Intel Rewards RealSense Developers

Intel has awarded  $1m to a number of developers as part of its RealSense 3D App Challenge, which was launched last year.

Announced by Intel president Renee James at Computex 2014, the RealSense App Challenge was part of Intel’s efforts to boost RealSense globally and generate software innovation around the ecosystem.

More than 7,000 software creators in 37 countries applied to compete, and 400 were selected to develop new applications for entertainment, learning and collaboration.

Several hundred developers of creative app ideas in these categories received the latest edition of the RealSense 3D Camera and RealSense software development kit, which included free tools, examples and application programing interfaces with which to develop their ideas.

Intel announced on Thursday that the grand prize winner, who picks up $100,000, is Brazilian developer Alexandre Ribeiro da Silva of Anima Games.

His Seed app requires gamers to use reflexes and rational thinking to solve puzzles. The goal of the game is to guide a little floating seed through its journey to reforest a devastated land.

The second prize of $50,000 was awarded to Canadian developer David Schnare of Kinetisense. His OrthoSense app uses RealSense to help medical professionals remotely rehabilitate a patient who has suffered a hand injury by tracking their range of movement over time.

“This practical application of human-computer interaction is an impressive example of how technology can make our lives better,” Intel said.

Another notable winner was Lee Bamber from the UK, who received recognition for his virtual 3D video maker. The app allows a user to record themselves as a 3D hologram and then transport to a variety of scenes.

Once recorded, they can then change the camera position over the course of the playback to add an extra dimension to a video blogs, storybook or v-mails, for instance.

“The idea of the app is that you can choose the backdrop then set the lighting as you would in a studio then do the acting,” Bamber explained in his video.

Doug Fisher, SVP and general manager of Intel’s Software and Services Group, said in a blog post that now the app challenge is complete “the real work begins”, as Intel Software will continue to encourage all finalists to bring products to market.

“We also will continue mobilising our resources to inspire, educate and advance innovation through programmes such as the Intel Developer Zone, where developers can engage to find new software tools and build industry relationships,” he said.

“Human-computer interactions will no longer be defined by mice, keyboards and 2D displays. Our physical and digital worlds are coming together. When they do, the opportunities for us as consumers and businesses will explode.”

Source

Qualcomm Gives Snapdragon More Umph

Qualcomm has released a new Trepn Profiler app for Android which will profile Snapdragon processors and tinker with them.

The Trepn Profiler app identifies apps that overwork the CPU or are eating too much data. The app will pinpoint which of the apps drain the battery faster.

All data that will be obtained by this app can provide information you need to know which program is slowing down your phone.

Most Android phone users will not give a damn, but developers will find it useful. Those who are interested in testing roms, custom kernels, and their own apps can use the data gathered by the Trepn Profiler.

Developers can measure optimisation and performance on Snapdragon-powered mobile devices. Data are real-time include network usage, battery power, GPU frequency load, and CPU cores’ load. Key features also include six fast-loading profiling presets, and an advanced mode to manually select data points and save for analysis.

The Advanced Mode allows profiling a single app or device, offline data analysis, and increasing of data collection interval. This special mode also allows longer profiling sessions, displaying two data point in one overlay, and viewing of profile data.

All up this should enable developers to come up with more Snapdragon friendly apps.

Source

AMD To Power Samsung’s Digital Media

AMD’s Embedded R-Series accelerated processing unit, previously codenamed “Bald Eagle,” is powering Samsung’s latest set-back-box digital media players.

Bald Eagle was designed for high performance at low power with broad connectivity but mostly for digital signage.

It seems that new Samsung SBB-B64DV4 is intended for demanding signage applications that transform Samsung SMART Signage Displays into digital tools for a wide range of business needs.

The chipmaker claimed that by using its Embedded R-Series APUs, Samsung SBB media players for digital signage can manage HD graphics performance and support multivideo stream capabilities up to two displays, in a power efficient and ultra-compact form factor.

Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that digital signage is a key vertical for the AMD Embedded business.

