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Intel Gives Exascale A Boost
Intel’s exascale computing efforts have received a boost with the extension of the company’s research collaboration with the Barcelona Supercomputing Center.
Begun in 2011 and now extended to September 2017, the Intel-BSC work is currently looking at scalability issues with parallel applications.
Karl Solchenbach, Intel’s director, Innovation Pathfinding Architecture Group in Europe said it was important to improve scalability of threaded applications on many core nodes through the OmpSs programming model.
The collaboration has developed a methodology to measure these effects separately. “An automatic tool not only provides a detailed analysis of performance inhibitors, but also it allows a projection to a higher number of nodes,” says Solchenbach.
BSC has been making HPC tools and given Intel an instrumentation package (Extrae), a performance data browser (Paraver), and a simulator (Dimemas) to play with.
Charlie Wuischpard, VP & GM High Performance Computing at Intel said that the Barcelona work is pretty big scale for Chipzilla.
“A major part of what we’re proposing going forward is work on many core architecture. Our roadmap is to continue to add more and more cores all the time.”
“Our Knights Landing product that is coming out will have 60 or more cores running at a slightly slower clock speed but give you vastly better performance,” he said.
MediaTek Shows Off New IoT Platform
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MediaTek had announced a new development platform, as part of its MediaTek Labs initiative.
The LinkIt Connect MT7681 platform is based on the MT7681 SoC, designed for simple and affordable WiFi-enabled Internet of Things (IoT) devices. The company also released a software development kit (SDK) and hardware development kit (HDK) for the new platform.
The HDK includes the LinkIt Connect 7681 development board, which features the MT7681 chipset, micro-USB port and pins for various I/O interfaces. The chipset can be used in WiFi station or access point modes.
In station mode, the chip connects to a wireless access point and communicates with web services or cloud servers, which means it could be used to control smart thermostats. However, in access point mode, the chipset can communicate with devices directly, for example to control smart plugs or light bulbs using a smartphone.
“The world is rapidly moving towards connecting every imaginable device in the home, yet developers often have to spend too much effort on making their products Wi-Fi enabled,” said Marc Naddell, VP, MediaTek Labs. “The MediaTek LinkIt Connect 7681 platform simplifies and accelerates this process so that developers can focus on making innovative home IoT products, whatever their skill level.”
MediaTek Labs was launched in September 2014 and its goal is to promote a range of innovative MediaTek platforms, namely frugal devices such as wearables, IoT and home automation hardware.
Will AMD’s Kaveri Launch As Godavari?
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The new desktop refresh according to SweClockers is going to end up with A10-8850K branding. The new processor will get a 100MHz faster turbo clock and is based on the same 28nm manufacturing process. The base CPU clock for the A10-8850K is 3.7GHz, the same speed as the AMD A10-7850K, but the Turbo clock will jump to 4.1GHz with the new one. The A10-7850K has 4.0 GHz top turbo clock and 720 MHz GPU speed for its GCN Sea Island GPU.
The new A10-8850K will get the GPU to 856MHz. The memory speed supported stays at 2133MHz and the socket of choice remains FM2+. The TDP stays at 95W.
As you can see this is a small evolution and you can expect some cool parts for AMD on the desktop side in the latter part of 2016, some eighteen months from now, in 14nm.
AMD’s Carrizo Coming In The Second Quarter
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AMD released its earnings today and one cool question came up about the upcoming Carrizo mobile APU.
Lisa SU, the new AMD President and CEO, told MKM Partners analyst Ian Ing that Carrizo is coming in Q2 2015.
This is a great news and AMD’s Senior VP and outgoing general manager of computing and graphics group John Byrne already shared a few details about his excitement about Carrizo.
There are two Carrizo parts, one for big notebooks and All in Ones called Carrizo and a scaled down version called Carrizo L. We expect that the slower Carrizo-L is first to come but, Lisa was not specific. Carrizo-L is based on Puma+ CPU cores with AMD Radeon R-Series GCN graphics is intended for mainstream configurations with Carrizo targeting the higher performance notebooks.
Usually when a company says that something is coming in Q2 2015 that points to a Computex launch and this Taipei based tradeshow starts on June 2 2015. We strongly believe that the first Carrizo products will showcased at or around this date.
Lisa also pointed out that AMD has “significantly improved performance in battery life in Carrizo.” This is definitely good news, as this was one of the main issues with AMD APUs in the notebook space.
