The social network continues to see surging interest in video. During one day last quarter, its users watched a combined 100 million hours of video. Roughly 500 million users watch at least some video each day.

That’s a lot of video and a lot of viewers, and Facebook wants to capitalize on it.

“We are exploring a dedicated place on Facebook for when they just want to watch videos,” CEO Mark Zuckerberg said Wednesday during a conference call to discuss Facebook’s quarterly financial results.

But he was tight-lipped on how the video might actually be presented.

Asked if a stand-alone video app is in the cards, he mentioned the success of Messenger and a Facebook app for managing Pages. “I do think there are additional opportunities for this and we’ll continue looking at them,” he said.

Facebook wants to encourage more video viewing because it keeps users on the site longer, helping it to sell more ads.

“Marketers also really love video and it’s a compelling way to reach consumers,” COO Sheryl Sandberg said during the call.

Zuckerberg has been watching the growth of video for osme time. At a town hall meeting in November 2014, he predicted, ”In five years, most of [Facebook] will be video.”

And it’s likely that most of that video will be consumed over mobile networks.

Among Facebook’s heaviest users — the billion people who access it on a daily basis — 90 percent use a mobile device, either solely or in addition to their PC.

It’s financial results for the fourth quarter were strong. Revenue was $5.8 billion, up 52 percent from the same period in 2014, while net profit more than doubled to $1.6 billion.

http://www.thegurureview.net/aroundnet-category/facebook-exploring-a-dedicated-video-service.html

According to the Gizchina website, the company the three new SoCs carry the catchy titles of MT6739, MT6750 and MT6750T. .

The MT6739 will probably replace the MT6735. Both have quad A53 cores but it will mean that the MT6739 will get a Cat 6 upgrade from Cat 4. The MT6739 supports speeds of up to 1.5GHz, 512 KB L2 cache, 1280×720 at 60fps resolution, and video decode to 1080p 30fps with H.264 and 13 megapixel camera. This means it is an entry level SoC for phones that might fit into the $100 price range.

The MT6750 and MT6750T look like twins, only the T version supports full HD 1920×1080 displays. The MT6750 has eight cores, four A53 clocked at 1.5Ghz and four A53 clocked at 1.0GHz and is manufactured on TSMC’s new 28nm High Performance Mobile Computing manufacturing mode. This is the same manufacturing process MediaTek is using for the Helio P10 SoC. The new process allows lower leakage and better overall transistor performance at lower voltage.

The MT6750 SoC supports single channel LPDDR3 666MHz and eMCP up to 4GB. The SoC supports eMMC 5.1, 16 megapixel camera, 1080p 30 fps with both H.264 and H.265 decoding. It comes with an upgraded ARM Mali T860 MP2 GPU with 350 MHz and display support of 1280×720 HD720 ready with 60 FPS. This means the biggest upgrade is the Cat 6 upgrade and it makes sense – most of European and American networks now are demanding a Cat 6 or higher modem that supports carrier aggregation.

This new SOc looks like a slowed down version of Helios P10 and should be popular for entry level Android phones.

Courtesy-Fud

The new Mali GPU can push enough pixels on the local display it is more likely that it is interested in using the technology for streaming.

Many smartphones can record 4K video and this means that smartphones could be a home to high resolution content which can be streamed to a large, high resolution screen.

It looks like Mali DP650can juggle the device’s native resolution and the external display’s own resolution and the variable refresh rates. At least that is what ARM says it can do.

The GPU is naturally able to handle different resolutions but it is optimized for a “2.5K”, which means WQXGA (2560×1600) on tablets and WQHD (2560×1440) on smartphones, but also Full HD (1920×1080) for slightly lower end devices.

Mark Dickinson, general manager, media processing group, ARM said: “The Mali-DP650 display processor will enable mobile screens with multiple composition layers, for graphics and video, at Full HD (1920×1080 pixels) resolutions and beyond while maintaining excellent picture quality and extending battery life,”

“Smartphones and tablets are increasingly becoming content passports, allowing people to securely download content once and carry it to view on whichever screen is most suitable. The ability to stream the best quality content from a mobile device to any screen is an important capability ARM Mali display technology delivers.”

ARM did not say when the Mali-DP650 will be in the shops or which chips will be the first to incorporate its split-display mode feature.

Courtesy-Fud

It is starting to look sales teams for the pair are each trying to show that they can use the technology to reduce the most electricity consumption and production costs.

In its yearly result for 2015, TSMC made an announcement that it is planning to enter mass-production system of chips produced by 16-nano FinFET Compact (FFC) process sometime during 1st quarter of this year. TSMC had finished developing 16-nano FFC process at the end of last year. During the announcement TSMC talked up the fact that its 16-nano FFC process focuses on reducing production cost more than before and implementing low electricity.

TSMC is apparently ready for mass-production of 16-nano FFC process sometime during 1st half of this year and secured Huawei’s affiliate called HiSilicon as its first customer.

