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HP Announces TouchPad 4G Deal
Hewlett-Packard announced it would release a 4G TouchPad tablet with upgraded hardware that will be available on AT&T’s wireless network.
The tablet will have a 1.5GHz processor, which is a change from the dual-core 1.2GHz Qualcomm Snapdragon processor available with older Wi-Fi-only TouchPad models that went on sale just two weeks ago.
Last August Qualcomm said that by the start of this year it would ship the dual-core Snapdragon QSD8672 chip that could run at clock speeds of up to 1.5GHz.
The TouchPad will have 32GB of internal storage, GPS and built-in AT&T wireless mobile broadband capabilities, HP said in a statement. Specific pricing and availability will be announced at a later date.
Wireless connectivity will be available through AT&T’s DataConnect mobile data plans for tablets or Wi-Fi hotspots around the country, HP said.
TouchPad users have expressed concerns about the device’s performance, especially the long load times for some applications. HP attributes the performance issue to software problems and said it will deliver an over-the-air software update that should resolve some performance problems.
Some buyers also were concerned about the TouchPad’s weight of about 1.6 pounds (740 grams), which is heavier than Apple’s iPad at 1.32 pounds. The TouchPad includes a 9.7-inch screen and comes with WebOS 3.0, which is also used in smartphones.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”