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Will Google Use Intel Inside?
March 21, 2014 by admin
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It seems that Intel has elbowed its way under the bonnet of the high profile Nexus 8 tablet. Word on the street is that the Moorefield chip which is said to make a top speed of around 2.33 GHz, when the wind is behind it, has kicked Qualcomm’s tried and tested Snapdragon chip out of the Nexus range.
The move would give the Nexus 8, some good GPU power thanks to the PowerVR G6430 graphic engine. Google may unveil the actual tablet during the Google I/O event as well as the next big upgrade to the Android software dubbed lollipop. Still it is starting to look like Intel may really become a force to be reckoned with in mobile after all.
However, we should point out that Nexus 8 CPU rumors are nothing new. There was talk of Intel, Qualcomm and even Nvidia over the past couple of months – but we are still not entirely certain what’s under the bonnet.
Intel Outs New Xeon Chipset
Intel has released details about its new Xeon E7 v2 chipset. The Xeon processor E7 8800/4800/2800 v2 product family is designed to support up to 32-socket servers with configurations of up to 15 processing cores and up to 1.5 terabytes of memory per socket.
The chip is designed for the big data end of the Internet of Things movement, which the processor maker projected will grow to consist of at least 30 billion devices by 2020. Beyond two times better performance power, Intel is promising a few other upgrades with the next generation of this data-focused chipset, including triple the memory capacity, four times the I/O bandwidth and the potential to reduce total cost of ownership by up to 80 percent.
The 15-core variants with the largest thermal envelope (155W) run at 2.8GHz with 37.5MB of cache and 8 GT/s QuickPath connectivity. The lowest-power models in the list have 105W TDPs and run at 2.3GHz with 24MB of cache and 7.2 GT/s of QuickPath bandwidth. There was also talk of 40W, 1.4GHz models at ISSCC but they have not been announced yet.
Intel has signed on nearly two dozen hardware partners to support the platform, including Asus, Cisco, Dell, EMC, and Lenovo. On the software end, Microsoft, SAP, Teradata, Splunk, and Pivotal also already support the new Xeon family. IBM and Oracle are among the few that support Xeon E7 v2 on both sides of the spectrum.
Ubuntu Cross-Platform Delayed
Ubuntu will not offer cross-platform apps as soon as it had hoped.
Canonical had raised hopes that its plan for Ubuntu to span PCs and mobile devices would be realised with the upcoming Ubuntu 14.04 release, providing a write-once, run-on-many template similar to that planned by Google for its Chrome OS and Android app convergence.
This is already possible on paper and the infrastructure is in place on smartphone and tablet versions of Ubuntu through its new Unity 8 user interface.
However, Canonical has decided to postpone the rollout of Unity 8 for desktop machines, citing security concerns, and it will now not appear along with the Mir display server this coming autumn.
This will apply only to apps in the Ubuntu store, and in the true spirit of open source, anyone choosing to step outside that ecosystem will be able to test the converged Ubuntu before then.
Ubuntu community manager Jono Bacon told Ars Technica, “We don’t plan on shipping apps in the new converged store on the desktop until Unity 8 and Mir lands.
“The reason is that we use app insulation to (a) run apps securely and (b) not require manual reviews (so we can speed up the time to get apps in the store). With our plan to move to Mir, our app insulation doesn’t currently insulate against X apps sniffing events in other X apps. As such, while Ubuntu SDK apps in click packages will run on today’s Unity 7 desktop, we don’t want to make them readily available to users until we ship Mir and have this final security consideration in place.
“Now, if a core-dev or motu wants to manually review an Ubuntu SDK app and ship it in the normal main/universe archives, the security concern is then taken care of with a manual review, but we are not recommending this workflow due to the strain of manual reviews.”
As well as the aforementioned security issues, there are still concerns that cross-platform apps don’t look quite as good on the desktop as native desktop versions and the intervening six months will be used to polish the user experience.
Getting the holistic experience right is essential for Ubuntu in order to attract OEMs to the converged operating system. Attempts to crowdfund its own Ubuntu handset fell short of its ambitious $20m target, despite raising $10.2 million, the single largest crowdfunding total to date.
Did Intel Kill Bay Trail?
Intel has decided that some of its budget Bay Trail parts have been out evolved and flung them into a tar pit. According to CPU World the parts first appeared in September. Intel released budget Bay Trail systems on a chip for mobile and desktop markets, under Celeron and Pentium brands.
They were manufactured on 22nm technology, and featured such enhancements as greater number of CPU cores, higher clock speeds, beefed up graphics unit, not to mention an out-of-order microarchitecture, that improved per-clock CPU performance by up to 30 per cent faster compared to their predecessors. With this performance goodness it is a little surprising the Intel has decided that all the all Bay Trail SoCs will be discontinued in a matter of a few months. Details of the planned discontinuation were published this week by Intel in several Product Change Notification documents.
