to face problems dealing with better chips from their main rival AMD: while tablets are cannibalising notebooks with ARM kicking its tail in the mobile space.
Can Intel Tablets Take Business Away From iPads?
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Tablets based on Intel’s first dedicated tablet processor may not be a smash hit among consumers like Apple’s iPad, but they could find much better acceptance within enterprises, analysts said this week.
Apple’s iPad is the ‘Golden Child’, but Intel’s Oak Trail processor could bring a fresh crop of tablets that are more closely aligned to security, software and hardware needs of businesses, analysts said. By supporting the Windows 7 OS, Oak Trail tablets will integrate better than the iPad into IT environments relying on Windows.
Tablets with Intel’s 1.5GHz Atom Z670 processor from Fujitsu and Motion Computing went on sale this month and will start shipping in June. Fujitsu is taking orders for the Stylistic Q550 Slate PC tablet, which is priced starting at US$729. Motion Computing is taking orders for the CL900 Tablet PC, which is priced starting at $899. The business tablets come with Microsoft’s Windows 7 OS and include solid-state drive storage. Intel has said 35 devices based on the Oak Trail chip will become available starting in May.
Apple may be spurring consumer tablet innovation, but computing needs are very different in the corporate world, said Stephen Baker, vice president of industry analysis at NPD. Outside the Apple ecosystem, there is a whole world of corporate applications and computing needs driven by Windows, Baker said.
New Atom Architecture In The Making
Word on the street is that Intel is in the process of developing an entirely new Atom architecture based on its 3D transistor technology they announced last week. This new architecture should enable more power efficiency on the chip.
The new processor is being called Silvermont and the Atom will encompass a system-on-chip design, similar to Intel’s Z760 Atom or ARM’s processors. Silvermont is being designed on Intel’s 22nm process and harness the power of Intel’s 3D transistor technology that has yet to be tested.
Intel Developing Thunderbolt Technology
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A new interconnect technology being developed by Intel could be ready for market by 2015 and will be able to move data between computers at up to five times the speed of its recently launched Thunderbolt technology, an Intel researcher said earlier this week.
The new technology uses silicon photonics, which combines silicon components with optical networking, to transfer data at up to 50 gigabits per second over distances of up to 100 meters, said Jeff Demain, strategy director of circuits and system research at Intel Labs, at a company event in New York.
Intel expects the technology to be ready for use in PCs, tablets, smartphones, televisions and other products by 2015, Demain said. As well as being faster than today’s interconnect technologies, it’s expected to lower costs because the components will be built using existing silicon manufacturing processes.
The technology could possibly be used in TVs and set-top boxes to carry video streams at much higher definition than those available today. Image resolution is likely to quadruple by the middle of the decade, when successors to 1080p have arrived, and that will mean more data has to be pushed to the TV.
It should also enable faster data transfers between smartphones, tablets, PCs and peripherals such as external storage drives.
The technology still has a way to go, but Intel showed its progress at the event in New York Wednesday. It showed what it said were working prototypes of the silicon chips used to transmit and receive the laser signals.