“The AMD Embedded R-Series APU enables leading digital signage providers to harness high levels of compute and graphics performance within a low-power design envelope. AMD Embedded Solutions help designers at Samsung achieve aggressive form factor goals and drive down system costs while providing the rich multimedia their digital signage customers’ demand,” he said.

The AMD Embedded RX-425BB APU combines an x86 CPU with an integrated, discrete-class AMD Radeon R6 graphics processing unit in a low-power configuration to minimize heat dissipation constraints and meet energy efficiency requirements.

The processor uses AMD’s latest Graphics Core Next architecture, created for advanced graphics applications and parallel processing capabilities.

Source

Samsung Producing NVMe PCIe SSDs

Samsung Electronics has started mass production of what it claims is the industry’s first Non-Volatile Memory Express (NVMe) PCIe solid state drive (SSD), which has an M.2 form factor for use in PCs and workstations.

Samsung said in an announcement that it is “the first in the industry” to bring NVMe SSDs to OEMs for the PC market.

The SM951-NVMe operates at low power in standby mode and is the most compact of any NVMe SSD out there, according to the firm.

“Our new NVMe SSD will allow for faster, ultra-slim notebook PCs with extended battery use, while accelerating the adoption of NVMe SSDs in the consumer marketplace,” said SVP of memory marketing Jeeho Baek.

“Samsung will continue to stay a critical step ahead of others in the industry in introducing a diversity of next-generation SSDs that contribute to an enhanced user experience through rapid popularisation of ultra-fast, highly energy-efficient, compact SSDs.”

Samsung has added an NVMe version of the SM951 SSD after making a AHCI-based PCIe 3.0 version available since early January. This, Samsung said, will form an even stronger SSD portfolio.

The new NVMe-based SM951 SSD boasts a sequential data read and write speed of up to 2,260MBps and 1,600MBps respectively, while taking advantage of the firm’s own controller technology.

“These performance figures are the industry’s most advanced, with speeds four and three times faster than those of a typical SATA-based M.2 SSD which usually moves data at up to 540MBps and 500MBps respectively,” Samsung added.

The drive achieves these high speeds by using four 8Gbps lanes of simultaneous data flow. This allows for a data transfer rate of 32Gbps and a maximum throughput of 4GBps, giving the new drive a huge advantage over SATA-based M.2 SSDs, which can only transfer data at up to 600MBps.

When it comes to random read operations, the SM951-NVMe can process 300,000 IOPS operations, which is more than twice as fast as the 130,000 rate of its AHCI-based predecessor, Samsung said, while being more than three times faster than the 97,000 IOPS of a SATA-based SSD.

“Meeting all M.2 form factor requirements, the drive’s thickness does not exceed 4mm. [It] also weighs less than 7g, which is lighter than two nickels and only a tenth the weight of a 2.5in SSD. Capacities are 512GB, 256GB and 128GB,” Samsung explained.

Samsung said that the company plans to incorporate 3D V-NAND technology into its NVMe SSD line-up, which could see even higher densities and performance.

Earlier this week HP unveiled the HP Z Turbo Drive G2, a storage solution featuring Samsung’s NVMe SSDs to process large datasets.

The HP Z Turbo Drive G2 PCIe SSD is said to deliver four times traditional SATA SSD performance at a similar cost to previous devices. This will allow workstation users to “super-charge” the productivity and creativity of workflows, according to HP.

Source

RadioShack Plans To Sell Customer Data

RadioShack plans to keep moving forward with its plan to sell its customer data, despite opposition from a number of states.

The company has asked a bankruptcy court for approval for a second auction of its assets, which includes the consumer data.

The state of Texas, which is leading the action by the states, opposed the sale of personally identifiable information (PII), citing the online and in-store privacy policies of the bankrupt consumer electronics retailer.

The state claimed that it found from a RadioShack deposition that the personal information of 117 million customers could be involved. But it learned later from testimony in court that the number of customer files offered for sale might be reduced to around 67 million.

