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More Details Uncovered On AMD’s ZEN Cores
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Our well informed industry sources have shared a few more details about the AMD’s 2016 Zen cores and now it appears that the architecture won’t use the shared FPU like Bulldozer.
The new Zen uses a SMT Hyperthreading just like Intel. They can process two threads at once with a Hyperthreaded core. AMD has told a special few that they are dropping the “core pair” approach that was a foundation of Bulldozer. This means that there will not be a shared FPU anymore.
Zen will use a scheduling model that is similar to Intel’s and it will use competitive hardware and simulation to define any needed scheduling or NUMA changes.
Two cores will still share the L3 cache but not the FPU. This because in 14nm there is enough space for the FPU inside of the Zen core and this approach might be faster.
We mentioned this in late April where we released a few details about the 16 core, 32 thread Zen based processor with Greenland based graphics stream processor.
Zen will apparently be ISA compatible with Haswell/Broadwell style of compute and the existing software will be compatible without requiring any programming changes.
Zen also focuses on a various compiler optimisation including GCC with target of SPECint v6 based score at common compiler settings and Microsoft Visual studio with target of parity of supported ISA features with Intel.
Benchmarking and performance compiler LLVM targets SPECint v6 rate score at performance compiler settings.
We cannot predict any instruction per clock (IPC improvement) over Intel Skylake, but it helps that Intel replaced Skylake with another 14nm processor in later part of 2016. If Zen makes to the market in 2016 AMD might have a fighting chance to narrow the performance gap between Intel greatest offerings.
Courtesy-Fud
AMD Coherent Data Reaches 100 GBs
After a lot of asking around, we can give you some actual numbers about the AMD’s coherent fabric.
The inter-connecting technology already sounded very promising, but now we have the actual number. The HSA, Heterogeneous System Architecture MCM (Multi Chip Module) that AMD is working on can give you almost seven times faster score than the traditional PCIe interface.
Our industry sources have confirmed that with 4 GMI (Global Memory Interconnect) links AMD’s CPU and GPU can talk at 100GB/s. the traditional PCIe 16X provides 15GB/s at about 500 ns latency. Data Fabric eliminates PCIe latency too.
AMD will be using this technology with the next gen Multi Chip module that packs a Zeppelin CPU (most likely packed with a bunch of ZEN cores) and a Greenland GPU that of course comes with super fast HBM (High Bandwidth Memory). The Greenland and HBM can communicate at 500 GB/s and can provide highest performance GPU with 4+ teraflops.
This new MCM package based chip will also talk with DDR4 3200 memory at 100GB/s speed making it quite attractive for the HSA computation oriented customers.
AMD Misses Again
Fabless chipmaker AMD has come up with a mixed set of results for the second quarter. The company managed to make as much cash as the cocaine nose jobs of Wall Street expected, but missed revenue expectations.
In fact its revenues were below the psychologically important billion figure at $942 million.
We knew it was going to be bad. Last week we were warned that the results would be flat. The actual figure was $942m, an 8.5 per cent sequential decline and a 34.6 per cent drop from the same period a year ago.
As you might expect, there are some measures of this not being AMD’s fault. The company is almost entirely dependent on PC sales. Not only have these fallen but don’t look like they are going to pick up for a while.
AMD’s Computing and Graphics division reported revenue of $379m, which was down 54.2 per cent, year-on-year. Its operating loss was $147m, compared to a $6m operating loss for last year’s quarter.
Lisa Su, AMD president and CEO, in a statement said that strong sequential revenue growth in AMD’s enterprise, embedded, and semi-custom segment and channel business was not enough to offset near-term problems in its PC processor business. This was due to lower than expected consumer demand that impacted sales to OEMs, she said.
“We continue to execute our long-term strategy while we navigate the current market environment. Our focus is on developing leadership computing and graphics products capable of driving profitable share growth across our target markets,” she added.
In the semi-custom segment, AMD makes chips for video game consoles such as the Nintendo Wii U, Microsoft Xbox One, and Sony PlayStation 4 consoles. That segment did reasonably well, up 13 percent from the previous quarter but down 8 percent from a year ago.
But AMD’s core business of processors and graphics chips fell 29 percent from the previous quarter and 54 percent from a year ago. AMD said it had decreased sales to manufacturers of laptop computers.
Figures like this strap a large target on AMD’s back with a sign saying “take me over” but AMD is not predicting total doom yet.