Lisa also said that AMD expects Carrizo to be beneficial for embedded and other businesses as well. If only it could have come a bit earlier, so let’s hope AMD can get enough significant design wins with Carrizo. AMD has a lot of work to do in order to get its products faster to market, to catch up with Intel on power and performance or simply to come up with innovative devices that will define its future. This is what we think Lisa is there for but in chip design, it simply takes time.
AMD Headed To The Facial Recognition Space
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AMD has developed facial recognition technology to enable users to organize and search video clips based on the people featured in them.
AMD executive Richard Gayle demonstrated to Tom’s Guide how AMD Content Manager, uses facial recognition to browse through a group of local videos to find specific faces.
There is an index that displays the people’s faces that have been detected throughout the video clips.
The user can edit the names of the people as well as add keyword tags to help improve future searches for specific people.
For instance, if you are searching for videos that feature one person, you can click on his or her respective face to pull up the corresponding videos.
Additionally, if you want to narrow a search to a specific person combined with a keyword tag, you can drag the face icon and click on the desired keyword.
Once you click on the video you wish to view, a player appears in the right windowpane, along with a timeline displayed at the bottom with a list of all the people who appear in the video.
The timeline is separated into various coloured boxes to mark the exact moment in the video when each person first appears on screen, so you do not have to watch the entire video to see the bit you want.
The application also has facial recognition capabilities that allow users to do some basic editing, such as compiling a single montage video of any individual or individuals.
While this is pretty good technology, it probably does not have any major use yet on its own.
Gayle said it is unlikely that AMD will release Content Manager in its current form but will license it to OEMs that are able to rebrand the application before offering it on their respective systems.
He claimed that only AMD processors have sufficient power to operate the application, because of the processor’s ability to have the CPU, GPU and memory controller work closely together.
AMD’s Fiji GPU Goes High Bandwidth
New evidence coming from two LinkedIn profiles of AMD employees suggest that AMD’s upcoming Radeon R9 380X graphics card which is expected to be based on the Fiji GPU will actually use High-Bandwidth Memory.
Spotted by a member of 3D Center forums, the two LinkedIn profiles mention both the R9 380X by name as well as describe it as the world’s firts 300W 2.5D discrete GPU SoC using stacked die High-Bandwidth Memory and silicon interposer. While the source of the leak is quite strange, these are more reliable than just rumors.
The first in line is the profile of Ilana Shternshain, an ASIC Physical Design Engineer, which has been behind the Playstation 4 SoC, Radeon R9 290X and R9 380X, which is described as the “largest in ‘King of the hill’ line of products.”
The second LinkedIn profile is the one from AMD’s System Architect Manager, Linglan Zhang, which was involved in developing “the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.”
Earlier rumors suggest that AMD might launch the new graphics cards early this year as the company is under heavy pressure from Nvidia’s recently released, as well as the upcoming, Maxwell-based graphics cards.
Samsung Finally Starts 14nm FinFET
A company insider has spilled the beans in Korea, claiming that Samsung has started Apple A9 production in 14nm FinFET.
The A9 is the next generation SoC for Apple iPhone and iPad products and it is manufactured on the Samsung – GlobalFoundries 14nm FinFET manufacturing process. In the other news, Samsung’s Ki-nam, president of the company’s semiconductor business and head of System LSI business has confirmed that the company started production of 14-nanometre FinFET chips.
The report mentions Austin as a possible site for Apple products but we wonder if the GlobalFoundries Fab 8 in New York State could become one of the partners for the 14nm FinFET manufacturing. Samsung didn’t officially reveal the client for the 14nm FinFET, but Apple is the most obvious candidate, while we expect to see 14 / 16nm FinFET graphics chips from AMD and Nvidia but most likely in the latter half of 2015 at best.
Qualcomm is likely to announce new LTE modem based on 14nm FinFET and the flagship SoC Snapdragon 810 is a 20nm chip. Qualcomm is manufacturing its 810 chips as we speak to meet demand for flagship Android phones coming in Q1 2015. Flagship Samsung, HTC and LG phones among others are likely to use Snapdragon 810 as a replacement for this year’s Snapdragon 801, a high end chip that ended up in millions of high-end phones.
Samsung / GlobalFoundries14nm FinFET process is 15 percent smaller, 20 percent faster, and 35 percent more power efficient compared to 20nm processors. This definitely sounds exiting and will bring more performance into phones, tablets, GPUs and will significantly decrease power consumption. The move from 28nm is long overdue.
We believe that Qualcomm’s LTE modem might be the first chip to officially come with this manufacturing process and Apple will probably take most of the 14nm production for an update in its tablets and phones scheduled for 2015.
