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Intel’s Haswell Goes 13W
Intel’s Haswell Y-series processors as we said a few weeks ago have yet launch. The current plan is to launch two Ivy SKUs in Q1 2013, both dual-cores, and later in 2013 Intel plans to replace them with Haswell Y series parts, with even lower TDP.
The faster one is called Core i7 3689Y and has two cores and two threads, as well as a base clock of 1.5GHz. With the help of Intel Turbo Boost 2.0, the top single-core turbo clock is an impressive 2.6GHz, while the maximum dual-core turbo clock stops at 2.4GHz, which is still impressive. This core comes with Intel HD graphics 4000 clocked between 350MHz and 860MHz with turbo.
This new core supports both DDR3 and DDR3L at 1600MHz, has 4MB of cache and impressively low 13W TDP. We have explained that SDP stands for Standard Dissipation Power and Intel expect it to be at 7W for this part.
The runner up is called Core i5 3439Y and has the same two cores and two threads with 1.5GHz base clock, but the single core turbo clock stops at 2.3GHz, while the dual-core top clock is 2.10GHz. The graphics speed, TDP and memory support remain the same, but there is a difference in cache size. Core i5 3439Y comes with 3MB instead of 4MB for Core i7 Y series 3689Y part.
Toyota Goes Wireless Charging
January 2, 2013 by admin
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Toyota is taking the smartphone boom quite seriously and the car-maker hopes to offer the first wireless charging systems in select models as early as next year.
Toyota’s wireless system will be compatible with the Qi standard and it will be introduced in the new Avalon sedan next year. Of course, it will be optional and it will be part of Toyota’s $1,950 “technology package” which includes other geeky goodies as well.
According to the BBC, Chrysler is also planning to offer a similar system in the Dodge Dart. Other car-makers will no doubt offer wireless charging functionality sooner rather than later.
The number of Qi compatible phones is limited for the time being. Just 34 phones support it, including the Lumia 920, Nexus 4 and HTC Windows Phone 8X. However, some very popular devices like Apple’s iPhone and Sammy’s Galaxy S series phones don’t support wireless charging just yet.
nVidia’s Tegra 4 Specs Spotted
Here is an interesting leak, just what the doctor ordered to spice up a rather slow news cycle. Chiphell has posted a slide containing a few Tegra 4 specs, but we still don’t know the clocks or a few other interesting details. Of course, the leak should be taken with a grain of salt, but the specs are more or less in line with what we were expecting all along.
Tegra 4, codenamed Wayne, is a 28nm part with revamped graphics and new ARM cores. Although the slide does not directly point to the type of ARM cores used in the design, the new chip is based on ARM’s latest A15 core. Like the Tegra 3, the new chip will also feature an additional companion core to improve energy efficiency. No surprises here really.
In terms of GPU performance, Nvidia promises to deliver a six-fold improvement over the Tegra 3 and a 20x improvement over Tegra 2 chips. Oddly enough, in spite of Nvidia’s graphics prowess, Tegra chips never featured world-beating graphics. This time around they could, thanks to the new 72-core GPU. The GPU will be able to cope with 2560×1600 screens at 120Hz, but it could also take on 4K resolutions, although details are still sketchy. At this point 4K support could only be relevant for next-generation smart TVs, with a huge price tag.
As far as other features go, Tegra 4 brings support for USB 3.0 and DDR3L dual-channel memory. The leak does not mention LTE support.
Tegra 4 will have to take on the likes of Samsung’s upcoming Exynos 5440, which should also debut in early 2013. Nvidia was first to market with a quad-core A9 chip, but this time around it will have to face off against the new Exynos and A15 quad-cores from other vendors.
Nvidia is expected to showcase the new chip at CES and we’ll be there to check it out.
AMD Offers More Radeon Chips
AMD has announced four Radeon HD 8000M series GPU chips sporting its latest Graphics Core Next (GCN) architecture.
AMD’s GCN architecture made its first appearance in the firm’s ultra high-end mobile chips, however next month’s CES show will see the firm show off laptops featuring four Radeon HD 8000M series chips. The firm’s four Radeon HD 8000M chips are pitched at the mainstream and gaming laptop markets, though the company said that Asus already has a laptop announced that will use the chips in an ‘ultrathin’ design.
AMD’s Radeon HD 8000M series sees the firm split three chips with the same number of stream processors and memory clock speeds that scale up to 1.25GHz but differentiated by their core speeds. The firm’s Radeon HD 8500M, Radeon HD 8600M and Radeon HD 8700M all have 384 stream processors but are clocked up to 650MHz, 775MHz and between 650MHz and 850MHz, respectively.
Topping AMD’s present range is the Radeon HD 8800M, which has 640 stream processors and is clocked at between 650MHz and 700MHz, while its GDDR5 memory is also clocked at 1.25GHz. All of the firm’s chips, by virtue of being based on the GCN architecture, support DirectX 11.1.
AMD said it will launch three more chips in the Radeon HD 8000M series in the second quarter of 2013. According to the firm’s roadmap, two of those chips will sit above the Radeon HD 8800M in terms of performance while the third will straddle somewhere between the Radeon HD 8600M and Radeon HD 8700M.
