The new Mali GPU can push enough pixels on the local display it is more likely that it is interested in using the technology for streaming.

Many smartphones can record 4K video and this means that smartphones could be a home to high resolution content which can be streamed to a large, high resolution screen.

It looks like Mali DP650can juggle the device’s native resolution and the external display’s own resolution and the variable refresh rates. At least that is what ARM says it can do.

The GPU is naturally able to handle different resolutions but it is optimized for a “2.5K”, which means WQXGA (2560×1600) on tablets and WQHD (2560×1440) on smartphones, but also Full HD (1920×1080) for slightly lower end devices.

Mark Dickinson, general manager, media processing group, ARM said: “The Mali-DP650 display processor will enable mobile screens with multiple composition layers, for graphics and video, at Full HD (1920×1080 pixels) resolutions and beyond while maintaining excellent picture quality and extending battery life,”

“Smartphones and tablets are increasingly becoming content passports, allowing people to securely download content once and carry it to view on whichever screen is most suitable. The ability to stream the best quality content from a mobile device to any screen is an important capability ARM Mali display technology delivers.”

ARM did not say when the Mali-DP650 will be in the shops or which chips will be the first to incorporate its split-display mode feature.

Courtesy-Fud

It is starting to look sales teams for the pair are each trying to show that they can use the technology to reduce the most electricity consumption and production costs.

In its yearly result for 2015, TSMC made an announcement that it is planning to enter mass-production system of chips produced by 16-nano FinFET Compact (FFC) process sometime during 1st quarter of this year. TSMC had finished developing 16-nano FFC process at the end of last year. During the announcement TSMC talked up the fact that its 16-nano FFC process focuses on reducing production cost more than before and implementing low electricity.

TSMC is apparently ready for mass-production of 16-nano FFC process sometime during 1st half of this year and secured Huawei’s affiliate called HiSilicon as its first customer.

HiSilicon’s Kirin 950 that is used for Huawei’s premium Smartphone called Mate 8 is produced by TSMC’s 16-nano FF process. Its A9 Chip, which is used for Apple’s iPhone 6S series, is mass-produced using the 16-nano FinFET Plus (FF+) process that was announced in early 2015. By adding FFC process, TSMC now has three 16-nano processors in action.

Samsung is not far behind it has mass-produced Gen.2 14-nano FinFET using a process called LPP (Low Power Plus). This has 15 per cent lower electricity consumption compared to Gen.1 14-nano process called LPE (Low Power Early).

Samsung Electronics’ 14-nano LPP process was seen in the Exynos 8 OCTA series that is used for Galaxy S7 and Qualcomm’s Snapdragon 820. But Samsung Electronics is also preparing for Gen.3 14-nano FinFET process.

Vice-President Bae Young-chang of Samsung’s LSI Business Department’s Strategy Marketing Team said it will use a process similar to the Gen.2 14-nano process.

Both Samsung and TSMC might have a few problems. It is not clear what the yields of these processes are and this might increase the production costs.

Even if Samsung Electronics and TSMC finish developing 10-nano process at the end of this year and enter mass-production system next year, but they will also have to upgrade their current 14 and 16-nano processes to make them more economic.

Even if 10-nano process is commercialized, there still will be many fabless businesses that will use 14 and 16-nano processes because they are cheaper. While we might see a few flagship phones using the higher priced chips, it might be that we will not see 10nm in the majority of phones for years.

Courtesy-Fud

Samsung’s new HBM solution will be used in high-performance computing (HPC), advanced graphics, network systems and enterprise servers, and is said to offer DRAM performance that is “seven times faster than the current DRAM performance limit”.

This will apparently allow faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.

“By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies,” said Samsung Electronics’ SVP of memory marketing, Sewon Chun.

“Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market.”

The 4GB HBM2 DRAM, which uses Samsung’s 20nm process technology and advanced HBM chip design, is specifically aimed at next-generation HPC systems and graphics cards.

“The 4GB HBM2 package is created by stacking a buffer die at the bottom and four 8Gb core dies on top. These are then vertically interconnected by TSV holes and microbumps,” explained Samsung.