In the first round of the sale, RadioShack sold about 1,700 stores to hedge fund Standard General, which entered into an agreement to set up 1,435 of these as co-branded stores with wireless operator Sprint. Some other assets were also sold in the auction.

The sale of customer data, including PII, was withdrawn from the previous auction, though RadioShack did not rule out that it could be put up for sale at a later date.

The case could have privacy implications for the tech industry as it could set a precedent, for example, for large Internet companies holding consumer data, if they happen to go bankrupt.

Texas has asked the U.S. Bankruptcy Court for the District of Delaware for a case management order to ensure that in any motion for sale of the PII, RadioShack should be required to provide information on the kind of personal data that is up for sale and the number of customers that will be affected.

On Monday, Texas asked the court that its motion be heard ahead of RadioShack’s motion for approval to auction more assets.

The court had ordered in March the appointment of a consumer privacy ombudsman in connection with the potential sale of the consumer data including PII. RadioShack said in a filing Friday that it intends to continue working with the ombudsman and the states with regard to any potential sale of PII, but did not provide details.

Source

RedHat And Canonical Discuss Linux 4.0

Red Hat has been telling everyone  its plans to integrate the latest Linux 4.0 kernel into its products.

In a statement, a spokesman told us, “Red Hat’s upstream community projects will begin working with 4.0 almost immediately; in fact, Fedora 22 Alpha was based on the RC1 version of the 4.0 kernel.

“From a productization perspective, we will keep an eye on these integration efforts for possible inclusion into Red Hat’s enterprise portfolio.

“As with all of our enterprise-grade solutions, we provide stable, secure and hardened features, including the Linux kernel, to our customers – once we are certain that the next iterations of the Linux kernel, be it 4.0 or later, has the features and maturity that our customer base requires, we will begin packaging it into our enterprise portfolio with the intention of supporting it for 10 years, as we do with all of our products.”

Meanwhile, Canonical Head Honcho Mark Shuttleworth has confirmed that Linux Kernel 4.0 should be making its debut in Ubuntu products before the end of the year.

In an earlier note to The INQUIRER, Shuttleworth confirmed that the newly released kernel’s integration was “likely to be in this October release.”

The news follows the release of version 4.0 of the Linux kernel in a flurry of what T S Eliot would describe as “not with a bang but a whimper”.

Writing on the Linux Kernel Mailing List on Sunday afternoon, Linux overlord Linus Torvalds explained that the new version was being released according to schedule, rather than because of any dramatic improvements, and because of a lack of any specific reason not to.

“Linux 4.0 was a pretty small release in linux-next and in final size, although obviously ‘small’ is relative. It’s still over 10,000 non-merge commits. But we’ve definitely had bigger releases (and judging by linux-next v4.1 is going to be one of the bigger ones),” he said.

“Feature-wise, 4.0 doesn’t have all that much special. Much has been made of the new kernel patching infrastructure, but realistically that wasn’t the only reason for the version number change. We’ve had much bigger changes in other versions. So this is very much a ‘solid code progress’ release.”

Come to think of it, it is very unlikely that T S Eliot would ever have written about Linux kernels, but that’s not the point.

Torvalds, meanwhile, explained that he is happier with releasing to a schedule rather than because of any specific feature-related reason, although he does note that there have been four billion code commits, and Linux 3.0 was released after the two billion mark, so there’s a nice symmetry there.

In fact, back in 2011 the version numbering of the Linux kernel was a matter of some debate, and Torvalds’ lacklustre announcement seems to be pre-empting more of the same.

In a subsequent post Torvalds jokes, “the strongest argument for some people advocating 4.0 seems to have been a wish to see 4.1.15 – because ‘that was the version of Linux Skynet used for the T-800 Terminator.’”

Source

Toshiba And SanDisk Launch 3D Flash Chip

Toshiba has announced the world’s first 48-layer Bit Cost Scalable (BiCS) flash memory chip.

