Intel plans to invest up to $5.5 billion over the coming years to use its Dalan, China, facility to expand its NAND manufacturing capacity. Initial 3D NAND production is expected to commence in second-half 2016 in Dalan.

Barrons has said that with pricing pressure already present in DRAM, Intel’s move puts Micron in a state of uncertainty.

This is a little odd given that Intel and Micron are chums, but Barron’s Rajvindra Gill said that the move will reduce Chipzilla’s dependence on Micron.

More than half of output is expected to use 3D NAND in the next two to three years and Intel’s focus on the technology reduces its reliance on Micron as a supplier while transforming it into a competitor, Gill said.

Micron be the last one standing when the mergers and acquisitions the industry is seeing and be an industry also ran.

Intel’s focus on the non-volatile memory market could put the pricing and supply/demand environment under pressure.

Micron has already had difficulties setting up 3D NAND versus its peers and now has another significant challenger entering the market, Gill said.

Intel’s move to NAND places a major Micron customer at risk. While Intel noted that its relationship with Micron remains strong and that it will continue to focus on 3D Xpoint, we believe the IM Flash Agreement could be at risk.

With Intel producing more NAND on its own, it could look to lower its reliance on the joint venture.

Intel has a right to sell its portion of the joint venture to Micron. If Intel elects to do so, a closing date would be set within two years. Sales to IM Flash sales to Intel were $101 million in the third quarter, or 8 per cent of trade NAND revenue.
Courtesy-http://www.thegurureview.net/computing-category/is-intel-trying-to-destroy-micron.html

The new Mali-470 GPU has half the power consumption and two times the energy efficiency of the Mali-400, and is designed for next-generation wearables and IoT devices such as industrial control panels and healthcare monitors that rely on low-cost and low-power chips.

The Mali-470 supports OpenGL ES 2.0, used by Android and Android Wear, hinting that the GPU could also find its way into low-cost smartphones. If not, ARM promises that the chip will bring smartphone-quality visuals to wearable and IoT devices, supporting screen resolutions of up to 640×640 on single-core devices, and higher resolutions for multi-core configurations.

ARM envisions the new GPU paired with its efficient Cortex-A7 or A53 CPU designs for a low-power SoC.

“ARM scrutinises every milliwatt across the entire SoC to enable OEMs to optimize energy efficiency and open up new opportunities,” said Mark Dickinson, vice president and general manager of ARM’s multimedia processing group.

“Tuning efficiency is particularly relevant for devices requiring sophisticated graphics on a low power budget such as wearables, entry-level smartphones and IoT devices. The Mali-470 has been designed to meet this demand by enabling a highly capable user interface while being extremely energy efficient.”

ARM expects the first SoCs using the GPU be ready by the end of 2016, meaning that the chip will start showing up in devices the following year.

The launch of the Mali-470 GPU comes just hours after ARM announced plans to pick up the product portfolio and other business assets of Carbon Design Systems, a supplier of cycle-accurate virtual prototyping solutions.

The deal will see Carbon’s staff transfer to ARM, where the chip firm will make use of the Massachusetts-based outfit’s expertise in virtual prototypes. This will enable ARM to iron out any bugs and make improvements to chips before they move to foundries for production.

ARM also said that Carbon will help the firm enhance its capability in SoC architectural exploration, system analysis and software bring-up.

Courtesy-TheInq

A recent study shows that the slump in PC sales in the first half was deliberately made to help Skylake sell better since August. Initially analysts believed that sales of the Skylake are hindered by existing stocks of previous Haswells, but it turns out this was untrue.

Tech Trader Daily has found that Intel significantly reduced shipments of its central processing units in the first half of the year, to leave PC maker inventories drained and empty.

This is normal practice since Intel needed to have all its PC makers and retailers with empty enough stocks in order to fill them up quickly with new Skylake models in August. But this year the plan worked too well. The Skylake stocks quickly evaporated and the first supply aps appeared between the months of August and September, with Intel quickly assuring its customers that new Skylake batches will return in stores as fast as possible.

Normally Chipzilla has a cycle of unit buildups in the first half of a financial year and then a controlled drain of units in the second half. This helps PC makers and retailers build systems in the first half and then sell them bundled without being compromised by stand-alone units selling alongside them at a higher pace in the second.

