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Can Intel Go Wireless?
July 17, 2014 by admin
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Intel wants to lead the drive into a less wired world by pushing standards, drive down the cost, and make these technologies ubiquitous.
At Computex, Intel demonstrated WiGig wireless docking and simultaneous wireless charging of a laptop, smartphone, headset and tablet with a pad placed under a tabletop. The company said that it would deliver reference designs for systems that use the technology in 2016 as part of a future Core processor family known as Skylake.
WiGig trades range for speed and operates in the 60GHz spectrum, compared with 2.4- and 5.0GHz for WiFi. It can transfer data at speeds of up to 7Gbps, compared to a maximum speed of a little more than 1Gbps for 802.11ac.
WiGig can be used to stream video from a mobile device to a TV or monitor, replacing HDMI and DisplayPort cables, but is being seen as a way of carrying out networking and wireless docking. It means that you can put your laptop on your desk and it automatically connects with your monitor, keyboard and mouse, printer and other peripherals without cables.
Intel plans to make its own WiGig chips. The outfit said it will have silicon for both transmitters and receivers in production by the end of this year, and available in products in the first half of 2015. Intel also wants to push Rezence for wireless charging.
Chipzilla has added that it will contribute some of its own IP to expand the standard to support wireless charging of laptops (which requires at least 20 watts) and that Rezence will be part of a Skylake reference design by 2016. This means that the world could be wirelessly networked soon after that.
TSMC Testing ARM’s Cortex A57
ARM and TSMC have manufactured the first Cortex A57 processor based on ARM’s next-gen 64-bit ARMv8 architecture.
The all new chip was fabricated on TSMC’s equally new FinFET 16nm process. The 57 is ARM’s fastest chip to date and it will go after high end tablets, and eventually it will find its place in some PCs and servers as well.
Furthermore the A57 can be coupled with frugal Cortex A53 cores in a big.LITTLE configuration. This should allow it to deliver relatively low power consumption, which is a must for tablets and smartphones. However, bear in mind that A15 cores are only now showing up in consumer products, so it might be a while before we see any devices based on the A57.
In terms of performance, ARM claims the A57 can deliver a “full laptop experience,” even when used in a smartphone connected to a screen, keyboard and mouse wirelessly. It is said to be more power efficient than the A15 and browser performance should be doubled on the A57.
It is still unclear when we’ll get to see the first A57 devices, but it seems highly unlikely that any of them will show up this year. Our best bet is mid-2014, and we are incorrigible optimists. The next big step in ARM evolution will be 20nm A15 cores with next-generation graphics, and they sound pretty exciting as well.
TSMC And Imagination Team Up
TSMC and Imagination Technologies announced the next step in their tech collaboration in an effort to develop Imagination’s next generation PowerVR 6-series GPUs.
The new GPUs are still not ready for prime time, but they should be used in future SoC designs, including those stamped out using TSMC’s 16nm FinFET process. The two companies will work to create new reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology.
As GPU muscle becomes more important for next generation SoCs, designers need more advanced and more complex processes, such as TSMC’s 16FinFET.
“Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products,” said Hossein Yassaie, CEO of Imagination.
TSMC VP Cliff Hou argued that the need for high performance mobile GPUs will drive silicon processes in the future, much in the same way CPU development pushed new processes in the nineties.
Samsung Goes Star-ups
Samsung will put $1.1 billion towards venture capital funding of semiconductor firms.
The company said that it will commit the research and development funding through its Samsung Venture Americas branch and Catalyst Fund investment operations, according to multiple reports.
The investment is set to target semiconductor design and manufacturing. The company will look to fund startups that can assist its hardware units and will open a new R&D facility in Silicon Valley.
The announcement comes as Samsung is seeing its revenues hit record levels. The company reported quarterly profits of 7.5 billion to close out 2012 and sales from Samsung’s handset unit reached record levels.
Analysts believe that the company now controls nearly 23 percent of the smartphone market. The jump in hardware sales has brought with it a healthy appetite for components. Earlier this month Samsung passed Apple to become the world’s largest single user of semiconductor chips.
Samsung has recently stepped up its investment activities, with the firm buying storage vendor Nvelo and last week buying a small stake in Wacom, best known for its touchpad and stylus input technology. With the firm looking to invest in startups, it is perhaps looking to follow in Apple’s footsteps, which kickstarted its chip design efforts by buying PA Semiconductor and later Intrinsity, and invested in Imagination Technologies.
TSMC 20nm Processors In High Demand
TSMC believes demand for next-generation 20nm chips will be even higher than demand for current 28nm products.
Speaking in a conference call, TSMC CEO Morris Chang said the volume of 20nm SoCs built next year will be greater than 28nm volume in 2012 and by 2015 it should be greater than 28nm volume in 2013.
TSMC hopes to start 20nm production in the latter part of the year. The company is constructing two new facilities at Fab 15 and it hopes to start 20nm production in both simultaneously. We could be in for a quick ramp.