The BiCS is a two-bit-per-cell, 128Gb (16GB) device with a 3D-stacked cell structure flash that improves density and significantly reduces the overall size of the chip.

Toshiba is already using 15nm dies so, despite the layering, the finished product will be competitively thin.

24 hours after the first announcement, SanDisk made one of its own regarding the announcement. The two companies share a fabrication plant and usually make such announcements in close succession.

“We are very pleased to announce our second-generation 3D NAND, which is a 48-layer architecture developed with our partner Toshiba,” said Dr Siva Sivaram, executive vice president of memory technology at SanDisk.

“We used our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second-generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”

Samsung has been working on its own 3D stacked memory for some time and has released a number of iterations. Production began last May, following a 10-year research cycle.

Moving away from the more traditional design process, the BiCS uses a ‘charge trap’ which stops electrons leaking between layers, improving the reliability of the product.

The chips are aimed primarily at the solid state drive market, as the 48-layer stacking process is said to enhance reliability, write speed and read/write endurance. However, the BiCS is said to be adaptable to a number of other uses.

All storage manufacturers are facing a move to 3D because, unless you want your flash drives very long and flat, real estate on chips is getting more expensive per square inch than a bedsit in Soho.

Micron has been talking in terms of 3D NAND since an interview with The INQUIRER in 2013 and, after signing a deal with Intel, has predicted 10TB in a 2mm chip by the end of this year.

Production of the chips will roll out initially from Fab 5 before moving in early 2016 to Fab 2 at the firm’s Yokkaichi Operations plant.

This is in stark contrast to Intel, which mothballed its Fab 42 chip fabrication plant in Chandler, Arizona before it even opened, as the semiconductors for computers it was due to produce have fallen in demand by such a degree.

The Toshiba and Sandisk BiCS chips are available for sampling from today.

Source

Panasonic Appears To Be On The Hunt

Japanese electronics giant Panasonic Corp said it is gearing up to spend 1 trillion yen ($8.4 billion) on acquisitions over the next four years, bolstered by a stronger profit outlook for its automotive and housing technology businesses.

Chief Executive Kazuhiro Tsuga said at a briefing on Thursday that Panasonic doesn’t have specific acquisition targets in mind for now. But he said the firm will spend around 200 billion yen on M&A in the fiscal year that kicks off in April alone, and pledged to improve on Panasonic’s patchy track record on big deals.

“With strategic investments, if there’s an opportunity to accelerate growth, you need funds. That’s the idea behind the 1 trillion yen figure,” he said. Tsuga has spearheaded a radical restructuring at the Osaka-based company that has made it one of the strongest turnaround stories in Japan’s embattled technology sector.

Tsuga previously told Reuters that company was interested in M&A deals in the European white goods market, a sector where Panasonic has comparatively low brand recognition.

The firm said on Thursday it’s targeting operating profit of 430 billion yen in the next fiscal year, up nearly 25 percent from the 350 billion yen it expects for the year ending March 31.

Panasonic’s earnings have been bolstered by moving faster than peers like Sony Corp and Sharp Corp to overhaul business models squeezed by competition from cheaper Asian rivals and caught flat-footed in a smartphone race led by Apple Inc and Samsung Electronics. Out has gone reliance on mass consumer goods like TVs and smartphones, and in has come a focus on areas like automotive technology and energy-efficient home appliances.

Tsuga also sought to ease concerns that an expensive acquisition could set back its finances, which took years to recover from the deal agreed in 2008 to buy cross-town rival Sanyo for a sum equal to about $9 billion at the time.

Source

Oracle Launches OpenStack Platform With Intel

Oracle and Intel have teamed up for the first demonstration of carrier-grade network function virtualization (NFV), which will allow communication service providers to use a virtualized, software-defined model without degradation of service or reliability.

The Oracle-led project uses the Intel Open Network Platform (ONP) to create a robust service over NFV, using intelligent direction of software to create viable software-defined networking that replaces the clunky equipment still prevalent in even the most modern networks.