HiSilicon’s Kirin 950 that is used for Huawei’s premium Smartphone called Mate 8 is produced by TSMC’s 16-nano FF process. Its A9 Chip, which is used for Apple’s iPhone 6S series, is mass-produced using the 16-nano FinFET Plus (FF+) process that was announced in early 2015. By adding FFC process, TSMC now has three 16-nano processors in action.

Samsung is not far behind it has mass-produced Gen.2 14-nano FinFET using a process called LPP (Low Power Plus). This has 15 per cent lower electricity consumption compared to Gen.1 14-nano process called LPE (Low Power Early).

Samsung Electronics’ 14-nano LPP process was seen in the Exynos 8 OCTA series that is used for Galaxy S7 and Qualcomm’s Snapdragon 820. But Samsung Electronics is also preparing for Gen.3 14-nano FinFET process.

Vice-President Bae Young-chang of Samsung’s LSI Business Department’s Strategy Marketing Team said it will use a process similar to the Gen.2 14-nano process.

Both Samsung and TSMC might have a few problems. It is not clear what the yields of these processes are and this might increase the production costs.

Even if Samsung Electronics and TSMC finish developing 10-nano process at the end of this year and enter mass-production system next year, but they will also have to upgrade their current 14 and 16-nano processes to make them more economic.

Even if 10-nano process is commercialized, there still will be many fabless businesses that will use 14 and 16-nano processes because they are cheaper. While we might see a few flagship phones using the higher priced chips, it might be that we will not see 10nm in the majority of phones for years.

Courtesy-Fud

Samsung’s new HBM solution will be used in high-performance computing (HPC), advanced graphics, network systems and enterprise servers, and is said to offer DRAM performance that is “seven times faster than the current DRAM performance limit”.

This will apparently allow faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.

“By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies,” said Samsung Electronics’ SVP of memory marketing, Sewon Chun.

“Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market.”

The 4GB HBM2 DRAM, which uses Samsung’s 20nm process technology and advanced HBM chip design, is specifically aimed at next-generation HPC systems and graphics cards.

“The 4GB HBM2 package is created by stacking a buffer die at the bottom and four 8Gb core dies on top. These are then vertically interconnected by TSV holes and microbumps,” explained Samsung.

“A single 8Gb HBM2 die contains over 5,000 TSV holes, which is more than 36 times that of an 8Gb TSV DDR4 die, offering a dramatic improvement in data transmission performance compared to typical wire-bonding based packages.”

Samsung’s new DRAM package features 256GBps of bandwidth, which is double that of an HBM1 DRAM package. This is equivalent to a more than seven-fold increase over the 36GBps bandwidth of a 4Gb GDDR5 DRAM chip, which has the fastest data speed per pin (9Gbps) among currently manufactured DRAM chips.

The firm’s 4GB HBM2 also enables enhanced power efficiency by doubling the bandwidth per watt over a 4Gb GDDR5-based solution, and embeds error-correcting code functionality to offer high reliability.

Samsung plans to produce an 8GB HBM2 DRAM package this year, and by integrating this into graphics cards the firm believes designers will be able to save more than 95 percent of space compared with using GDDR5 DRAM. This, Samsung said, will “offer more optimal solutions for compact devices that require high-level graphics computing capabilities”.

Samsung will increase production volume of its HBM2 DRAM over the course of the year to meet anticipated growth in market demand for network systems and servers. The firm will also expand its line-up of HBM2 DRAM solutions in a bid to “stay ahead in the high-performance computing market”.

Courtesy-TheInq

A big focus of the AT&T discounts is special deals on Samsung’s Galaxy smartphones and Gear S2 smartwatches. Analysts interpreted that focus on Samsung devices as a way to clear out inventory prior to expected upgrade announcements coming in late February at Mobile World Congress in Barcelona.

AT&T is also facing pressure to add more subscribers, as analysts — including Evercore ISI this week– have predicted AT&T’s fourth-quarter postpaid subscriber loss will be more than 300,000. That comes amid reports that T-Mobile added 4.5 million net subscribers for the fourth quarter and Verizon Wireless added 525,000.

All the major carriers, including AT&T, hit the December holidays with special device deals, but AT&T apparently didn’t feel enough impact on its inventory from those offers, analysts said.

AT&T and Samsung are motivated to get rid of all the old inventory before new models arrive, said Patrick Moorhead, an analyst at Moor Insights & Strategy. “Retailers won’t run such an aggressive promotion unless they have a lot of stock.”

An AT&T spokeswoman provided a different explanation: “Due to popular demand, AT&T is bringing back some of its holiday promos.”

