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Intel Talks More About Skylake
A new Intel roadmap suggests the first Broadwell LGA parts will launch in Q2, while Skylake-S parts will come in Q3.
The roadmap was published by PC Online and points to two Broadwell LGA launches this quarter – the Core i7-5775C and Core i5-5675C. These two parts will be joined by a total of four Skylake-S products in Q3, the Core i7-6700K, Core i7-6700, Core i5-6600K, Core i5-6600 and the Core i5-6500.
Both Skylake-S and Broadwell LGA will replace the current crop of Haswell parts, including Devil’s Canyon products. However, Broadwell LGA sits one tier above Skylake-S and Haswell-based products.
Starting in Q4, we should see more Broadwell LGA parts, but we don’t have any names yet. In the first quarter of 2016, we can also expect new Skylake-S parts.
Speaking of 2016, Intel plans to unleash the Broadwell-E in the first quarter of 2016. Little is known about Broadwell-E, but the new 14nm flagship is expected to sport eight cores. Clocks remain unknown, although the 14nm node promises substantial gains.
Will Intel Release Skylake This Year?
Intel has confirmed that it will release Core M processors this year based on its new Skylake chip design.
Intel CEO Brian Krzanich said at the Goldman Sachs Technology and Internet conference that the the new Core M chips are due in the second half of the year and will also extend battery life in tablets, hybrids, and laptop PCs.
The new chips will mean much thinner tablets and mobile PCs which will make Apple’s Air look decidedly portly. Intel’s Core M chips, introduced last year, are based on the Broadwell but the Skylake chips should also improve graphics and general application performance.
The Skylake chips will be able to run Windows 10, as well as Google’s Chrome and Android OSes, Krzanich said. But most existing Core M systems run Windows 8.1, and Intel has said device makers haven’t shown a lot of interest in other OSes. So most Skylake devices will probably run Windows 10. Chipzilla is expected to give more details about the new Core M chips in June at the Computex trade show in Taipei.
Skylake systems will also support the second generation of Intel’s RealSense 3D camera technology, which uses a depth sensor to create 3D scans of objects, and which can also be used for gesture and facial recognition. The hope is that the combination of Skylake and a new Windows operating system will give the PC industry a much needed boost.
In related news, Intel announced that socketed Broadwell processors will be available in time for Windows 10.
Intel Investing Big In Isreal
Intel is investing a further $550 million in Israel, more specifically in the upgrade of its Fab 28 in Kiryat Gat.
According to Israel21c, this will bring the total scope of Intel investments in Israel to over $6 billion since 2006. The Kiryat Gat facility is likely to be one of the first Intel 10nm fabs.
Israeli Ministry of Economy official Ziva Eger said the investment will help create thousands of jobs and reinforce the country’s standing as a world leader in technology.
“The agreement signed today between the Industrial Cooperation Authority and Intel is another expression of Intel’s contribution by way of its purchase of equipment, new technologies and Israeli products developed together with Intel,” said CEO of Intel Israel Maxine Fassberg.
Fab 28 currently churns out 22nm silicon for Intel. The fab was passed over for the 14nm upgrade. A source familiar with the matter told us that Israel competes with Ireland for every node upgrade.
“We lost 14nm to Ireland and won 10nm,” the source said.
Israel is currently in a better position to offer incentives and subsidies for such investments, as Ireland’s ‘business-friendly’ tax policies are being scrutinized by the European Union.
Intel is expected to launch the first 10nm CPU in 2016, followed by 7nm parts a couple of years later.
Intel To Add Broadwell To NUC Series
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Intel is planning to update its rather successful NUC (Next Unit of Computing) series and as you can expect, they will come with Broadwell CPUs inside.
Intel isn’t hiding the external design of the new cases and there is a dominant yellow connector at the front of the new NUC, and this one should be providing charging power even when the device is turned off.
The board comes with either M2 storage or single SATA and there will be two different designs one exclusively for M2 drive and the second taller that will be able to take 2.5 inch SSD or HDD as well.
We will probably learn more details at CES 2015 that is about to start in less than three weeks from now, but the Broadwell in this small form factor will get a speed boost and some future prove technologies such as M2 SSD support.
We are running Core i5 4200 powered NUC with Windows 10 and it really works great powered by 240GB Kingston mS200 mSata SSD and Impact SO DIMM memory. These machines takes less than half an hour to assemble and boot into windows, including Windows 10 and make a perfect choice for the lovers of quiet computing.
The new version will obviously run at least slightly faster than the one we are testing and the marketing is excluding about “the one with the yellow USB connector”.
Can Intel Go Wireless?
July 17, 2014 by admin
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Intel wants to lead the drive into a less wired world by pushing standards, drive down the cost, and make these technologies ubiquitous.
At Computex, Intel demonstrated WiGig wireless docking and simultaneous wireless charging of a laptop, smartphone, headset and tablet with a pad placed under a tabletop. The company said that it would deliver reference designs for systems that use the technology in 2016 as part of a future Core processor family known as Skylake.
