Meizu is expected to be one of the first companies to use the X25. Last year it was also the first to use MTK 6795T for its Meizu MX5 phone. In that case the “T” suffix stood for Turbo. This phone was 200 MHz faster than the standard Helio X10 “non T” version.

In 2016 is that MediaTek decided to use the new Helio X25 name because of a commercial arrangement. MediaTek didn’t mention any of the partners, but confirmed that the CPU and GPU will be faster. They did not mention specific clock speeds. Below is a diagram of the Helio X20, and we assume that the first “eXtreme performance” cluster will get a frequency boost, as well as the GPU.

The Helio X25 will not have any architectural changes, it is just a faster version of X20, just like MTK 6795T was faster version of MTK 6795. According to the company, the Helio X25 will be available in May.

This three cluster Helio X25 SoC has real potential and should be one of the most advanced mobile solutions when it hits the market.The first leaked scores of the Helio X20 suggest great performance, but the X25 should have even better scores. There should be a dozen design wins with Helio X20/ X25 and most of them are yet to be announced. There should be a few announcements for the Helio X25 soon, but at least we do know that now there will be a even faster version of three cluster processor.

Courtesy-Fud

The SDK gives developers access to advanced VR features, according to Qualcomm, allowing them to simplify development and attain improved performance and power efficiency with Qualcomm’s Snapdragon 820 processor, found in Android smartphones such as the Galaxy S7 and tipped to feature in upcoming VR headsets.

In terms of features, the development kit offers tools such as digital signal processing (DSP) sensor fusion, which allows devs to use the “full breadth” of technologies built into the Snapdragon 820 chip to create more responsive and immersive experiences.

It will help developers combine high-frequency inertial data from gyroscopes and accelerometers, and there’s what the company calls “predictive head position processing” based on its Hexagon DSP, while Qualcomm’s Symphony System Manager makes easier access to power and performance management for more stable frame rates in VR applications running on less-powerful devices.

Fast motion to photon will offer single buffer rendering to reduce latency by up to 50 percent, while stereoscopic rendering with lens correction offers support for 3D binocular vision with color correction and barrel distortion for improved visual quality of graphics and video, enhancing the overall VR experience.

Stereoscopic rendering with lens correction supports 3D binocular vision with color correction and barrel distortion for improved visual quality of graphics and video, enhancing the overall VR experience.

Rounding off the features is VR layering, which improves overlays in a virtual world to reduce distortion.

David Durnil, senior director of engineering at Qualcomm, said: “We’re providing advanced tools and technologies to help developers significantly improve the virtual reality experience for applications like games, 360 degree VR videos and a variety of interactive education and entertainment applications.

“VR represents a new paradigm for how we interact with the world, and we’re excited to help mobile VR developers more efficiently deliver compelling and high-quality experiences on upcoming Snapdragon 820 VR-capable Android smartphones and headsets.”

The Snapdragon VR SDK will be available to developers in the second quarter through the Qualcomm Developer Network.

The launch of Qualcomm’s VR SDK comes just moments after AMD also entered the VR arena with the launch of the Sulon Q, a VR-ready wearable Windows 10 PC.

Courtesy-TheInq

The plan is not official yet but appears to have been leaked to the Wall Street Journal. Achin Bhowmik, who oversees RealSense as vice president and general manager of Intel’s perceptual computing group, declined to discuss unannounced development efforts.

But he said Intel has a tradition of creating prototypes for products like laptop computers to help persuade customers to use its components. We have to build the entire experience ourselves before we can convince the ecosystem,” Bhowmik said.

Intel appears to be working on an augmented-reality headset when it teamed up with IonVR to to work on an augmented-reality headset that could work with a variety of operating systems, including Android and iOS. Naturally, it had a front-facing RealSense camera.

RealSense depth camera has been in development for several years and was shown as a viable product technology at the Consumer Electronics Show in 2014. Since then, nothing has happened and Microsoft’s Kinect sensor technology for use with Windows Hello in the Surface Pro 4 and Surface Book knocked it aside.

Intel’s biggest issue is that it is talking about making a consumer product which is something that it never got the hang of.

RealSense technology is really good at translating real-world objects into virtual space. In fact a lot better than the HoloLens because it can scan the user’s hands and translate them into virtual objects that can manipulate other virtual objects.

Courtesy-Fud

That’s according to U.S. Department of Energy (DOE) officials, who run the national labs. A new program aims to connect manufacturers with supercomputers and the expertise to use them.

This program provides $3 million, initially, for 10 industry projects, the DOE has announced. Whether the program extends into future fiscal years may well depend on Congress.

The projects are all designed to improve efficiency, product development and energy use.

For instance, Procter & Gamble will get help to reduce the paper pulp in products by 20%, “which could result in significant cost and energy savings” in this energy- intensive industry, according to the project description.

Another firm, ZoomEssence, which produces “powder ingredients that capture all the key sensory components of a liquid,” will work to optimize the design of a new drying method using HPC simulations, according to the award description.

