Blackberry Goes Infotainment

Blackberry’s QNX Software Systems has announced a partnership that will allow its infotainment system to be placed in car’s digital instrument clusters.

The technology will allow drivers to see their music lists and album art, turn-by-turn navigation directions and local news in between instruments such as the speedometer and tachometer.

BlackBerry announced its collaboration with Rightware, a maker of automotiveuser interface design tools, at the Telematics Detroit show here. The collaboration combines the QNX Neutrino operating system and the Rightware Kanzi user interface.

QNX demonstrated the instrument cluster in a Mercedes-Benz concept car. The system also uses MirrorLink, an industry standard for the integration ofsmartphones into infotainment systems. The system is able to mirror Android-based smartphones to both the infotainment center on the console and the instrument cluster display.

With the MirrorLink connection, the instrument cluster can display realtime information, such as local speed limits, turn-by-turn directions, traffic reports and incoming phone calls. Because the cluster is fully digital, it can dynamically change views, highlighting the most important information and using advanced visualizations to help the driver process information more quickly.

“QNX Software Systems and Rightware have already worked together on successful production programs, including the exciting new Audi virtual cockpit,” said Peter McCarthy, director of global alliances for QNX.

With the Kanzi software, developers can create UIs with photorealistic, real-time 2D and 3D graphics. The QNX OS enables the Kanzi UI to access vehicle data and services, including navigation, multimedia, speed, RPM, and car diagnostics. It essentially provides an abstraction layer based on QNX’s persistent publish/subscribe (PPS) technology.

Source

Can Qualcomm Move Forward?

Qualcomm has posted its smallest quarterly revenue increase since 2010, which saw its share price plummeting five percent in after hours trading.

Qualcomm reported its second quarter earnings on Wednesday for the three months to 30 March, and its revenue rose to $6.37bn during the period, up four percent from a year ago, with net profit up five percent to $1.97bn.

However, that was the smallest year over year percentage increase since the June quarter of 2010, when revenue declined by two percent, and was far lower than the quarterly growth rates of over 20 percent that Qualcomm investors have seen previously.

“We delivered another solid quarter, driven by demand for our leading multimode 3G/LTE chipset solutions and record licensing revenues,” said Qualcomm CEO Steve Mollenkopf in the earnings report, not mentioning that earnings reflected a much lower increase than seen in recent quarters.

“Looking forward, we are pleased to be raising our earnings per share guidance for the fiscal year. We continue to see increasing demand for our industry-leading chipsets and strong growth in calendar year 2014 of 3G/4G smartphones around the world.”

Qualcomm also forecast sales of between $6.2bn and $6.8bn for the April to June quarter, with the low end of that estimate representing a decline of one percent from a year ago.

It’s probable that while growing smartphone penetration in emerging markets is helping to keep the firm’s unit sales high, it’s also having an negative effect on Qualcomm’s average selling price (ASP) levels of mobile chipsets and devices.

Following Qualcomm’s earnings report, analysts said that the dip in revenue was attributable to a decline in sales in China as the country’s biggest network, China Mobile, prepares to launch a faster network with 4G, or LTE, technology, and customers are anticipating the launch before buying new smartphones.

Qualcomm now expects to make a profit of between $5 and $5.25 per share, five cents above its earlier projection, the firm said.

Source

Do Chip Makers Have Cold Feet?

It is starting to look like chip makers are having cold feet about moving to the next technology for chipmaking. Fabricating chips on larger silicon wafers is the latest cycle in a transition, but according to the Wall Street Journal chipmakers are mothballing their plans.

Companies have to make massive upfront outlays for plants and equipment and they are refusing, because the latest change could boost the cost of a single high-volume factory to as much as $10 billion from around $4 billion. Some companies have been reining in their investments, raising fears the equipment needed to produce the new chips might be delayed for a year or more.

ASML, a maker of key machines used to define features on chips, recently said it had “paused” development of gear designed to work with the larger wafers. Intel said it has slowed some payments to the Netherlands-based company under a deal to help develop the technology.

Gary Dickerson, chief executive of Applied Materials said that the move to larger wafers “has definitely been pushed out from a timing standpoint”

Source

Is Intel Expanding?

Even if it means that it will be the first to make ARM’s 64-bit chips, Intel said that it wants to expand its contract foundry work. Intel CEO Brian Krzanich said he would expand his company’s small contract manufacturing business, paving the way for more chipmakers to tap into the world’s most advanced process technology.

Krzanich told analysts that he planned to step up the company’s foundry work, effectively giving Intel’s process technology to its rivals. He said that company’s who can use Intel’s leading edge and build computing capabilities that are better than anyone else’s, are good candidates for foundry service. Krzanich added that the slumping personal computer industry, Intel’s core market, was showing signs of bottoming out.