Those promos — available to both consumers and business customers at AT&T retail stores — include a free Samsung Gear S2 smartwatch for a limited time to any customer buying a Samsung Galaxy smartphone, or a free Samsung Galaxy Tab 4 for buying a Galaxy smartphone on an AT&T Next wireless plan. AT&T is also offering an iPad mini 2 for $99 when a customer buys a new iPhone on the Next plan.

For business customers, the 2-for-1 smartphone deal is new. It allows business customers to buy a new smartphone and then get another smartphone, valued at up to $650, for free.

Source-http://www.thegurureview.net/mobile-category/att-facing-pressure-offers-aggressive-smartphone-discounts.html

PC manufacturers shipped 75.7 million machines in the fourth quarter compared with about 82.6 million a year earlier. Sales sank 3.1 per cent in the US to 16.9 million in the quarter.

Gartner forecasts a fall of  a  percent in 2016 with the potential of a soft recovery later in the year.

Mikako Kitagawa, an analyst at Gartner said that the  fourth quarter of 2015 marked the fifth consecutive quarter of worldwide PC shipment decline. Holiday sales did not boost the overall PC shipments, hinting at changes to consumers’ PC purchase behavior.

Lenovo retained its leadership of the PC market with 20 percent of the global market in the fourth quarter. Its shipments dropped 4.2 percent. HP was the  No. 2 global PC maker, increased its market share slightly to almost 19 percent. The company maintained its top position in the U.S., with 27 percent of the market, despite a decline of 8.4 percent in fourth-quarter shipments. Del increased its global market share to 13.5 percent from 13.1 percent and ranked third.

IDC released similar figures saying that it was all the fault of the strong US dollar hampered overseas sales. It thinks that the decline in PC sales may slow in 2016, with IDC projecting a fall of 3.1 percent compared with 10 percent drop in 2015. Greater commercial adoption of Microsoft Windows 10 operating system may help stabilize sales.

Courtesy-Fud

The chip is designed for in-car navigation and infotainment systems running QNX, Linux, and Android.  It has wireless capabilities and can connected to your phone.  The LTE version will link to the Internet.

They can manage multiple displays to run the screen in your dashboard  and an infotainment screen in the back seat. It also offers support for high-resolution 4K displays for when some company inevitably decides to cram a high-res, high-density screen into one of its cars.

The 820A chips are close cousins ofthe the Snapdragon 820 SoCs that will start shipping in phones later this year and use Qualcomm’s custom-made 64-bit Kryo CPU cores, an Adreno 530 GPU, a  Hexagon 680 DSP all cooked up with a 14nm manufacturing process. They will also use the Snapdragon X12 LTE which can manage 600Mbps down and  150Mbps up when the wind is behind it and it is going downhill. There are all the usual 802.11ac Wi-Fi, Bluetooth, and other features.

Qualcomm said that it used a “modular approach” in designing the chip, which  means that the cars infotainment system can be upgraded with hardware and software updates, thereby enabling vehicles to be easily upgraded with the latest technology.

Car makers could theoretically swap out the chip or the entire package without needing to worry about software changes. Qualcomm specifically mentions upgrading LTE connectivity over the lifetime of the car to keep up with the capabilities of cellular networks.

Qualcomm says the 820A family will begin sampling in Q1 of 2016.

Courtesy-Fud

Based on the firm’s fourth generation Graphics Core Next (GCN) architecture and built using a 14nm FinFET fabrication process, the upcoming architecture is a big jump from the current 28nm process.

AMD said that it expects shipments of Polaris GPUs to begin in mid-2016, offering improvements such as HDR monitor support and better performance-per-watt.

The much smaller 14nm FinFET process means that Polaris will deliver “a remarkable generational jump in power efficiency”, according to AMD, offering fluid frame rates in graphics, gaming, virtual reality and multimedia applications running on small form-factor thin and light computer designs.

“Our new Polaris architecture showcases significant advances in performance, power efficiency and features,” said AMD president and CEO Lisa Su. “2016 will be a very exciting year for Radeon fans driven by our Polaris architecture, Radeon Software Crimson Edition and a host of other innovations in the pipeline from our Radeon Technologies Group.”

The Polaris architecture features AMD’s fourth-generation GCN architecture, a next-generation display engine with support for HDMI 2.0a and DisplayPort 1.3, and next-generation multimedia features including 4K h.265 encoding and decoding.

GCN enables gamers to experience high-performance video games with Mantle, a tool for alleviating CPU bottlenecks such as API overhead and inefficient multi-threading. Mantle, which is basically AMD’s answer to Microsoft’s Direct X, enables improvements in graphics processing performance. In the past, AMD has claimed that Kaveri teamed with Mantle to enable it to offer built-in Radeon dual graphics to provide performance boosts ranging from 49 percent to 108 percent.

The new GPUs are being sampled to OEMs at the moment and we can expect them to appear in products by mid-2016, AMD said. Once they are in the market, we can expect to see much thinner form factors in devices thanks to the much smaller 14nm chip process.

Courtesy-TheInq