WiGig trades range for speed and operates in the 60GHz spectrum, compared with 2.4- and 5.0GHz for WiFi. It can transfer data at speeds of up to 7Gbps, compared to a maximum speed of a little more than 1Gbps for 802.11ac.
WiGig can be used to stream video from a mobile device to a TV or monitor, replacing HDMI and DisplayPort cables, but is being seen as a way of carrying out networking and wireless docking. It means that you can put your laptop on your desk and it automatically connects with your monitor, keyboard and mouse, printer and other peripherals without cables.
Intel plans to make its own WiGig chips. The outfit said it will have silicon for both transmitters and receivers in production by the end of this year, and available in products in the first half of 2015. Intel also wants to push Rezence for wireless charging.
Chipzilla has added that it will contribute some of its own IP to expand the standard to support wireless charging of laptops (which requires at least 20 watts) and that Rezence will be part of a Skylake reference design by 2016. This means that the world could be wirelessly networked soon after that.
Hitachi Bringing New Xeon Servers To Market
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Hitachi Data Systems announced that it will expand its family of blade and rack server products for the enterprise market. The forthcoming Hitachi Compute Systems will be based on the new Intel Xeon processor E5-2600 family.
Roberto Basilio, vice president, Infrastructure Platforms Product Management, Hitachi Data Systems said that by leveraging the new Intel Xeon processor E5 family, upcoming Hitachi Compute Systems will feature faster performance, higher density and greater energy efficiency. The servers are being designed for converged data centres. They come pre-configured and optimised for leading applications such as Microsoft Exchange 2010, SAP HANA and solutions with VMware.
He said that the Intel Xeon processor E5-2600 product family provides exceptional energy efficiency, increased security, flexible performance and the opportunity for streamlining customer’s data centres. The current range of Hitachi Compute Systems consists of two blade server product lines, Hitachi Compute Blade 2000 and Hitachi Compute Blade 320, both of which are intended for high performance, high availability applications. The portfolio also includes a family of rack-optimised servers, Hitachi Compute Rack, that are the foundation for dedicated, packaged solutions such as the company’s award-winning object store, Hitachi Content Platform (HCP).
Is Intel Ready For The USB 3.0 Standard?
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The USB Implementers Forum has ruled that the Ivy Bridge 7 Series Chipset and other Intel chipsets have achieved USB 3.0 certification. USB 3.0 delivers up to 10 times the data transfer rate of USB 2.0, as well as improved power efficiency. Intel’s Ivy Bridge will ship in Windows PCs in the April and will be the first to have USB 3.0 as a standard feature for the first time. USB 3.0 has been seen on laptops and desktops from AMD or NEC.
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Intel Gives Details On Their Xeon E5 Processors
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Intel finally gave more details at the supercomputing conference SC2011 about its upcoming Xeon E5 processors and been showing off its Knights Corner many integrated core (MIC) solution.
We don’t expect to see the new Xeons until the first half of 2012, but Intel has has been shipping the new chips to “a small number of cloud and HPC customers” since September. The E5 family has the same core as the 3960X which Intel launched this week. So far though Intel does not seem to be keen to ramp up any mass production. Some of this might have something to do with problems in production which were rumoured earlier this year. However early benchmarks indicate that it could be a winner.
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Gigabyte Debuts New Motherboards
July 14, 2011 by admin
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Gigabyte just announced their new slate of motherboards that will support AMD’s A75 series chipsets and the latest AMD A-Series APUs or Llano. The new A75 based motherboards are said to offer DIY PC builders and developers a higher level of 3D and multimedia performance that is scalable and said to offer the best value upgrade path imaginable.
Gigabyte’s VP of Service and Marketing Henry Kao is quoted as saying that the new boards were new and exciting as AMD new APU’s were “ground breaking” APU technology. As well as bringing AMD A-Series technology to DIY users who demand excellent gaming and multimedia performance on a budget, these motherboards also offer a compelling upgrade path that includes Dual Graphics configurations.
The A75 motherboards from Gigabyte feature an AMD A75 ‘Hudson’ chipset supporting the latest 32 nanometer AMD A-Series APUs. That said, these chips are the first ever to combine a DX11-capable, high performance graphics processor with the option of a dual or quad core CPU on one silicon die, offering a 3D gaming and multimedia experience which is similar to a discrete graphics configuration.
Intel’s 22nm MIC To Debut Soon
Word on the street is that Intel may debut their first Many Integrated Core (MIC) using its upcoming 22nm process technology and expects to have more than 100 developer sites for MIC by the end of 2011.
Intel’s MIC micro-architecture is expected to be used for highly parallel applications in the high end computing arena such as scientific exploration and research and weather modelling. Just like its competitors such as AMD’s FireStream or Nvidia’s Tesla, Intel is not fond of MIC replacing processors.
During his keynote at the Intel Developer Forum (IDF) Intel’s Kirk Skaugen, VP of Architecture and GM said that compatibility with x86 will give MIC certain advantages. Kirk also went on to say that MIC would act like a co-processor where you can use the same compilers, the same tools, and the same VTunesthat power.