Intel also unveiled two upcoming mobile chips from its Atom line designed interchange features to create different versions of the component. A high-end version of the new chip, code named Broxton, and is due out in mid-2015. SoFIA, a low-end chip was shown as an example of Intel’s pragmatism and willingness to change how it does business. Krzanich said that in the interest of speed, SoFIA would be manufactured outside of Intel, with the goal of bringing it to market next year.

Intel will move production of SoFIA chips to its own 14 nanometer manufacturing lines, Krzanich added.

Source

Intel Buys KNO Software

Intel has acquired educational software developer Kno to add to its Education division.

Speaking in the company blog, Intel Sales and Marketing Group VP John Galvin explained that in a world where kids are being bombarded by technology, Intel Education has a mission to support the rollout of technology in the classroom.

Galvin said, “The Kno platform provides administrators and teachers with the tools they need to easily assign, manage and monitor their digital learning content and assessments.”

This acquisition brings Intel’s global digital content library to over 225,000 [higher education] and K-12 titles from 74 education publishers. “We’re looking forward to combining our expertise with Kno’s rich content so that together, we can help teachers create classroom environments and personalized learning experiences that lead to student success,” Galvin added.

Intel Education has been working for the past decade with over 10 million teachers that it has assisted to integrate technology with education.

In the UK alone there have been tremendous strides in educational software over the past 30 years, dating back to the government pledge to provide a computer in every school, which led to the creation of the BBC Microcomputer designed specifically for that purpose.

Today, not only is ICT a dedicated lesson in its own right, but it forms one of the key skills that educators are expected to incorporate into all lesson plans, putting it on a par with English and Maths, showing just how far we’ve come from making Venn diagrams with ascii art.

Source

Chip Makers Going After Cars

Chip makers including Broadcom and Renesas Electronics are putting more focus on in-car entertainment with faster processors and networks for wireless HD movies and navigation, aiming to keep drivers informed and passengers entertained.

With PC sales slipping and the mobile device market proving highly competitive, chip makers are looking for greener pastures in other sectors like in-car entertainment and information.

From Renesas comes the R-Car M2 automotive SoC (System-on-a-Chip), which has enough power to handle simultaneous high-definition navigation, video and voice-controlled browsing.

The SoC is meant for use in mid-range systems. It features two ARM Cortex A-15 cores running at up to 1.5GHz and Renesas’ own SH-4A processor plus the PowerVR SGX544MP2 from Imagination Technologies for 3D graphics. This combination helps the M2 exceed the previous R-Car H1 with more than three times the CPU capacity and approximately six times better graphics performance.

Car makers that want to put a more advanced entertainment system in their upcoming models should go for the eight core R-Car H2 SoC, which was announced earlier this year. It is based on ARM’s big.LITTLE architecture, and uses four Cortex-A15 cores and another four Cortex-A7 cores.

The H2 will be able to handle four streams of 1080p video, including Blu-Ray at 60 frames per second, according to Renesas. Mass production is scheduled for the middle of next year, while the M2 won’t arrive in larger volumes until June 2015.

Broadcom on the other hand is seeking to drive better networking on the road. The company’s latest line of wireless chipsets for in-car connectivity uses the fast 802.11ac Wi-Fi wireless standard, which offers enough bandwidth for multiple displays and screen resolution of up to 1080p. Use of the 5GHz band for video allows it to coexist with Bluetooth hands-free calls on 2.4GHz, according Broadcom.

Broadcom has also implemented Wi-Fi Direct and Miracast. Wi-Fi Direct lets products such as smartphones, cameras and in this case in-car computers connect to one another without joining a traditional hotspot network, while Miracast lets users stream videos and share photos between smartphones, tablets and displays.

The BCM89335 Wi-Fi and Bluetooth Smart Ready combo chip and the BCM89071 Bluetooth and Bluetooth Smart Ready chip are now shipping in small volumes.

Source

CPU-Z Hits Android

Popular hardware identification tool CPU-Z has hit the Google Play Store. Like the PC version, the apps is completely free and it offers tons of information about your device.

It identified the SoC on board, along with the architecture and clock speed for each core. It also figures out the exact device brand, amount of RAM, storage, battery level, status and temperature. It can tap into the device’s sensor array, which is more of a gimmick than anything useful.

It’s worth noting that it is still in beta, so there might be some kinks to work out. If you’re eager to give it a go, you can find it here. https://play.google.com/store/apps/details?id=com.cpuid.cpu_z.