MediaTek Cuts Xiaomi
The dark satanic rumour mill manufactured a hell on earth rumour that MediaTek has stopped supplying chips to Xiaomi.
MediaTek is apparently cross that Xiaomi has been investing in SoC supplier Leadcore Technology. Xiaomi has reportedly reached a deal with Leadcore allowing the phone maker to get access to the chip designer’s technology patents. DigiTimes however suggests that MediaTek has been trying to expand its presence in the mid-range and high-end market segments, but finds Xiaomi’s pricing strategy is disrupting its plans.
MediaTek’s MT6589T, a quad-core 1.5GHz chip, was originally designed to target mid-range and high-end mobile devices. The solution was introduced in Xiaomi’s Redmi smartphone in August 2013. However, prices for the Redmi series have been cut to as low as $114.
Xiaomi is ranked as the third largest smartphone vendor worldwide in the third quarter of 2014. Xiaomi’s shipments for the quarter registered a 211.3 per cent on-year jump boosting its market share to 5.3 per cent from 2.1 per cent during the same period of 2013.
Will The Chip Industry Take Fall?
Microchip Technology has managed to scare Wall Street by warning of an industry downturn. This follows rumours that a number of US semiconductor makers with global operations are reducing demand for chips in regions ranging from Asia to Europe.
Microchip Chief Executive Steve Sanghi warned that the correction will spread more broadly across the industry in the near future. Microchip expects to report sales of $546.2 million for its fiscal second quarter ending in September. The company had earlier forecast revenue in a range of $560 million to $575.9 million. Semiconductor companies’ shares are volatile at the best of times and news like this is the sort of thing that investors do not want to hear.
Trading in Intel, whiich is due to report third quarter results tomorrow, was 2.6 times the usual volume. Micron, which makes dynamic random access memory, or DRAM, was the third-most traded name in the options market. All this seems to suggest that the market is a bit spooked and much will depend on what Chipzilla tells the world tomorrow as to whether it goes into a nosedive.
MediaTek Goes IoT
SoC designer MediaTek has launched a new push to develop technologies used in wearables and Internet-of-Things (IoT) devices.
Dubbed MediaTek Labs, the new organisation will offer tools for developers such as software and hardware development kits (SDKs and HDKs), but it will also offer other forms of support, i.e. tech support and marketing.
MediaTek LinkIt dev platform
The MediaTek LinkIt platform promises to offer a full-service approach for developers keen to enter the space. It allows developers familiar with MediaTek’s Arduino implementation to quickly migrate to the new platform
For the time being the platform is limited to the MediaTek Aster MT2502A processor. The company says it is the world’s smallest commercially available SoC. The chip can work with MediaTek’s WiFi and GPS companion chipsets.
The company is calling on developers to join the MediaTek Labs initiative and in case you are interested you can check out the details on the new MediaTek Labs website.
MediaTek Aster spec
Now for some juicy hardware. The Aster MT2502A is an ARM7 EJ-S part clocked at 260MHz. The dev board features 4MB of RAM and 16MB of flash. GPS and WiFi capability can be added using the MT3332 and MT5931 chips. The platform supports microSD, Bluetooth (including BLE), along with GSM and GPRS communications.
The Aster is clearly not an SoC for feature packed wearables with high resolution screens, but it could be used in more down to earth applications such as fitness trackers.
MediaTek says it will offer three platforms based on two wearable solutions. The One Application Use (OAU) platform is for fitness trackers and simple Bluetooth devices. The Simple Application Platform (SAU) is intended for smart watches, wristbands and more elaborate fitness trackers.
SAU is the focus segment for the Aster chipset and it should offer 5 to 7 days of battery life.
MediaTek Rich Application Platform
The Rich Application Platform (RAU) is for Android Wear and it will offer a lot more functionality out of the box, including camera support, 3D graphics, as well as Bluetooth, WiFi and GPS in the same package.
This platform sounds a bit more interesting, but details are sketchy. For some reason many media outlets erroneously described the first Aster chip as MediaTek’s only smartwatch chip, but it is clearly not intended for the Rich Application Platform.
We have yet to see what sort of silicon MediaTek can conjure up for high-end wearables, but this is what it has in mind. The platform is designed for high-end smartwatches and glasses. It will feature multicore processors clocked at 1GHz or more. The platform also includes Bluetooth, GSM/GPRS, GPS, WiFi, sensors and a proper TFT screen. Battery life is described as short, two to three days, which sounds a bit better than what the current generation of smartwatches can deliver.