The carrier also announced it is creating a new dedicated network core for IoT connections that can scale far beyond the ability of its existing networks with the intent to reach billions of sensors and devices.

“Continued innovation in smart cities, connected cars and wearables demonstrates that IoT is the future for how we will live and work,” said Mike Lanman, senior vice president of enterprise products at Verizon during an event held at Verizon’s San Francisco Innovation Center. He said Verizon is taking a “holistic approach” to help expand the IoT market from millions of connections to billions. The event was webcast.

Other major wireless carriers, including AT&T, are developing programs to offer a range of services to industries and cities for connecting IoT sensors to wireless networks and then to cloud services for data analysis.

At Verizon, Lanman said the company is working to lower the cost of connecting billions of existing devices that companies have used for years to Verizon’s network. Holding up a new computer chip made by Sequans Communications, an LTE chip maker, he said the chip will provide a “significant reduction in cost…that changes the game.” It will provide 4G LTE connectivity in modules connected to IoT devices to “make the wide-area network more accessible to developers.”

Also, next year Verizon will launch a new IoT core network within its LTE network to provide a “much lower cost” than with Verizon’s existing wired and wireless networks.

“The cost for an IoT module and the cost to connect will both drop dramatically,” Lanman added. “Whether you are connecting your dog or water meters and any other low-payload devices, we’ll handle it through a new IoT core.”

Source-http://www.thegurureview.net/consumer-category/verizon-launches-thingspace-for-iot-development.html

Designed for demanding embedded needs, the processors incorporate the newest AMD 64-bit x86 CPU core (“Excavator”), plus third-generation Graphics Core Next GPU architecture, and better power management for reduced energy consumption.

AMD tells us that combined, these chips provide industry-leading graphics performance and key embedded features for next-generation designs. The SOC architecture enables simplified, small form factor board and system designs from AMD customers and a number of third party development platform providers.

What AMD brings to the party is its graphics and multimedia performance, including capability for hardware-accelerated decode of 4K video playback and support for the latest DDR4 memory.
Jim McGregor, principal analyst, TIRIAS Research said that AMDs push into x86 embedded platforms is paying off with an increasing number of customers and applications.

“There is a need for immersive graphics, high-quality visualization, and parallel computing in an increasing number of embedded applications. Across these fronts, the AMD Embedded R-Series SOC is a very compelling solution.”

Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that his outfit’s AMD Embedded R-Series SOC is a strong match for these needs in a variety of industries including digital signage, retail signage, medical imaging, electronic gaming machines, media storage, and communications and networking.

“The platform offers a strong value proposition for this next generation of high-performance, low-power embedded designs.”

The new AMD Embedded R-Series SOCs offer 22 percent improved GPU performance when compared to the 2nd Generation AMD Embedded R-Series APU2 and a 58 percent advantage against the Intel Broadwell Core i7 when running graphics-intensive benchmarks.

AMD released some of the specs for its integrated AMD Radeon graphics including:

Up to eight compute units4 and two rendering blocks

GPU clock speeds up to 800MHz resulting in 819 GFLOPS

•DirectX 12 support

Fully HSA Enabled

The AMD Embedded R-Series SOC was architected with embedded customers in mind and includes features such as industrial temperature support, dual-channel DDR3 or DDR4 support with ECC (Error Correction Code), Secure Boot, and a broad range of processor options.

It has a configurable thermal design power (cTDP) allows designers to adjust the TDPs from 12W to 35W in 1W increments for greater flexibility.

The SOC also has a 35 percent reduced footprint when compared to the 2nd Generation AMD Embedded R-Series APU, making it an excellent choice for small form factor applications.

AMD said that the range is the first embedded processor with dual-channel 64-bit DDR4 or DDR3 with Error-Correction Code (ECC), with speeds up to DDR4-2400 and DDR3-2133, and support for 1.2V DDR4 and 1.5V/1.35V DDR3.

Its dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB) and initiates trusted boot environment before starting x86 cores
It has a high-performance Integrated FCH featuring PCIe Gen3 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, and UART

The AMD Embedded R-Series SOC provides industry-leading ten-year longevity of supply. The processors support Microsoft Windows 7, Windows Embedded 7 and 8 Standard, Windows 8.1, Windows 10, and AMD’s all-open Linux driver including Mentor Embedded Linux from Mentor Graphics and their Sourcery CodeBench IDE development tools.

It will be interesting to see if AMD can make up the ground it has lost on PCs and higher ticket items. Most of the company still appears to be in a holding pattern until Zen arrives.

Courtesy-http://www.thegurureview.net/computing-category/will-amds-newest-soc-save-the-company.html

The new Mali-470 GPU has half the power consumption and two times the energy efficiency of the Mali-400, and is designed for next-generation wearables and IoT devices such as industrial control panels and healthcare monitors that rely on low-cost and low-power chips.

The Mali-470 supports OpenGL ES 2.0, used by Android and Android Wear, hinting that the GPU could also find its way into low-cost smartphones. If not, ARM promises that the chip will bring smartphone-quality visuals to wearable and IoT devices, supporting screen resolutions of up to 640×640 on single-core devices, and higher resolutions for multi-core configurations.