“A single 8Gb HBM2 die contains over 5,000 TSV holes, which is more than 36 times that of an 8Gb TSV DDR4 die, offering a dramatic improvement in data transmission performance compared to typical wire-bonding based packages.”

Samsung’s new DRAM package features 256GBps of bandwidth, which is double that of an HBM1 DRAM package. This is equivalent to a more than seven-fold increase over the 36GBps bandwidth of a 4Gb GDDR5 DRAM chip, which has the fastest data speed per pin (9Gbps) among currently manufactured DRAM chips.

The firm’s 4GB HBM2 also enables enhanced power efficiency by doubling the bandwidth per watt over a 4Gb GDDR5-based solution, and embeds error-correcting code functionality to offer high reliability.

Samsung plans to produce an 8GB HBM2 DRAM package this year, and by integrating this into graphics cards the firm believes designers will be able to save more than 95 percent of space compared with using GDDR5 DRAM. This, Samsung said, will “offer more optimal solutions for compact devices that require high-level graphics computing capabilities”.

Samsung will increase production volume of its HBM2 DRAM over the course of the year to meet anticipated growth in market demand for network systems and servers. The firm will also expand its line-up of HBM2 DRAM solutions in a bid to “stay ahead in the high-performance computing market”.

Courtesy-TheInq

The Android fork, which adds conventional desktop features such as a taskbar, start menu and support for multiple windows, has been a huge hit, overshadowing the implementation of Android revealed in Google’s recent high-end tablet the Pixel C.

The initial build, as ever, is designed to fish for bugs and aid developers. A beta will follow in the coming weeks. The Alpha doesn’t contain Google Mobile Services apps such as the Play store and Gmail, but the finished version will. In the meantime, users can sideload the gApps package or go to the Amazon Web Store.

There may also be problems with some video codecs, but we’re told this is a licensing issue which will be resolved in the final version too. In the meantime, the first release is perfectly useable.

Compatibility with most Android apps is instant, but the user community can ‘upvote’ their favourites on the Remix OS site to flag what’s working best in each category.

The company has already released a small desktop machine of its own, called the Remix Mini, the world’s first fully functioning Android PC, priced at just $70 after a successful Kickstarter campaign. It has also developed a 2-in-1 ultrabook, the Remix Ultra, and has licensed Remix OS to several Far East tablet manufacturers.

In this new move, the company has teamed up with Android-x86, a group that has been working on an executable version of Android for computers since 2009, to launch a Remix OS installer which will allow existing hardware to become Remix OS powered, or as a partition on a dual-boot machine.

A third option is to store the OS on a USB stick, meaning that you can make any computer your own. This technique has already been popular through the Keepod programme which offers Android on a stick to countries without access to high-speed computers.

The advantages of Remix OS to the developing world are significant. Bench tests have shown that Remix OS works significantly faster than Windows, which will potentially breathe new life into older machines and make modern machines run at previously impossible speeds.

Remix OS was designed by three ex-Google engineers and includes access to the full Google Apps suite and the Google Play store.

David Ko, co-founder of Jide Technology, said: “Today’s public release of Remix OS, based on Android-x86, is something that we’ve been working towards since we founded Jide Technology in 2014.

“All of us are driven by the goal of making computing a more accessible experience, and this free, public release allows us to do this. We believe Remix OS is the natural evolution of Android and we’re proud to be at the forefront of this change.”

The public Alpha will be available to download from Jide and android-x86 from 12 January, and a beta update is expected swiftly afterwards. The INQUIRER has been using a Remix Mini for over a month now, and a full review of the operating system is coming soon.

Courtesy-TheInq

What makes it interesting is that it has a built-in keypad that allows it to be PIN protected when inserted into any device and can be set to ‘self-destruct’ after 10 incorrect log-in attempts. Better still, it comes with an aluminium cover to prevent the self-destruct accidentally being triggered in your bag.

Compatible with USB up to 3.1, it offers speeds of up to 135MBps read and 40MBps write. It is also designed to be OS independent, and includes up to 256-bit AES protection without any drivers on the host device.

“We are excited to add DataTraveler 2000 to our existing line-up of fast and encrypted USB flash drives for organisations and SMBs,” said Valentina Vitolo, flash business manager at Kingston. “It is the perfect option to deploy in the workforce where a uniform encrypted data storage solution that works on many different operating systems is in use.”