For the third quarter, AMD expects revenue to increase 6 percent, plus or minus 3 percent, sequentially, which is a fairly conservative outlook given the fact that Windows 10 is expected to push a few sales its way.
AMD supplies chips to the Nintendo Wii U, Microsoft Xbox One, and Sony PlayStation 4 consoles and these seem to be going rather well.
Is The Chip Market On The Rebound
Don’t let anyone fool you, the chipmarket is still not doing that well and there are a few problems to be sorted out before real money will be made.
FC Tseng, vice chairman for foundry VIS said that handset makers have too much inventory in their warehouses and the much hyped IoT market boom has not yet arrived.
In fact it is looking like 2015 will not be as good as 2014, which was pretty good at least as far as VIS was concerned.
Semiconductor demand for IoT applications will emerge, but no one has really worked out what the key drivers of IoT market growth will be, Tseng said.
Smartphones, devices such as watches, bracelets and glasses are all being identified as the popular applications when it comes to wearables and the Internet of Things.
VIS forecast that the global 2015 semiconductor market will increase 5 per cent in production value to $358 bn, while the foundry sector will grow by a larger 10 per cent on year to about S$50 bn.
VIS chairman and president Leuh Fang warned that the company has seen a low visibility of customer orders for the third quarter of 2015.
VIS reported record revenues and profits for 2014 and has been spending on capital expenditure like a mad thing in 2015.
Did AMD Commit Fraud?
AMD must face claims that it committed securities fraud by hiding problems with the bungled 2011 launch of Llano that eventually led to a $100 million write-down, a US court has decided.
According to Techeye US District Judge Yvonne Gonzales Rogers said plaintiffs had a case that AMD officials misled them by stating in the spring of 2011 and will have to face a full trial.
The lawsuit was over the Llano chip, which AMD had claimed was “the most impressive processor in history.”
AMD originally said that the product launch would happen in the fourth quarter of 2010, sales of the Llano were delayed because of problems at the company’s chip manufacturing plant.
The then Chief Financial Officer Thomas Seifert told analysts on an April 2011 conference call that problems with chip production for the Llano were in the past, and that the company would have ample product for a launch in the second quarter.
Press officers for AMD continued to insist that there were no problems with supply, concealing the fact that it was only shipping Llanos to top-tier computer manufacturers because it did not have enough chips.
By the time AMD ramped up Llano shipments in late 2011, no one wanted them any more, leading to an inventory glut.
AMD disclosed in October 2012 that it was writing down $100 million of Llano inventory as not shiftable.
Shares fell nearly 74 percent from a peak of $8.35 in March 2012 to a low of $2.18 in October 2012 when the market learned the extent of the problems with the Llano launch.
Intel Gives Exascale A Boost
Intel’s exascale computing efforts have received a boost with the extension of the company’s research collaboration with the Barcelona Supercomputing Center.
Begun in 2011 and now extended to September 2017, the Intel-BSC work is currently looking at scalability issues with parallel applications.
Karl Solchenbach, Intel’s director, Innovation Pathfinding Architecture Group in Europe said it was important to improve scalability of threaded applications on many core nodes through the OmpSs programming model.
The collaboration has developed a methodology to measure these effects separately. “An automatic tool not only provides a detailed analysis of performance inhibitors, but also it allows a projection to a higher number of nodes,” says Solchenbach.
BSC has been making HPC tools and given Intel an instrumentation package (Extrae), a performance data browser (Paraver), and a simulator (Dimemas) to play with.
Charlie Wuischpard, VP & GM High Performance Computing at Intel said that the Barcelona work is pretty big scale for Chipzilla.
“A major part of what we’re proposing going forward is work on many core architecture. Our roadmap is to continue to add more and more cores all the time.”
“Our Knights Landing product that is coming out will have 60 or more cores running at a slightly slower clock speed but give you vastly better performance,” he said.
Nvidia Unveils New Tegra X1 Chip
Chipmaker Nvidia debuted a new processor aimed at powering high-end graphics on car dashboards as well as sophisticated auto-pilot systems.
At an event in Las Vegas ahead of the Consumer Electronics Show, Nvidia Chief Executive Jen-Hsun Huang said the Tegra X1 chip would provide enough computing horsepower for automobiles with displays built into mirrors, dashboard, navigation systems and passenger seating.
“The future car is going to have an enormous amount of computational ability,” Huang said. “We imagine the number of displays in your car will grow very rapidly.”
The Tegra X1 has twice the performance of its predecessor, the Tegra K1, and will come out in early 2015, Nvidia said.