Barry Hill, Oracle’s global head of NFV, told The INQUIRER: “It gets us over one of those really big hurdles that the industry is desperately trying to overcome: ‘Why the heck have we been using this very tightly coupled hardware and software in the past if you can run the same thing on standard, generic, everyday hardware?’. The answer is, we’re not sure you can.

“What you’ve got to do is be smart about applying the right type and the right sort of capacity, which is different for each function in the chain that makes up a service.

“That’s about being intelligent with what you do, instead of making some broad statement about generic vanilla infrastructures plugged together. That’s just not going to work.”

Oracle’s answer is to use its Communications Network Service Orchestration Solution to control the OpenStack system and shrink and grow networks according to customer needs.

Use cases could be scaling out a carrier network for a rock festival, or transferring network priority to a disaster recovery site.

“Once you understand the extent of what we’ve actually done here, you start to realize just how big an announcement this is,” said Hill.

“On the fly, you’re suddenly able to make these custom network requirements instantly, just using off-the-shelf technology.”

The demonstration configuration optimizes the performance of an Intel Xeon E5-2600 v3 processor designed specifically for networking, and shows for the first time a software-defined solution which is comparable to the hardware-defined systems currently in use.

In other words, it can orchestrate services from the management and orchestration level right down to a single core of a single processor, and then hyperscale it using resource pools to mimic the specialized characteristics of a network appliance, such as a large memory page.

“It’s kind of like the effect that mobile had on fixed line networks back in the mid-nineties where the whole industry was disrupted by who was providing the technology, and what they were providing,” said Hill.

“Suddenly you went from 15-year business plans to five-year business plans. The impact of virtualization will have the same level of seismic change on the industry.”

Today’s announcement is fundamentally a proof-of-concept, but the technology that powers this kind of next-generation network is already evolving its way into networks.

Hill explained that carrier demand had led to the innovation. “The telecoms industry had a massive infrastructure that works at a very slow pace, at least in the past,” he said.

“However, this whole virtualization push has really been about the carriers, not the vendors, getting together and saying: ‘We need a different model’. So it’s actually quite advanced already.”

NFV appears to be the next gold rush area for enterprises, and other consortium are expected to make announcements about their own solutions within days.

The Oracle/Intel system is based around OpenStack, and the company is confident that it will be highly compatible with other systems.

The ‘Oracle Communications Network Service Orchestration Solution with Enhanced Platform Awareness using the Intel Open Network Platform’ – or OCNSOSWEPAUTIONP as we like to think of it – is currently on display at Oracle’s Industry Connect event in Washington DC.

The INQUIRER wonders whether there is any way the marketing department can come up with something a bit more catchy than OCNSOSWEPAUTIONP before it goes on open sale.

Source

USB 3.1 Coming Later This Year

The emerging USB 3.1 standard is on track to reach desktops as hardware companies release motherboards with ports that can transfer data twice as fast as the previous USB technology.

MSI recently announced a 970A SLI Krait motherboard that will support the AMD processors and the USB 3.1 protocol. Motherboards with USB 3.1 ports have also been released by Gigabyte, ASRock and Asus, but those boards support Intel chips.

USB 3.1 can shuffle data between a host device and peripheral at 10Gbps, which is two times faster than USB 3.0. USB 3.1 is also generating excitement for the reversible Type-C cable, which is the same on both ends so users don’t have to worry about plug orientation.

The motherboards with USB 3.1 technology are targeted at high-end desktops. Some enthusiasts like gamers seek the latest and greatest technologies and build desktops with motherboards sold by MSI, Asus and Gigabyte. Many of the new desktop motherboards announced have the Type-C port interface, which is also in recently announced laptops from Apple and Google.

New technologies like USB 3.1 usually first appear in high-end laptops and desktops, then make their way down to low-priced PCs, said Dean McCarron, principal analyst of Mercury Research.

PC makers are expected to start putting USB 3.1 ports in more laptops and desktops starting later this year.

Source

« Previous Page — Next Page »