ARM envisions the new GPU paired with its efficient Cortex-A7 or A53 CPU designs for a low-power SoC.

“ARM scrutinises every milliwatt across the entire SoC to enable OEMs to optimize energy efficiency and open up new opportunities,” said Mark Dickinson, vice president and general manager of ARM’s multimedia processing group.

“Tuning efficiency is particularly relevant for devices requiring sophisticated graphics on a low power budget such as wearables, entry-level smartphones and IoT devices. The Mali-470 has been designed to meet this demand by enabling a highly capable user interface while being extremely energy efficient.”

ARM expects the first SoCs using the GPU be ready by the end of 2016, meaning that the chip will start showing up in devices the following year.

The launch of the Mali-470 GPU comes just hours after ARM announced plans to pick up the product portfolio and other business assets of Carbon Design Systems, a supplier of cycle-accurate virtual prototyping solutions.

The deal will see Carbon’s staff transfer to ARM, where the chip firm will make use of the Massachusetts-based outfit’s expertise in virtual prototypes. This will enable ARM to iron out any bugs and make improvements to chips before they move to foundries for production.

ARM also said that Carbon will help the firm enhance its capability in SoC architectural exploration, system analysis and software bring-up.

Courtesy-TheInq

The outfit has been going through hell lately. Last month AMD ace CPU architect Jim Keller stepped away from the company after completing his work on Zen.

Rogers was one of AMD’s high-ranking technology and engineering corporate fellows, and been responsible for helping to develop the software ecosystem behind AMD’s heterogeneous computing products and the Heterogeneous System Architecture.

He was a public figure for AMD and active on the software development and evangelism side, frequently presenting the latest HSA tech and announcements for AMD at keynotes and conferences.

While he is not the only person working on the software side of HSA at AMD, Rogers’ role in its development is important. Rogers was a major contributor to the HSA Foundation, helping to initially found it in 2012. He served as the Foundation’s president until he left AMD.

It seems his defection was kept secret, and took place sometime this quarter and did not manage to leak.

According to his LinkedIn profile Phil Rogers is now Nvidia’s “Chief Software Architect – Compute Server” which is similar to what he was doing over at AMD. Nvidia is not a member of the HSA Foundation, but they are currently gearing up for the launch of the Pascal GPU family, which has some features that overlap well with Phil Rogers’ expertise.

Pascal’s NVLink CPU & GPU interconnect would allow tightly coupled heterogonous computing similar to what AMD has been working on. It makes a fair bit of sense for Nvidia to bring over a heterogeneous compute specialist makes a great deal of sense.

Rogers’ departure from AMD will have to be mentioned on the earnings call on the 15th. AMD’s Gregory Stoner will probably replace him. Stoner is AMD’s current Senior Director of Compute Solutions Technology and long-time Vice President of the HSA Foundation.

Source-http://www.thegurureview.net/computing-category/is-amd-losing-top-scientist-to-nvidia.html

According to EETimes Paul Boudre, who claimed that SOI is already being used by Apple and Intel even though neither company is broadcasting it. SOI appears to be on track to major market penetration even while the rest of the industry is talking FinFETs.

GlobalFoundries general manager Rutger Wijburg told the SEMICON Europa 2015 that his outfit’s 22-nanometer “22FDX” SOI platform delivers FinFET-like performance but at a much lower power point and at a cost comparable to 28-nanometer planar technologies.

The 300-millimeter $250 million FD-SOI foundry here in the “Silicon Saxony” area of Germany, builds on 20 years of GlobalFoundries’ investments in Europe’s largest semiconductor fabs.

GlobalFoundries said it will extend Moore’s Law by using fully-deleted silicon-on-insulator (FD-SOI) transistors on wafers bought from Soitec.

Many had thought that if GloFlo’s FD-SOI gamble paid off then it would be a while before FinFET would have a serious rival. But Boudre’s claims suggests that SOI is already being used.

Customers like Intel and OEMs supplying fully-deleted silicon-on-insulator (FD-SOI) RF transistors to Apple proves that SOI and Soitec are past the cusp of the growth curve, destined to ramp up exponentially.

The problem for Soitec is no one is really talking about it. Chipzilla is committed to the FinFET, because it is higher performance than FD-SOI, even though it is higher power too.
Boudre said that it was supplying SOI wafers to Intel for other applications that don’t require high-performance. For instance, our wafers are very good for their silicon photonics projects.

Apple is already using SOI for several radio frequency (RF) chips in their front-ends, because they use 20-times less power. The iPhone is still using gallium arsenide (GaAs) for its power amplifier (PA) because it needs the high-power device for good connections, but for other RF front-end chips, and in fact for all the chips that they want to keep “always on,” the lower power consumption of FD-SOI is pushing the smartphone makers to Soitec, Boudre said.

SOI wafers cost three-times as much as bulk silicon but the cost per die is less because of the simplified processing steps including fewer masks.

Normally GPS chips run on 0.8 volts and consume over 20 milliamps, so they must be turned off most of the time. But when they are made with SOI wafers, they can run on 0.4 volts and consume only 1 milliamp. The mobile device to leave them on all the time and new and more accurate location sensing and new kinds of location-based applications can be developed.