AMD was tight-lipped on the power figures for its chips, saying that full details of its Radeon HD 8000M series chips will appear at CES, where its partners will tip up with laptops sporting the chips.
Intel Details 22nm SoC
Thanks to a long spate of bad luck over at AMD, Intel now finds itself in a rather safe market lead, at least in high-end and server markets. However, in the low-end and mobile, Intel has a lot of catching up to do.
ARM still dominates the mobile market and Intel is looking to take on the British chip designer with new 22nm SoCs of its own. Intel outlined its SoC strategy at the 2012 International Electron Devices Meeting in San Francisco the other day.
The cunning plan involves 3D tri gate transistors and Intel’s 22nm fabrication process, or in other words it is a brute force approach. Intel can afford to integrate the latest tech in cheep and cheerful 22nm Atoms, thus making them more competitive in terms of power efficiency.
Since Intel leads the way with new manufacturing processes it already has roughly a year of experience with 22nm chips, while ARM partners rely on 28nm, 32nm and more often than not, 40nm processes. Intel’s next generation SoCs will also benefit from other off-the-shelf Intel tech, such as 3D tri-gate transistors.
Will Lenovo Go Public In 2K14?
Lenovo’s parent firm Legend Holdings could float an initial public offering (IPO) as soon as 2014, according to the firm’s chairman.
Liu Chuanzhi, chairman of Legend Holdings told China Business News that the firm plans to list on the China A-share market between 2014 and 2016. Chuanzhi also reportedly said the company will invest $3.2bn by 2014 to develop its various businesses.
Legend Holdings is 36 percent owned by the Chinese state controlled Academy of Sciences, with a further 20 percent owned by the private investment firm China Oceanwide Holdings Group.
Legend Holdings also has venture capital and real estate interests outside of Lenovo Group. The firm’s system building operations however have gone from strength to strength since it bought IBM’s PC business back in 2005, and it is now heavily promoting its Yoga tablet-laptop hybrid device.
Earlier this year Gartner reported that Lenovo had overtaken HP to become the largest PC vendor, something that HP disputed by offering IDC’s figures. Regardless of HP’s protestations then, Lenovo is set to overtake HP as its PC business continues to grow while HP’s has been shrinking for some time.
Legend Holdings might want to cash in on Lenovo’s high flying status and a cash injection from an IPO could help the company invest in designing products for the smartphone and tablet markets.
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Motorola To Close More Locations
December 19, 2012 by admin
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Motorola Mobility will shut down most operations in South Korea in 2013 as part of an ongoing restructuring under Google ownership.
The decision is estimated to displace about 500 jobs in South Korea and follows a decision made a month ago to close down most international Motorola websites and to lay off about 4,000 workers.
Motorola Mobility said in a statement that it began telling staff in South Korea on Monday about “plans to close most of our operations in Korea, including our research and development and consumer mobile device marketing organization.”
The statement said the changes “reflect our plans to consolidate our global R&D efforts to foster collaboration, and to focus more attention on markets where we are best positioned to compete effectively.”
TSMC To Boost 28nm Production
TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.
TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.
But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.
WD Going 5TB Next Year
According to Russian website Almodi.org that managed to snag some screenshots of WD’s plans for the next year, it appears that Western Digital wants to bring 5TB drives in both its Green ant the Red Series in Q4 2013.
In addition to the 5TB WD50EFRX Red series and the WD50EZRX in the Green series, the Q3 2013 will also bring 4TB drives in both series. Of course, we are talking about 3.5-inch drives that will feature 64MB of cache and SATA 6Gbps interface.
The slides also do not reveal any info regarding standard 3.5-inch Blue series and 2.5-inch Scorpio line of drives. As you may remember, WD has recently announced a 4TB version in its Black series lineup so 5TB one might come sooner than in the Green or WD Red NAS line.
AMD Shows Piledriver Opteron
AMD’s Piledriver rollout is all but complete. With Trinity in the mobile and desktop space, new 3300 and 4300 Opterons are bringing the new architecture to data centers.
The Opteron 4300 series offers six different parts, in quad-, six- and eight-core flavours. Stock clocks range between 2.2GHz and 3.5GHz, with TDP’s in the 35W to 95W range. The cheapest Opteron 4334 costs $191, while the priciest 4332HE comes in at $501. The 3300 series consists of three quad- and eight-core SKUs, priced at $125 to $229. The pricing of both series is pretty aggressive.
But what’s next for AMD? Well things should be eerily quiet on the server front in 2013. Abu Dhabi, Seoul and Delhi/Orochi C should last throughout 2013 and even a good part of 2014. That’s when we can expect some major changes, as AMD transitions to 28nm and goes about transforming its Opteron lineup.
Future Low Power CPUs and APUs (as AMD calls them) should replace Dehli/Orochi-C in 1P and dense server markets, but AMD is also planning “Client APUs for market enablement,” and this sounds a lot like ARM-based low voltage parts. Of course, in the high end AMD plans to stick with big Steamroller cores, but mid-2014 is a long way off.