This time Intel launched the Skylake in the second half of the year, August onwards, so the cycle was stuffed up. Now it seems that this will mean a low supply of Skylakes in the first half of 2016. If you can find them, you might need to stock up now.

Intel is making piles from this. PC makers mainly build their systems on Skylakes and since the supply is low the price is high. Intel does not have to discount to shift the technology, the suppliers have to buy it at any price. Particularly as Intel’s only real x86 market, AMD, is having a bit of a snooze.

A full transition to Skylake will probably happen in winter, but the ongoing process at the moment gives Intel the much-needed money to financially buffer a slowdown in sales next spring.  All this gives a warning about what will happen if AMD goes under and Intel takes total control.

Source-http://www.thegurureview.net/computing-category/did-intel-deliberately-slow-pc-sales.html

The new 8000 series consists of a Starter Kit (20800 AFA) and software updates for the full StoreServ range, and HP can now offer multi-petabyte systems offering 3.2 million IOPS with scale out from two to eight controllers and proven tier-1 resiliency.

“Regardless of your size, budget, growth rate, quality of service requirements or even your storage network environment, HP 3PAR StoreServ storage offers a best-in-class flash solution to power your public, private or hybrid cloud with uncompromising adaptability from a single architecture,” said Manish Goel, senior vice president and general manager of HP Storage.

HP has also announced additions to the existing 20000 range, including a 20800 All-Flash Starter Kit clocking in at $99,000, and the 20450, a 6PB all-flash array with 1.8 million IOPS.

Using these products together can create up to 60PB of aggregate usable capacity. Both ranges offer the same hardware acceleration from the HP 3PAR Gen5 Thin Express ASIC, which offers double the bandwidth of competing platforms and up to 20GBps of read bandwidth.

Both ranges are now also certified for use in SAP HANA Tailored Data Centre Integrations. Priority Optimisation can bring latencies as low as 0.5 milliseconds through a QoS engine that requires almost no interaction from system admins.

This is just part of an aggressive strategy in cheap, scalable enterprise storage. In April the company launched the Openstack based StoreVirtual range.

HP has also announced data protection enhancements to the 3PAR StoreServ powered by StoreOnce Recovery Manager Central, offering complete granular recovery of backups taken incrementally based only on changed data to minimise resources.

Finally, Fibre customers can use the new HP SmartSAN, which uses Express Provisioning Technology to orchestrate SAN fabric zoning, reducing the process of SAN configuration by 80 percent.

The products are designed to be a little more robust than SanDisk’s InfiniFlash, which is designed for no more than a few writes of archiving, and the price tag goes up accordingly starting at $19,000, but it’s still a significant drop in price for all-flash and hybrid flash arrays.

An eight-node enterprise flash family with density equivalent to a mechanical drive array starts at $1.50 per gigabyte, based on its predecessor line. That’s a big drop given the speed advantages that could pay for itself in certain sectors.

The products will be rolling out over the next few months starting with the StoreServ 8000 which will be available immediately. More products will be available next month, and RMC-V brings up the rear in October.

Source-http://www.thegurureview.net/computing-category/hp-moves-to-lower-the-price-of-ssds.html

Sourc

Beancounters at Digitimes Research said that sales totaled US$12 billion in the second quarter of 2015, increasing 1 per cent from the previous quarter,

Server-use DRAM products became the primary product line for SK Hynix for the first time in the second quarter as sales of its PC-use DRAM chips suffered a significant decline compared to a quarter earlier.

Price reductions of PC DRAM chips were greater than market expectations in the second quarter due to an oversupply in the market, affecting sales performance of SK Hynix.

Samsung was less affected by declining PC DRAM prices because mobile DRAM products accounted for 35 per cent of its total DRAM income.

Samsung memory and semiconductor revenues hit a record high in the second quarter.

For the third quarter, the bit growth rates of NAND flash shipments at Samsung will rise 10 per cent and SK Hynix will increase 13 per cent on quarter.

SK Hynix will manage a five to eight per cent growth while Samsung is expected to see shipments of its DRAM chips grow 12-14 per cent.

Digitimes Researcher flipped their iChing coins and came to the conclusion that Korea’s memory products are expected to increase 3 per cent on quarter and 12 per cent on year in the third quarter of 2015.

Source