TSMC will offer only one version of the 20nm process, compared to four versions of the 28nm process. This should also allow it to ramp up volume production faster, reckons Xbit Labs.
TSMC To Boost 28nm Production
TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.
TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.
But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.
TSMC Makes Expansion Plans
TSMC is expected to spend $10 billion next year in capital works as Apple plans to contract the outfit to build its next-generation processors.
According to the Chinese-language Economic Daily News TSMC has informed the equipment suppliers of its decision to hike capital expenditure for 2013 to US$10 billion. This indicates that TSMC has overcome technical problem with 20nm process, which Apple’s next-generation processors are said to use.
It also suggests that Jobs’ Mob is speeding up its reduction of work it gives Samsung. Apple has reportedly sent around 200 design engineers to help TSMC get familiar with the company’s next-generation processor designs at TSMC’s facility in Central Taiwan Science Park.
AMD Gives Opteron A Boost
AMD has shown there is a little life left in its Bulldozer Opterons by bumping up the clock speed of five Opteron models.
AMD launched its Bulldozer Opteron processors last November amid widespread anticipation that its brand new Bulldozer architecture would once again make it competitive with Intel. Its new architecture failed to impress, but the company has managed to eek out another 100MHz from five Opteron processors in what is likely to be a last hurrah before Piledriver Opterons make their appearance.
AMD bumped up the clocks by 100MHz on the 16-core Opteron 6284 SE and Opteron 6278 to 2.7GHz and 2.4GHz, respectively, while keeping TDPs the same as before, at 140W and 115W, respectively. The firm gave four Opteron 4200 series chips the same 100MHz bump, including the eight-core Opteron 4276HE to 2.6GHz, the six-core Opteron 4240 to 3.4GHz and the Opteron 4230 to 2.9GHz.
AMD was keen to point out that its speed bumped Opteron chips have been picked by Dell and by HP for 11 of its servers. Although the firm has not been able to compete with Intel’s Xeon chips on perfermance, its chips are considerably cheaper, a fact that AMD is using to win customers.
Although AMD’s 100MHz speed bump isn’t going to set the world on fire, every little bit of performance will help the firm as Intel ploughs on with its hugely impressive Sandy Bridge E and Ivy Bridge Xeon chips. AMD’s answer to Intel’s latest Xeon chips is expected to be the Piledriver Opterons.
AMD Aims For The Cloud
Advanced Micro Devices on Tuesday is expected to announce new Opteron 3200 series chips for low-end servers, which the company believes will give it a competitive edge over Intel in the cloud server arena.
The three Opteron 3200 chips are for use in single-socket servers for Web hosting and cloud applications, according to a company presentation. The chips have up to eight processor cores, clock speeds of up to 3GHz, and draw between 45 watts and 65 watts of power.
The new chips are based on the Bulldozer processor architecture, which is also in the Opteron 6200 16-core processors and FX-series gaming chips. The Opteron 3200 launch comes after AMD in late February announced it would pay US$334 million to acquire SeaMicro, which offers dense and power-efficient servers for cloud computing environments.
AMD’s chips will likely compete against Intel’s Xeon E3 series chips, which are used in SeaMicro’s SM10000-XE server. Intel worked with SeaMicro on the server, but analysts have said that AMD will ultimately swap Intel’s chips with its own chips.
AMD is pitching the Opteron 3200 as a “low-cost-per-core” product. The chips are priced between US$99 and $129, while Intel’s E3 chips are priced between $189 and $885. MSI, Tyan, Fujitsu and Dell are expected to launch Web servers and dense systems based on the chips.
AMD’s expanded product line provides an entry point to new markets, said Jim McGregor, chief technology strategist at In-Stat.
But the Opteron 3200 could be a misfit in servers if competing on price versus performance-per-watt, McGregor said. There is a growing interest in deploying low-power servers in data centers to cut energy costs, but the Opteron 3200 chips are comparatively power-hungry for such installations.
AMD To Slash A 10th Of Its Workforce
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Advanced Micro Devices Inc revealed a plan on Thursday to save about $200 million of operating costs in 2012 by cutting 10 percent of its global workforce and streamlining internal business processes.
The layoffs mark the first major move by Chief Executive Rory Read, who took the helm in August to try to galvanize a microprocessor maker that has bled market share to larger rival Intel Corp, while missing out on the mobile device boom.
“It’s not too surprising given the operating background of the new CEO and this is exactly what you’d bring an outsider in to do, but their problems go far deeper right now,” said Alex Gauna, an analyst at JMP Securities.
The layoffs should be completed in 2012′s first quarter, AMD said in a statement. Savings generated could help bankroll research and expansion into areas such as low-power chips, emerging markets and cloud computing next year.
In late September AMD, a distant second to Intel in selling microprocessors that are the brains of PCs, warned of manufacturing problems manufacturing it new 32 nanometer Llano chips as well as older 45 nanometer chips.