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AMD’s Carrizo Coming In The Second Quarter
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AMD released its earnings today and one cool question came up about the upcoming Carrizo mobile APU.
Lisa SU, the new AMD President and CEO, told MKM Partners analyst Ian Ing that Carrizo is coming in Q2 2015.
This is a great news and AMD’s Senior VP and outgoing general manager of computing and graphics group John Byrne already shared a few details about his excitement about Carrizo.
There are two Carrizo parts, one for big notebooks and All in Ones called Carrizo and a scaled down version called Carrizo L. We expect that the slower Carrizo-L is first to come but, Lisa was not specific. Carrizo-L is based on Puma+ CPU cores with AMD Radeon R-Series GCN graphics is intended for mainstream configurations with Carrizo targeting the higher performance notebooks.
Usually when a company says that something is coming in Q2 2015 that points to a Computex launch and this Taipei based tradeshow starts on June 2 2015. We strongly believe that the first Carrizo products will showcased at or around this date.
Lisa also pointed out that AMD has “significantly improved performance in battery life in Carrizo.” This is definitely good news, as this was one of the main issues with AMD APUs in the notebook space.
Lisa also said that AMD expects Carrizo to be beneficial for embedded and other businesses as well. If only it could have come a bit earlier, so let’s hope AMD can get enough significant design wins with Carrizo. AMD has a lot of work to do in order to get its products faster to market, to catch up with Intel on power and performance or simply to come up with innovative devices that will define its future. This is what we think Lisa is there for but in chip design, it simply takes time.
AMD’s Fiji GPU Goes High Bandwidth
New evidence coming from two LinkedIn profiles of AMD employees suggest that AMD’s upcoming Radeon R9 380X graphics card which is expected to be based on the Fiji GPU will actually use High-Bandwidth Memory.
Spotted by a member of 3D Center forums, the two LinkedIn profiles mention both the R9 380X by name as well as describe it as the world’s firts 300W 2.5D discrete GPU SoC using stacked die High-Bandwidth Memory and silicon interposer. While the source of the leak is quite strange, these are more reliable than just rumors.
The first in line is the profile of Ilana Shternshain, an ASIC Physical Design Engineer, which has been behind the Playstation 4 SoC, Radeon R9 290X and R9 380X, which is described as the “largest in ‘King of the hill’ line of products.”
The second LinkedIn profile is the one from AMD’s System Architect Manager, Linglan Zhang, which was involved in developing “the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.”
Earlier rumors suggest that AMD might launch the new graphics cards early this year as the company is under heavy pressure from Nvidia’s recently released, as well as the upcoming, Maxwell-based graphics cards.
Samsung Finally Starts 14nm FinFET
A company insider has spilled the beans in Korea, claiming that Samsung has started Apple A9 production in 14nm FinFET.
The A9 is the next generation SoC for Apple iPhone and iPad products and it is manufactured on the Samsung – GlobalFoundries 14nm FinFET manufacturing process. In the other news, Samsung’s Ki-nam, president of the company’s semiconductor business and head of System LSI business has confirmed that the company started production of 14-nanometre FinFET chips.
The report mentions Austin as a possible site for Apple products but we wonder if the GlobalFoundries Fab 8 in New York State could become one of the partners for the 14nm FinFET manufacturing. Samsung didn’t officially reveal the client for the 14nm FinFET, but Apple is the most obvious candidate, while we expect to see 14 / 16nm FinFET graphics chips from AMD and Nvidia but most likely in the latter half of 2015 at best.
Qualcomm is likely to announce new LTE modem based on 14nm FinFET and the flagship SoC Snapdragon 810 is a 20nm chip. Qualcomm is manufacturing its 810 chips as we speak to meet demand for flagship Android phones coming in Q1 2015. Flagship Samsung, HTC and LG phones among others are likely to use Snapdragon 810 as a replacement for this year’s Snapdragon 801, a high end chip that ended up in millions of high-end phones.
Samsung / GlobalFoundries14nm FinFET process is 15 percent smaller, 20 percent faster, and 35 percent more power efficient compared to 20nm processors. This definitely sounds exiting and will bring more performance into phones, tablets, GPUs and will significantly decrease power consumption. The move from 28nm is long overdue.
We believe that Qualcomm’s LTE modem might be the first chip to officially come with this manufacturing process and Apple will probably take most of the 14nm production for an update in its tablets and phones scheduled for 2015.
MediaTek Cuts Xiaomi
The dark satanic rumour mill manufactured a hell on earth rumour that MediaTek has stopped supplying chips to Xiaomi.
MediaTek is apparently cross that Xiaomi has been investing in SoC supplier Leadcore Technology. Xiaomi has reportedly reached a deal with Leadcore allowing the phone maker to get access to the chip designer’s technology patents. DigiTimes however suggests that MediaTek has been trying to expand its presence in the mid-range and high-end market segments, but finds Xiaomi’s pricing strategy is disrupting its plans.