Some other projects in the initial implementation of what is being called HPC4Mfg (HPC for Manufacturing) includes an effort to help Global Foundriesoptimize transistor design.

In another, the Ohio Supercomputer Center and the Edison Welding Institute will develop a welding simulation tool.

The national labs not only have the hardware; “more importantly the labs have deep expertise in using HPC to help solve complex problems,” said Donna Crawford, the associate director of computation at Lawrence Livermore National Laboratory, in a conference call. They have the applications as well, she said.

HPC can be used to design and prototype products virtually that otherwise might require physical prototypes. These systems can run simulations and visualizations to discover, for instance, new energy-efficient manufacturing methods.

Source-http://www.thegurureview.net/computing-category/u-s-wants-to-help-supercomputer-makers.html

According to the Gizchina website, the company the three new SoCs carry the catchy titles of MT6739, MT6750 and MT6750T. .

The MT6739 will probably replace the MT6735. Both have quad A53 cores but it will mean that the MT6739 will get a Cat 6 upgrade from Cat 4. The MT6739 supports speeds of up to 1.5GHz, 512 KB L2 cache, 1280×720 at 60fps resolution, and video decode to 1080p 30fps with H.264 and 13 megapixel camera. This means it is an entry level SoC for phones that might fit into the $100 price range.

The MT6750 and MT6750T look like twins, only the T version supports full HD 1920×1080 displays. The MT6750 has eight cores, four A53 clocked at 1.5Ghz and four A53 clocked at 1.0GHz and is manufactured on TSMC’s new 28nm High Performance Mobile Computing manufacturing mode. This is the same manufacturing process MediaTek is using for the Helio P10 SoC. The new process allows lower leakage and better overall transistor performance at lower voltage.

The MT6750 SoC supports single channel LPDDR3 666MHz and eMCP up to 4GB. The SoC supports eMMC 5.1, 16 megapixel camera, 1080p 30 fps with both H.264 and H.265 decoding. It comes with an upgraded ARM Mali T860 MP2 GPU with 350 MHz and display support of 1280×720 HD720 ready with 60 FPS. This means the biggest upgrade is the Cat 6 upgrade and it makes sense – most of European and American networks now are demanding a Cat 6 or higher modem that supports carrier aggregation.

This new SOc looks like a slowed down version of Helios P10 and should be popular for entry level Android phones.

Courtesy-Fud

The new Mali GPU can push enough pixels on the local display it is more likely that it is interested in using the technology for streaming.

Many smartphones can record 4K video and this means that smartphones could be a home to high resolution content which can be streamed to a large, high resolution screen.

It looks like Mali DP650can juggle the device’s native resolution and the external display’s own resolution and the variable refresh rates. At least that is what ARM says it can do.

The GPU is naturally able to handle different resolutions but it is optimized for a “2.5K”, which means WQXGA (2560×1600) on tablets and WQHD (2560×1440) on smartphones, but also Full HD (1920×1080) for slightly lower end devices.

Mark Dickinson, general manager, media processing group, ARM said: “The Mali-DP650 display processor will enable mobile screens with multiple composition layers, for graphics and video, at Full HD (1920×1080 pixels) resolutions and beyond while maintaining excellent picture quality and extending battery life,”

“Smartphones and tablets are increasingly becoming content passports, allowing people to securely download content once and carry it to view on whichever screen is most suitable. The ability to stream the best quality content from a mobile device to any screen is an important capability ARM Mali display technology delivers.”

ARM did not say when the Mali-DP650 will be in the shops or which chips will be the first to incorporate its split-display mode feature.

Courtesy-Fud

It is starting to look sales teams for the pair are each trying to show that they can use the technology to reduce the most electricity consumption and production costs.

In its yearly result for 2015, TSMC made an announcement that it is planning to enter mass-production system of chips produced by 16-nano FinFET Compact (FFC) process sometime during 1st quarter of this year. TSMC had finished developing 16-nano FFC process at the end of last year. During the announcement TSMC talked up the fact that its 16-nano FFC process focuses on reducing production cost more than before and implementing low electricity.

TSMC is apparently ready for mass-production of 16-nano FFC process sometime during 1st half of this year and secured Huawei’s affiliate called HiSilicon as its first customer.

HiSilicon’s Kirin 950 that is used for Huawei’s premium Smartphone called Mate 8 is produced by TSMC’s 16-nano FF process. Its A9 Chip, which is used for Apple’s iPhone 6S series, is mass-produced using the 16-nano FinFET Plus (FF+) process that was announced in early 2015. By adding FFC process, TSMC now has three 16-nano processors in action.

Samsung is not far behind it has mass-produced Gen.2 14-nano FinFET using a process called LPP (Low Power Plus). This has 15 per cent lower electricity consumption compared to Gen.1 14-nano process called LPE (Low Power Early).

Samsung Electronics’ 14-nano LPP process was seen in the Exynos 8 OCTA series that is used for Galaxy S7 and Qualcomm’s Snapdragon 820. But Samsung Electronics is also preparing for Gen.3 14-nano FinFET process.