An upcoming platform combining two of the X1 chips can process data collected from up to 12 high-definition cameras monitoring traffic, blind spots and other safety conditions in driver assistance systems, Huang said.
Combined with next-generation software, the chips can help detect and read road signs, recognize pedestrians and detect braking vehicles, he said.
Santa Clara, California-based Nvidia in recent years has been expanding beyond its core business of designing high-end graphics chips for personal computers.
After struggling to compete against larger chipmakers like Qualcomm in smartphones and tablets, Nvidia is now increasing its focus on using its Tegra mobile chips in cars and is already supplying companies including Audi, BMW and Tesla.
Applied Materials Makes A Profit
Chip-equipment maker Applied Materials has surprised most of the cocaine nose jobs of Wall Street with a better-than-expected third-quarter profit. It appears that contract manufacturers are spending more on technology used to make smartphone and memory chips.
The company also forecast current-quarter adjusted profit largely above analysts’ average estimate. Chief Executive Gary Dickerson said that demand for DRAM chips is expected to grow in the current quarter.
Applied Materials, which also provides equipment to make flat panel displays and solar cells, forecast an adjusted profit of 25-29 cents per share for the fourth quarter. Wall Street was expecting a profit of 26 cents per share.
Applied Materials expects revenue growth of about 10 to 17 percent, implying revenue of $2.19 billion to $2.33 billion for the quarter. Analysts on average were expecting $2.28 billion. Applied Materials’ net income rose to $301 millionin the third quarter ended July 27, from $168 milliona year earlier. Revenue rose 14.7 percent to $2.27 billion.
Revenue in the company’s silicon systems business, which brings in about two-thirds of total sales, rose 16 percent to $1.48 billion.
HP Increases SlateBook Pricing
Hewlett-Packard’s SlateBook 14 laptop with Google’s Android OS has started shipping on schedule, but it’s priced at $429, which is $30 more than the company had said it would cost.
The laptop, which has a 14-inch screen and Android 4.3, was announced in June. At the time, HP said it would be priced at $399.
It is available on HP’s website.
The SlateBook 14 was introduced after customers told HP they wanted laptops with Android. The laptop has an interface similar to that on Android tablets and can adjust mobile apps to run on the larger touchscreen. Users will also be able to sync laptop data with mobile devices and vice versa.
The laptop is also for those who rely on the Web for most of their computing, much like Chromebooks. It has a few advantages over Chromebooks, with support for key Android apps such as Skype. Android also boasts better wireless printing support than Chromebooks.
The laptop weighs 1.68 kilograms and offers nine hours of battery life, according to specifications on HP’s website.
It has a quad-core Tegra 4 processor, 2GB of DRAM and 16GB of storage. Connectivity features include 802.11b/g/n Wi-Fi and Bluetooth 4.0. It also has a webcam, USB 3.0 port and a micro-SD slot for expandable storage.
It could be a strong multimedia laptop with a 1920 x 1080 pixel screen and an integrated graphics processor that can handle 4K video. TVs can be connected to the laptop through an HDMI port.
Can Intel Go Wireless?
July 17, 2014 by admin
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Intel wants to lead the drive into a less wired world by pushing standards, drive down the cost, and make these technologies ubiquitous.
At Computex, Intel demonstrated WiGig wireless docking and simultaneous wireless charging of a laptop, smartphone, headset and tablet with a pad placed under a tabletop. The company said that it would deliver reference designs for systems that use the technology in 2016 as part of a future Core processor family known as Skylake.
WiGig trades range for speed and operates in the 60GHz spectrum, compared with 2.4- and 5.0GHz for WiFi. It can transfer data at speeds of up to 7Gbps, compared to a maximum speed of a little more than 1Gbps for 802.11ac.
WiGig can be used to stream video from a mobile device to a TV or monitor, replacing HDMI and DisplayPort cables, but is being seen as a way of carrying out networking and wireless docking. It means that you can put your laptop on your desk and it automatically connects with your monitor, keyboard and mouse, printer and other peripherals without cables.
Intel plans to make its own WiGig chips. The outfit said it will have silicon for both transmitters and receivers in production by the end of this year, and available in products in the first half of 2015. Intel also wants to push Rezence for wireless charging.
Chipzilla has added that it will contribute some of its own IP to expand the standard to support wireless charging of laptops (which requires at least 20 watts) and that Rezence will be part of a Skylake reference design by 2016. This means that the world could be wirelessly networked soon after that.