What is amusing then is that Intel’s reason for going with FinFETs was that SOI wafers were too expensive but it did find a use for it.

GlobalFoundries’ Saxony fab will offer four varieties of its 22FDX process.

FDX-ulp for the mainstream and low-cost smartphone market. This will use body-biasing to beat FinFETs on power, but equal them in performance.

FDX-uhp for networking applications using analogue integration to match FinFETs while minimizing energy consumption

FDX-ull for ultra-low power required by wearables and Internet of Things applications. This will have a 1 picoamp per micron leakage

DDX-rfa for radio frequency (RF) analogue applications delivering 50 percent lower power and reduced system costs for LTE-A cellular transceivers, high-order multiple-input/multiple-output (MIMO) WiFi combo chips and millimeter wave radar.

Courtesy-http://www.thegurureview.net/computing-category/ibm-and-intel-going-goflo-soi.html

The chipmaker was the only major chip provider to optimize its architecture for Windows Phone, and Microsoft’s Lumia devices, which run on Snapdragon 808 and 810 chips.

The Windows 10 devices which come to market later this year will have the option to integrate cellular connectivity with the X12, X7 or X5 LTE modems, which support the Microsoft operating system’s native Mobile Broadband Interface Model (MBIM).

Qualcomm said this would give business users, in particular, a similar experience on their large-screened devices as on their smartphones, giving the particular examples of location-based services and security driving LTE usage on PCs and tablets.

Integrated cellular connectivity has not been so important for notebook users, outside of a few scenarios such as WiFi-less trains, most wireless access from notebooks, and even tablets, is over a WLAN.

Qualcomm makes WiFi chips for portable devices but it does not have such a big market share. Working with Microsoft means it could have a higher presence and a far better chance of delivering mass sales. The Surface Pro and its new Surface Book, is getting good reviews and might even be popular.

Courtesy-http://www.thegurureview.net/computing-category/qualcomm-goes-lte-for-microsoft.html

The company recommended deleting the apps but did not name them, which may make it hard for people to know which apps put their data at risk.

The apps in question installed their own digital certificates on a person’s Apple mobile device. It would enable the apps to terminate an encrypted connection between a device and a service and view the traffic, which is a potential security risk.

Most websites and many apps use SSL/TLS (Secure Socket Layer/Transport Security Layer), a protocol that encrypts data traffic exchanged with a user. SSL/TLS is a cornerstone of Web security, ensuring data traffic that is intercepted is unreadable.

It is possible in some cases to interfere with an encrypted connection. Many enterprises that want to analyze encrypted traffic for security reasons will use SSL proxies to terminate a session at the edge of their network and initiate a new one with their own digital certificate, allowing them to inspect traffic for malicious behavior.

In that scenario, employees would likely be more aware or expect that kind of monitoring. But people downloading something from the App Store probably would have no idea of the access granted to their sensitive data traffic.

Apple checks applications to ensure that malicious ones are not offered in its store. Those checks are in large part the reason why Apple has had fewer problems with malicious mobile applications in its store.

Installing digital certificates isn’t itself a malicious action per se, but Apple may be concerned that users are not fully aware of the consequences of allowing an app to do so.

Source-http://www.thegurureview.net/aroundnet-category/apple-removes-data-spying-apps-from-store.html

Researchers from FireEye found that the malicious component, nicknamed Kemoge, has been seeded inside what appear to be legitimate apps offered on third-party application stores.

“This is another malicious adware family, possibly written by Chinese developers or controlled by Chinese hackers, spreading on a global scale that represents a significant threat,” wrote Yulong Zhang, a staff research scientist with FireEye.

Whomever created Kemoge repackaged legitimate apps with the malware and then promoted them on websites and through in-app ads to persuade people to download them.

Zhang listed a dozed affected apps: Sex Cademy, Assistive Touch, Calculator, Kiss Browser, Smart Touch, Shareit, Privacy Lock, Easy Locker, 2048kg, Talking Tom 3, WiFi Enhancer and Light Browser.

Third-party apps stores are considered risky places to download Android apps, as hackers frequently upload malicious apps to them. Google performs a security check on apps in its Play store, although harmful ones occasionally sneak in.

Kemoge not only displays unwanted ads, but it’s also loaded with eight root exploits that target a wide range of Android devices, Zhang wrote. A successful attack using those exploits means an attacker would have complete control over the device.

Kemoge will collect a device’s IMEI (International Mobile Station Equipment Identity) and IMSI (International Mobile Subscriber Identity) numbers, information on storage and apps, and send the information to a remote server.

That command-and-control server was still running, Zhang wrote. An analysis of traffic exchanged between an infected device and the server showed Kemoge also tries to uninstall antivirus apps.

FireEye came across an app called Shareit in Google’s Play store that was signed by the same digital certificate as the malicious one found on the third-party source.

The Google Play version of ShareIt did not have the eight root exploits or contact the command-and-control server, but it did have some of the same Kemoge code libraries. It now appears to be gone from Google Play.

Source-http://www.thegurureview.net/mobile-category/kemoge-malware-menacing-android-phones.html