Vice-President Bae Young-chang of Samsung’s LSI Business Department’s Strategy Marketing Team said it will use a process similar to the Gen.2 14-nano process.

Both Samsung and TSMC might have a few problems. It is not clear what the yields of these processes are and this might increase the production costs.

Even if Samsung Electronics and TSMC finish developing 10-nano process at the end of this year and enter mass-production system next year, but they will also have to upgrade their current 14 and 16-nano processes to make them more economic.

Even if 10-nano process is commercialized, there still will be many fabless businesses that will use 14 and 16-nano processes because they are cheaper. While we might see a few flagship phones using the higher priced chips, it might be that we will not see 10nm in the majority of phones for years.

Courtesy-Fud

According to Ars Technica Under the handle “GPUOpen” AMD is releasing a slew of open-source software and tools to give developers of games, heterogeneous applications, and HPC applications deeper access to the GPU and GPU resources.

In a statement AMD said that as a continuation of the strategy it started with Mantle, it is giving even more control of the GPU to developers.

“ As console developers have benefited from low-level access to the GPU, AMD wants to continue to bring this level of access to the PC space.”

The AMD GPUOpen initiative is meant to give developers the ability to use assets they’ve already made for console development. They will have direct access to GPU hardware, as well as access to a large collection of open source effects, tools, libraries and SDKs, which are being made available on GitHub under an MIT open-source license.

AMD wants GPUOpen will enable console-style development for PC games through this open source software initiative. It also includes an end-to-end open source compute infrastructure for cluster-based computing and a new Linux software and driver strategy

All this ties in with AMD’s Boltzmann Initiative and an HSA (Heterogeneous System Architecture) software suite that includes an HCC compiler for C++ development. This was supposed to open the field of programmers who can use HSA. A new HCC C++ compiler was set up to enable developers to more easily use discrete GPU hardware in heterogeneous systems.

It also allows developers to convert CUDA code to portable C++. According to AMD, internal testing shows that in many cases 90 percent or more of CUDA code can be automatically converted into C++ with the final 10 percent converted manually in the widely popular C++ language. An early access program for the “Boltzmann Initiative” tools is planned for Q1 2016.

AMD GPUOpen includes a new Linux driver model and runtime targeted at HPC Cluster-Class Computing. The headless Linux driver is supposed to handle high-performance computing needs with low latency compute dispatch and PCI Express data transfers, peer-to-peer GPU support, Remote Direct Memory Access (RDMA) from InfiniBand that interconnects directly to GPU memory and Large Single Memory Allocation support.

Apparently the fruity cargo cult Apple has already signed up to adopt the technology, which means that the rest of the world’s press will probably notice.

According to the Commercial Times TSMC will have 85,000-100,000 wafers fabricated with the foundry’s in-house developed InFo packaging technology in the second quarter of 2016.

TSMC has disclosed its InFO packaging technology will be ready for mass production in 2016. Company president and co-CEO CC Wei remarked at an October 15 investors meeting that TSMC has completed construction of a new facility in Longtan, northern Taiwan.

TSMC’s InFo technology will be ready for volume production in the second quarter of 2016, according to Wei.

TSMC president and co-CEO Mark Liu disclosed the company is working on the second generation of its InFO technology for several projects on 10nm and 7nm process nodes.

Source-http://www.thegurureview.net/computing-category/tsmc-goes-fan-out-wafers.html

The South Korean electronics giant is only the latest tech firm to make a somewhat belated push into the carmaker industry, as vehicle computer systems and sensors become more sophisticated.

In October, General Motors announced a strategic partnership with South Korea’s LG Electronics. LG will supply a majority of the key components for GM’s upcoming electric vehicle (EV), the Chevrolet Bolt. LG has also been building computer modules for GM’s OnStar telecommunications system for years.

Apple and Google have also developed APIs that are slowly being embedded by automakers to allow smartphones to natively connect and display their infotainment screens. Those APIs led to the rollout in several vehicles this year of Apple’s CarPlay and Android Auto.

Having formerly balked at the automotive electronics market as too small, consumer computer chipmakers are now entering the space with fervor.

Dutch semiconductor maker NXP is closing an $11.8 billion deal to buy Austin-based Freescale, which makes automotive microprocessors. The combined companies would displace Japan’s Renesas as the world’s largest vehicle chipmaker.

German semiconductor maker Infineon Technology has reportedly begun talks to buy a stake in Renesas.

Adding to growth in automotive electronics are regulations mandating technology such as backup cameras in the U.S. and “eCalling” in Europe, which automatically dials emergency services in case of an accident.

According to a report published by Thomson Reuters, Samsung and its tech affiliates are ramping up research and development for auto technology, with two-thirds of their combined 1,804 U.S. patent filings since 2010 related to electric vehicles and electric components for cars.

The combined automotive software, services and components market is worth around $500 billion, according to ABI Resarch.

Source-http://www.thegurureview.net/consumer-category/samsung-announces-entry-into-auto-industry.html