The Desktop Pentium J2850, along with mobile Celeron N2810 and Pentium N3510 are already End of Lifed and its last orders will be in two weeks, on February 11. The chips will ship until April 25, 2014. Also retired are mobile Celeron N2806, N2815, N2820, N2920, and Pentium N3520. Their EOL date is April 11, 2014, and they will ship until May 30, 2014. On August 22, 2014, Intel is going to discontinue Celeron J1750, J1850, N2805 and N2910. The “J” models are desktop processors, and the “N” are mobile ones. There is no word on Z-series Bay Trail-T parts, none appear to be EOL’d at this time.
Furthermore, on the same date Intel will retire Core i7-3940XM Extreme Edition, and boxed and tray versions of Core i7-3840QM and i7-3740QM CPUs. The last shipment date for the Celerons and Core i7s is February 6, 2015.
Red Hat Releases Linux E-Beta
Red Hat has made available a beta of Red Hat Enterprise Linux 7 (RHEL 7) for testers, just weeks after the final release of RHEL 6.5 to customers.
RHEL 7 is aimed at meeting the requirements of future applications as well as delivering scalability and performance to power cloud infrastructure and enterprise data centers.
Available to download now, the RHEL 7 beta introduces a number of enhancements, including better support for Linux Containers, in-place upgrades, XFS as the default file system, improved networking support and improved compatibility with Windows networks.
Inviting customers, partners, and members of the public to download the RHEL 7 beta and provide feedback, Red Hat is promoting the upcoming version as its most ambitious release to date. The code is based on Red Hat’s community developed Fedora 19 distribution of Linux and the upstream Linux 3.10 kernel, the firm said.
“Red Hat Enterprise Linux 7 is designed to provide the underpinning for future application architectures while delivering the flexibility, scalability, and performance needed to deploy across bare metal, virtual machines, and cloud infrastructure,” Senior Product Marketing Manager Kimberly Craven wrote on the Red Hat Enterprise Linux blog.
These improvements address a number of key areas, including virtualisation, management and interoperability.
Linux Containers, for example, was partially supported in RHEL 6.5, but this release enables applications to be created and deployed using Linux Container technology, such as the Docker tool. Containers offers operating system level virtualisation, which provides isolation between applications without the overhead of virtualising the entire server.
Red Hat said it is now supporting an in-place upgrade feature for common server deployment types. This will allow customers to migrate existing RHEL 6.5 systems to RHEL 7 without downtime.
RHEL 7 also makes the switch to XFS as its default file system, supporting file configurations up to 500TB, while ext4 file systems are now supported up to 50TB in size and B-tree file system (btrfs) implementations are available for users to test.
Interoperability with Windows has also been improved, with Red Hat now including the ability to bridge Windows and Linux infrastructure by integrating RHEL 7 and Samba 4.1 with Microsoft Active Directory domains. Red Hat Enterprise Linux Identity Management can also be deployed in a parallel trust zone alongside Active Directory, the firm said.
On the networking side, RHEL 7 provides support for 40Gbps Ethernet, along with improved channel bonding, TCP performance improvements and low latency socket poll support.
Other enhancements include support for very large scale storage configurations, including enterprise storage arrays, and uniform management tools for networking, storage, file systems, identities and security using the OpenLMI framework.
Did Qualcomm Snub Intel?
Earlier this year Intel made a lot of noise about leasing its foundries to third parties, but at least one big played does not appear to be interested.
Speaking at a tech conference, Qualcomm CEO Paul Jacobs said his company is not interested in using Intel fabs and that it will continue to cooperate with established foundries like TSMC.
Jacobs argued that Intel is great at building huge volumes of equally huge cores, but TSMC is a tad more flexible. He pointed out that foundries like TSMC can run build multiple different products simultaneously, controlling the process using software.
“Intel is famous, has been known for having a copy-exact model, so they need very large volumes of a particular chip to run through that,” Jacobs said, reports ITProPortal.
However, Jacobs did point out that he was glad to hear Intel is joining the foundry space and that it will be interesting to see how it plays out.
Did Intel Have an IPad In Y2K?
Intel apparently built an IPAD ten years before Steve Jobs though of the tablet and the name. It was in the days when sticking an I in front of anything meant it was Intel rather than Apple and the Intel Pad, or IPAD for short, could browse the Internet, play music and videos, and even act as a digital picture frame.
Intel scrapped the IPAD before consumers could get their hands on it as its move into Tablets was seen as one of the outfit’s biggest blunders. According to CNET in the late 1990s and early 2000s, Intel wanted to diversify its operations beyond the PC. The IPAD came from one of several small teams within its research arm tasked with exploring new business opportunities. The IPAD, which included a touch screen and stylus, would not run entirely on its own but connected to a computer to browse the Internet through an Intel wireless technology.