MediaTek’s MT6589T, a quad-core 1.5GHz chip, was originally designed to target mid-range and high-end mobile devices. The solution was introduced in Xiaomi’s Redmi smartphone in August 2013. However, prices for the Redmi series have been cut to as low as $114.
Xiaomi is ranked as the third largest smartphone vendor worldwide in the third quarter of 2014. Xiaomi’s shipments for the quarter registered a 211.3 per cent on-year jump boosting its market share to 5.3 per cent from 2.1 per cent during the same period of 2013.
Samsung Moves To Block nVidia
Samsung has moved to try and block the sales of Nvidia chips in the US.
Samsung has filed a complaint with the U.S. International Trade Commission as part of patent war which appears to have broken out between the two chipmakers. Samsung claims Nvidia infringed several of its chip-related patents and for making false claims about its products. This is effectively counter-suing after Nvidia filed a suit against the company in September making more or less the same charges.
Nvidia accused Samsung and rival Qualcomm of infringing patents on its graphics-processing unit (GPU). Samsung, which had filed the lawsuit in a US federal court on November 4, is seeking damages for deliberate infringement of several technical patents, including a few that govern the way semiconductors buffer and use data.
The ITC complaint also named computer-parts manufacturers Biostar Microtech and Elitegroup. These things run and run and usually wind up with a settlement where both sides agree to keep the details quiet. The ITC is often used as leverage in such cases because it deals with things a little quicker and a product embargo to the US can be seriously damage a company’s wealth.
Will The Chip Industry Take Fall?
Microchip Technology has managed to scare Wall Street by warning of an industry downturn. This follows rumours that a number of US semiconductor makers with global operations are reducing demand for chips in regions ranging from Asia to Europe.
Microchip Chief Executive Steve Sanghi warned that the correction will spread more broadly across the industry in the near future. Microchip expects to report sales of $546.2 million for its fiscal second quarter ending in September. The company had earlier forecast revenue in a range of $560 million to $575.9 million. Semiconductor companies’ shares are volatile at the best of times and news like this is the sort of thing that investors do not want to hear.
Trading in Intel, whiich is due to report third quarter results tomorrow, was 2.6 times the usual volume. Micron, which makes dynamic random access memory, or DRAM, was the third-most traded name in the options market. All this seems to suggest that the market is a bit spooked and much will depend on what Chipzilla tells the world tomorrow as to whether it goes into a nosedive.
MediaTek Goes IoT
SoC designer MediaTek has launched a new push to develop technologies used in wearables and Internet-of-Things (IoT) devices.
Dubbed MediaTek Labs, the new organisation will offer tools for developers such as software and hardware development kits (SDKs and HDKs), but it will also offer other forms of support, i.e. tech support and marketing.
MediaTek LinkIt dev platform
The MediaTek LinkIt platform promises to offer a full-service approach for developers keen to enter the space. It allows developers familiar with MediaTek’s Arduino implementation to quickly migrate to the new platform
For the time being the platform is limited to the MediaTek Aster MT2502A processor. The company says it is the world’s smallest commercially available SoC. The chip can work with MediaTek’s WiFi and GPS companion chipsets.
The company is calling on developers to join the MediaTek Labs initiative and in case you are interested you can check out the details on the new MediaTek Labs website.
MediaTek Aster spec
Now for some juicy hardware. The Aster MT2502A is an ARM7 EJ-S part clocked at 260MHz. The dev board features 4MB of RAM and 16MB of flash. GPS and WiFi capability can be added using the MT3332 and MT5931 chips. The platform supports microSD, Bluetooth (including BLE), along with GSM and GPRS communications.
The Aster is clearly not an SoC for feature packed wearables with high resolution screens, but it could be used in more down to earth applications such as fitness trackers.
MediaTek says it will offer three platforms based on two wearable solutions. The One Application Use (OAU) platform is for fitness trackers and simple Bluetooth devices. The Simple Application Platform (SAU) is intended for smart watches, wristbands and more elaborate fitness trackers.
SAU is the focus segment for the Aster chipset and it should offer 5 to 7 days of battery life.
MediaTek Rich Application Platform
The Rich Application Platform (RAU) is for Android Wear and it will offer a lot more functionality out of the box, including camera support, 3D graphics, as well as Bluetooth, WiFi and GPS in the same package.
This platform sounds a bit more interesting, but details are sketchy. For some reason many media outlets erroneously described the first Aster chip as MediaTek’s only smartwatch chip, but it is clearly not intended for the Rich Application Platform.