Source

Intel Releases 16GB Xeon Phi

Intel has announced five Xeon Phi accelerators including a high density add-in card while upping memory capacity to 16GB.

Intel has managed to get its Xeon Phi accelerator cards to power the Tianhe-2 cluster to the summit of the Top 500 list, however the firm isn’t waiting around to bring out new products. At the International Supercomputing show, Intel extended its Xeon Phi range with five new products, all of which have more than one TFLOPS double precision floating point performance, and the Xeon Phi 7120P and 7120X cards, which have 16GB of GDDR5 memory.

Intel’s Xeon Phi 7120P and 7120X cards have peak double precision floating point performance of over 1.2 TFLOPS, with 352GB/s bandwidth to the 16GB of GDDR5 memory. The firm also updated its more modest Xeon Phi 3100 series with the 3120P and 3120A cards, both with more than one TFLOPS of double precision floating point performance and 6GB of GDDR5 memory with bandwidth of 240GB/s.

Intel has also brought out the Xeon Phi 5120D, a high density card that uses mini PCI-Express slots. The firm said that the Xeon Phi 5120D card offers double precision floating point performance of more than one TFLOPS and 8GB of GDDR5 memory with bandwidth greater than 300GB/s.

That Intel is concentrating on double precision floating point performance with its Xeon Phi accelerators highlights the firm’s focus on research rather than graphics rendering or workstation tasks. However the firm’s ability to pack 16GB into its Xeon Phi 7100 series cards is arguably the most important development, as larger locally addressable memory means higher resolution simulations.

Intel clearly seems to believe that there is significant money to be made in the high performance PC market, and despite early reservations from industry observers the firm seems to be ramping up its Xeon Phi range at a rate that will start to give rival GPGPU accelerator designer Nvidia cause for concern.

Source

Haswell Refresh Coming Next Year

Intel has been executing its tick tock strategy flawlessly since January 2006 and now there is some indication that we might see the first slip in 8 years come 2014. Intel’s latest roadmap claims that in 12 months from now, in Q2 2014 Haswell will be replaced by a “Haswell refresh”.

Haswell is a tock, a 22nm new architecture and Broadwell is supposed to be based on Haswell fundamentals, but shrunk to 14nm like a proper “tock”. In case that the Haswell refresh is a tweaked 22nm core, this would mean that after 7 years of execution and billions of investments in cutting edge fabrication processes, Intel would have to slow things down.

It is not certain what would happen to 2015 Skylake, a new 14nm architecture, or the 10nm Skymont that is supposed to be the shrink, but in case Broadwell gets pushed back by a year there is a big possibility that the whole roadmap would slip a year.

When it gets ready the Haswell refresh (possibly a disguise name for Broadwell ed.) is replacing Core i7, Core i5, Core i3, Pentium and Celeron based Haswell chips, some sooner rather than later.

The chipset responsible for Haswell refresh is already branded as Z97 and H97 in desktop versions replacing the Z87 and H87 boards proving that the socket are likely to continue existing at least through 2014. It will be interesting to see the developments and if Broadwell is really delayed or this is just game of words on Intel’s part.

Source

Intel Shows More Ivy Bridge

Last week Intel officially released Haswell, but there’s still life in good old Ivy Bridge. The chipmaker has announced a range of low-end Ivy parts and even a Sandy Bridge based Celeron.

The Celeron G470 is possibly the last consumer Sandy Bridge we will ever see. It is a single-core 35W part clocked at 2GHz and it’s priced at just $37.

However, Ivy Bridge parts are a bit more interesting. They include the Celeron 1017, a dual-core, dua-thread chip clocked at 1.6GHz, with a TDP of just 17W. It costs $86 and should be a nice part for low-end laptops and nettops. The Celeron 1005M also costs $86, but it has a 35W TDP and a 1.9GHz clock.

There are four new G2000 Pentiums as well. The G2140 and G2030 are 55W parts, clocked at 3GHz and 3.3GHz respectively. The G2120T and G2030T are 35W chips, clocked at 2.6GHz and 2.7GHz. They cost $64 and $75 respectively. Of course, Pentiums don’t feature Hyperthreading and all four of them are dual-core parts.

The Core i3 line-up also got some speed bumps. The Core i3-3245 and 3250 are clocked at 3.4 and 3.5GHz and both have a TDP of 55W. The 3245 features HD 4000 graphics and costs $134, while the 3250 ends up with HD 2500 graphics and a price tag of $138. Lastly, the Core i3-3250T is a 3GHz part with a 35W TDP, it costs $138, just like its 55W sibling.

Source

« Previous Page — Next Page »