The device will be available later in the quarter. Prices are to be announced, but capacities will range from 16GB to 64GB.

Next up is the KC400, the latest addition to the SSDNow range powered by an eight-channel Phison controller and quad-core internal processor. It will be available is capacities from 128GB to 1TB with speeds of 550/540MBps read/write on the 256GB drive.

The MobileLite range of WiFi-enabled SD card readers has been expanded with the addition of the Wireless G3 and Wireless Pro. The G3 offers a 5600mAh onboard battery to charge mobile devices via the mobile app, and makes it even easier to transfer to and from mobile devices.

Both offer wireless 802.11ac connectivity, while the Pro edition adds an extra little something in the form of a 64GB flash storage option. Both have USB 3.0 and SD card slots, with an adapter for microSD. There’s also an Ethernet port so you can use it as a hotel room hotspot.

Last up, following on from the success of the HyperX CloudII headset, Kingston has released a special edition for Xbox One users which has garnered the moniker of ‘official’. It adds an inline volume control and comes in a hard-shell case.

This year’s offerings are less focused on the traditional Kingston flash product lines, and once again don’t increase capacities.

Courtesy-TheInq

Based on the firm’s fourth generation Graphics Core Next (GCN) architecture and built using a 14nm FinFET fabrication process, the upcoming architecture is a big jump from the current 28nm process.

AMD said that it expects shipments of Polaris GPUs to begin in mid-2016, offering improvements such as HDR monitor support and better performance-per-watt.

The much smaller 14nm FinFET process means that Polaris will deliver “a remarkable generational jump in power efficiency”, according to AMD, offering fluid frame rates in graphics, gaming, virtual reality and multimedia applications running on small form-factor thin and light computer designs.

“Our new Polaris architecture showcases significant advances in performance, power efficiency and features,” said AMD president and CEO Lisa Su. “2016 will be a very exciting year for Radeon fans driven by our Polaris architecture, Radeon Software Crimson Edition and a host of other innovations in the pipeline from our Radeon Technologies Group.”

The Polaris architecture features AMD’s fourth-generation GCN architecture, a next-generation display engine with support for HDMI 2.0a and DisplayPort 1.3, and next-generation multimedia features including 4K h.265 encoding and decoding.

GCN enables gamers to experience high-performance video games with Mantle, a tool for alleviating CPU bottlenecks such as API overhead and inefficient multi-threading. Mantle, which is basically AMD’s answer to Microsoft’s Direct X, enables improvements in graphics processing performance. In the past, AMD has claimed that Kaveri teamed with Mantle to enable it to offer built-in Radeon dual graphics to provide performance boosts ranging from 49 percent to 108 percent.

The new GPUs are being sampled to OEMs at the moment and we can expect them to appear in products by mid-2016, AMD said. Once they are in the market, we can expect to see much thinner form factors in devices thanks to the much smaller 14nm chip process.

Courtesy-TheInq

According to Ars Technica Under the handle “GPUOpen” AMD is releasing a slew of open-source software and tools to give developers of games, heterogeneous applications, and HPC applications deeper access to the GPU and GPU resources.

In a statement AMD said that as a continuation of the strategy it started with Mantle, it is giving even more control of the GPU to developers.

“ As console developers have benefited from low-level access to the GPU, AMD wants to continue to bring this level of access to the PC space.”

The AMD GPUOpen initiative is meant to give developers the ability to use assets they’ve already made for console development. They will have direct access to GPU hardware, as well as access to a large collection of open source effects, tools, libraries and SDKs, which are being made available on GitHub under an MIT open-source license.

AMD wants GPUOpen will enable console-style development for PC games through this open source software initiative. It also includes an end-to-end open source compute infrastructure for cluster-based computing and a new Linux software and driver strategy

All this ties in with AMD’s Boltzmann Initiative and an HSA (Heterogeneous System Architecture) software suite that includes an HCC compiler for C++ development. This was supposed to open the field of programmers who can use HSA. A new HCC C++ compiler was set up to enable developers to more easily use discrete GPU hardware in heterogeneous systems.