We have yet to see what sort of silicon MediaTek can conjure up for high-end wearables, but this is what it has in mind. The platform is designed for high-end smartwatches and glasses. It will feature multicore processors clocked at 1GHz or more. The platform also includes Bluetooth, GSM/GPRS, GPS, WiFi, sensors and a proper TFT screen. Battery life is described as short, two to three days, which sounds a bit better than what the current generation of smartwatches can deliver.
nVidia Finally Goes 20nm
For much of the year we were under the impression that the second generation Maxwell will end up as a 20nm chip.
First-generation Maxwell ended up being branded as Geforce GTX 750 and GTX 750 TI and the second generation Maxwell launched a few days ago as the GTX 980 and Geforce GTX 970, with both cards based on the 28nm GM204 GPU.
This is actually quite good news as it turns out that Nvidia managed to optimize power and performance of the chip and make it one of the most efficient chips manufactured in 28nm.
Nvidia 20nm chips coming in 2015
Still, people keep asking about the transition to 20nm and it turns out that the first 20nm chip from Nvidia in 20nm will be a mobile SoC.
The first Nvidia 20nm chip will be a mobile part, most likely Erista a successor of Parker (Tegra K1).
Our sources didn’t mention the exact codename, but it turns out that Nvidia wants to launch a mobile chip first and then it plans to expand into 20nm with graphics.
Unfortunately we don’t have any specifics to report.
AMD 20nm SoC in 2015
AMD is doing the same thing as its first 20nm chip, codenamed Nolan, is an entry level APU targeting tablet and detachable markets.
There is a strong possibility that Apple and Qualcomm simply bought a lot of 20nm capacity for their mobile modem chips and what was left was simply too expensive to make economic sense for big GPUs.
20nm will drive the voltage down while it will allow higher clocks, more transistors per square millimeter and it will overall enable better chips.
Just remember Nvidia world’s first quad-core Tegra 3 in 40nm was rather hot and making a quad core in 28nm enabled higher performance and significantly better battery life. The same was true of other mobile chips of the era.
We expect similar leap from going down to 20nm in 2015 and Erista might be the first chip to make it to 20nm. A Maxwell derived architecture 20nm will deliver even more efficiency. Needless to say AMD plans to launch 20nm GPUs next year as well.
It looks like Nvidia’s 16nm FinFET Parker processor, based on the Denver CPU architecture and Maxwell graphics won’t appear before 2016.
AMD’s Carrizo Goes Mobile Only
AMD’s upcoming Carrizo APU might not make it to the desktop market at all.
According to Italian tech site bitsandchips.it, citing industry sources, AMD plans to limit Carrizo to mobile parts. Furthermore the source claims Carrizo will not support DDR4 memory. We cannot confirm or deny the report at this time.
If the rumours turn out to be true, AMD will not have a new desktop platform next year. Bear in mind that Intel is doing the exact same thing by bringing 14nm silicon to mobile rather than desktop. AMD’s roadmap previously pointed to a desktop Carrizo launch in 2015.
AMD’s FM2+ socket and Kaveri derivatives would have to hold the line until 2016. The same goes for the AM3+ platform, which should also last until 2016.
Not much is known about Carrizo at the moment, hence we are not in a position to say much about the latest rumours. AMD’s first 20nm APU will be Nolan, but Carrizo will be the first 20nm big core. AMD confirmed a number of delays in a roadmap leaked last August.
The company recently confirmed its first 20nm products are coming next year. In all likelihood AMD will be selling 32nm, 28nm and 20nm parts next year.
ARM Launches Juno
ARM has announced two programs to assist Android’s ascent into the 64-bit architecture market.
The first of those is Linaro, a port of the Android Open Source Project to the 64-bit ARMv8-A architecture. ARM said the port was done on a development board codenamed “Juno”, which is the second initiative to help Android reach the 64-bit market.
The Juno hardware development platform includes a system on chip (SoC) powered by a quad-core ARM Cortex-A53 CPU and dual-core ARM Cortex-A57 CPU in an ARM big.little processing configuration.
Juno is said to be an “open, vendor neutral ARMv8 development platform” that will also feature an ARM Mali-T624 graphics processor.
Alongside the news of the 64-bit initiatives, ARM also announced that Actions Semiconductor of China signed a license agreement for the 64-bit ARM Cortex-A50 processor family.
“Actions provides SoC solutions for portable consumer electronics,” ARM said. “With this IP license, Actions will develop 64-bit SoC solutions targeting the tablet and over-the-counter (OTT) set top box markets.”
The announcements from ARM come at an appropriate time, as it was only last week that Google announced the latest version of its Android mobile operating system, Android L, which comes with support for 64-bit processors. ARM’s latest developments mean that Android developers are likely to take advantage of them in the push to take Android to the 64-bit market.
Despite speculation that it would launch as Android 5.0 Lollipop, Google outed its next software iteration on Wednesday last week as simply Android L, touting the oddly-named iteration as “the largest update to the operating system yet”.