Intel thought that “mobility” meant moving around your home or business and the IPAD was to be a portable device you could take around your house. The reason that they never thought of connecting it to the phone network was because Intel wanted to tie it all back to its core PC chip business. After several years of development on the Intel Web Tablet, then-CEO Craig Barrett unveiled the device at the Consumer Electronics Show in January 2001. The company planned to sell the tablet to consumers later that year.
Sadly though it miffed Intel’s PC partners, which didn’t want a product that could potentially compete with them and Intel caved in and cancelled the project.
Intel’s Cherry Trail Forthcoming
The next generation desktop and mobile Atom is Cherry Trail in 14nm and the first parts are expected in late 2014. Intel has been working hard to accelerate the introduction of Atom parts based on the new architecture and in 2014 it will finally ship Broadwell notebook chips and Cherry Trail Atoms in the same year, both using the new 14nm node.
The Cherry View is a notebook SoC version of a chip based on new Airmont core, while Cherry Trail is the part meant for tablets. The phone version is based on Moorefield architecture and they are all expected to show up in late 2014, most likely very late Q3 2014.
The TDP should go down compared to Bay Trail platform as the new 14nm needs less voltage to hit the same speed and should produce less heat at the same time. With the 14nm shrink Intel’s new Atoms will be able to get more fanless design wins.
The significance of 14nm products for mobile phones and tablets will be in the fact that ARM alliance lead by Qualcomm, Samsung, MediaTek and a few other players will be struggling to get 20nm designs out of the door in 2014, and Intel can already get to a 14nm.
However, Intel still has to integrate LTE inside its mobile phone SoCs, which has traditionally been proven to be a tough task. At this time only Qualcomm has on-die LTE and its LTE enabled SoCs are under the bonnet of almost every significant ARM based high-end phone out there.
Only time will tell how successful Intel’s mobile push will be. Even with these 14nm parts, once they show up roughly a year from now, it might be really tough for Intel to get some high-volume design wins in the phone space, despite the transition to 14nm.
Will Intel’s Tablet Gamble Work?
Earlier this year Intel caused quite a stir when CEO Brian Krzanich announced the company’s ultimate goal is to make $99 tablets a reality. So far Intel has failed to gain much market share in the tablet space, dominated by cheaper ARM application processors and Android.
However, Bay Trail-T has a good chance to turn things around. The new chip can easily take on high-end ARM parts and in most cases, wipe the floor with them. Since it’s an x86 part, it can also be used in Windows 8.1 tablets. However, the price was a problem. Intel’s official Bay Trail-T prices range from $32 to $37, making the chips significantly more expensive than mid-range and low-end ARM parts. However, many vendors are said to be getting discounts and paying a bit less, in the $20 to $30 range.
Things may be about to change. According to Digitimes, Intel is planning to spend up to $1 billion on tablet chip subsides. The cash should sweeten the deal for vendors willing to give Intel SoCs a go. Since we are talking about relatively low average selling prices, Intel could use the cash to practically halve the prices and offer Bay Trail-T parts for as little as $10. This would make them competitive overnight, as high-end ARM SoCs like the Exynos 5 and Tegra 4 are estimated to cost well over $20.
Intel has a long tradition of overspending on marketing. A few years ago it showed Ultrabook vendors with $300 million worth of market development funding and it has a huge Core marketing program. Intel recently announced that it would start treating Atom and Core equally, hence the move would make sense. Since Core lifecycles are getting longer, Intel could simply shift some of the funding to Atom products, namely tablet parts like Bay Trail-T.
The only problem? Well the report comes from Digitimes and the site’s hit and miss track record has been on the “miss” side lately, so take it with a grain of salt.
Is Intel Expanding?
Even if it means that it will be the first to make ARM’s 64-bit chips, Intel said that it wants to expand its contract foundry work. Intel CEO Brian Krzanich said he would expand his company’s small contract manufacturing business, paving the way for more chipmakers to tap into the world’s most advanced process technology.
Krzanich told analysts that he planned to step up the company’s foundry work, effectively giving Intel’s process technology to its rivals. He said that company’s who can use Intel’s leading edge and build computing capabilities that are better than anyone else’s, are good candidates for foundry service. Krzanich added that the slumping personal computer industry, Intel’s core market, was showing signs of bottoming out.
Intel also unveiled two upcoming mobile chips from its Atom line designed interchange features to create different versions of the component. A high-end version of the new chip, code named Broxton, and is due out in mid-2015. SoFIA, a low-end chip was shown as an example of Intel’s pragmatism and willingness to change how it does business. Krzanich said that in the interest of speed, SoFIA would be manufactured outside of Intel, with the goal of bringing it to market next year.
Intel will move production of SoFIA chips to its own 14 nanometer manufacturing lines, Krzanich added.