It also allows developers to convert CUDA code to portable C++. According to AMD, internal testing shows that in many cases 90 percent or more of CUDA code can be automatically converted into C++ with the final 10 percent converted manually in the widely popular C++ language. An early access program for the “Boltzmann Initiative” tools is planned for Q1 2016.

AMD GPUOpen includes a new Linux driver model and runtime targeted at HPC Cluster-Class Computing. The headless Linux driver is supposed to handle high-performance computing needs with low latency compute dispatch and PCI Express data transfers, peer-to-peer GPU support, Remote Direct Memory Access (RDMA) from InfiniBand that interconnects directly to GPU memory and Large Single Memory Allocation support.

Apparently the fruity cargo cult Apple has already signed up to adopt the technology, which means that the rest of the world’s press will probably notice.

According to the Commercial Times TSMC will have 85,000-100,000 wafers fabricated with the foundry’s in-house developed InFo packaging technology in the second quarter of 2016.

TSMC has disclosed its InFO packaging technology will be ready for mass production in 2016. Company president and co-CEO CC Wei remarked at an October 15 investors meeting that TSMC has completed construction of a new facility in Longtan, northern Taiwan.

TSMC’s InFo technology will be ready for volume production in the second quarter of 2016, according to Wei.

TSMC president and co-CEO Mark Liu disclosed the company is working on the second generation of its InFO technology for several projects on 10nm and 7nm process nodes.

Source-http://www.thegurureview.net/computing-category/tsmc-goes-fan-out-wafers.html

Most of the entry level, mainstream and even performance graphics cards from both Nvidia and AMD will rely on the GDDR5. This memory has been with us since 2007 but it has dramatically increased in speed. The memory chip has shrunken from 60nm in 2007 to 20nm in 2015 making higher clocks and lower voltage possible.

Some of the big boys, including Samsung and Micron, have started producing 8 Gb GDDR5 chips that will enable cards with 1GB memory per chip. The GTX 980 TI has 12 chips with 4 Gb support (512MB per chip) while Radeon Fury X comes with four HMB 1.0 chips supporting 1GB per chip at much higher bandwidth. Geforce Titan X has 24 chips with 512MB each, making the total amount of memory to 12GB.

The next generation cards will  get 12GB memory with 12 GDDR5 memory chips or 24GB with 24 chips. Most of the mainstream and performance cards will come with much less memory.

Only a few high end cards such as Greenland high end FinFET solution from AMD and a Geforce version of Pascal will come with the more expensive and much faster HMB 2.0 memory.

GDDR6 is arriving in 2016 at least at Micron and the company promises a much higher bandwidth compared to the GDDR5. So there will be a few choices.

Source-http://www.thegurureview.net/computing-category/will-gddr5-rule-in-2016.html

VR-World says that stage one results are finished and where shown off this week at SC15. This included a Heterogeneous Compute Compiler (HCC); a headless Linux driver and HSA runtime infrastructure for cluster-class, High Performance Computing (HPC); and the Heterogeneous-compute Interface for Portability (HIP) tool for porting CUDA-based applications to C++ programming.

AMD hopes the tools will drive application performance from machine learning to molecular dynamics, and from oil and gas to visual effects and computer-generated imaging.

Jim Belak, co-lead of the US Department of Energy’s Exascale Co-design Center in Extreme Materials and senior computational materials scientist at Lawrence Livermore National Laboratory said that AMD’s Heterogeneous-compute Interface for Portability enables performance portability for the HPC community.

“The ability to take code that was written for one architecture and transfer it to another architecture without a negative impact on performance is extremely powerful. The work AMD is doing to produce a high-performance compiler that sits below high-level programming models enables researchers to concentrate on solving problems and publishing groundbreaking research rather than worrying about hardware-specific optimizations.”

The new AMD Boltzmann Initiative suite includes an HCC compiler for C++ development, greatly expanding the field of programmers who can leverage HSA.

The new HCC C++ compiler is a key tool in enabling developers to easily and efficiently apply the hardware resources in heterogeneous systems. The compiler offers more simplified development via single source execution, with both the CPU and GPU code in the same file.

The compiler automates the placement code that executes on both processing elements for maximum execution efficiency.

Source- http://www.thegurureview.net/computing-category/amd-appears-to-be-pushing-its-boltzmann-plan.html