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Intel’s Core i7 3940XM Said To Be Fast
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The fastest Core i7 for notebooks currently available is the Core i7 3940XM, with four cores working at 3GHz by default and 3.9GHz in its turbo mode. It has a massive 8MB of cache and fits the 55W TDP envelope. It costs an arm, a leg and a few other organs of your choice, as its official price sits at $1096.
As of Q3 2013, the Core i7 3940XM will cease to be the fastest kid on the block. The Haswell replacement is right around the corner and the name of the new market leader is Core i7 4930MX. The “X” stands for Extreme Edition, while M means that the processor comes from the M-line of processors. We mentioned the H-line of processors here and the only main difference is that H comes GT3 graphics while Intel HD graphics 4600, Intel HD graphics 4×00 for GT2.
The Core i7 4930XM (yes the letters have changed the place from Ivy Bridge MX to XM with Haswell) is a quad-core with eight threads, 3GHz core clock, 3.9GHz maximum single core turbo, 3.8GHz max dual-core turbo and an impressive 3.7GHz max quad-core turbo clock.
The graphics core of choice Intel’s new GT2 HD graphics core which works between 400 and 1350MHz, but we are not aware of the number of graphics cores inside at this point. The fastest supported memory is rather disappointing, DDR3 or DDR3L 1600, and we expected a higher number here.
TSMC 20nm Processors In High Demand
TSMC believes demand for next-generation 20nm chips will be even higher than demand for current 28nm products.
Speaking in a conference call, TSMC CEO Morris Chang said the volume of 20nm SoCs built next year will be greater than 28nm volume in 2012 and by 2015 it should be greater than 28nm volume in 2013.
TSMC hopes to start 20nm production in the latter part of the year. The company is constructing two new facilities at Fab 15 and it hopes to start 20nm production in both simultaneously. We could be in for a quick ramp.
TSMC will offer only one version of the 20nm process, compared to four versions of the 28nm process. This should also allow it to ramp up volume production faster, reckons Xbit Labs.
Intel Makes Changes To Haswell
Intel has started dividing its mobile market segments into processors lines, where the Y processor line goes up to 11.5W TDP, U line covers chips in the 15W to 25W range, while the M line covers 37W, 47W as well as 57W TDP space, with two to four cores and graphics up to GT2.
The high performance H processor line is yet another BGA package processor line that also aims for 37W, 47W and 57W TDPs, with quad-core processors and up to GT3 graphics with on-package cache memory.
Intel expects that high performing gaming and workstation PCs will go use these processors and they fit some thick clamshell designs, no Ultrabooks with 57W unless you would want to use one for welding.
Intel currently doesn’t detail the processor number and the number of SKUs but it is obvious that they will end up with quad-core Core i7 branding for QC1+ and QC2+ market segments.
Intel’s Haswell Goes 13W
Intel’s Haswell Y-series processors as we said a few weeks ago have yet launch. The current plan is to launch two Ivy SKUs in Q1 2013, both dual-cores, and later in 2013 Intel plans to replace them with Haswell Y series parts, with even lower TDP.
The faster one is called Core i7 3689Y and has two cores and two threads, as well as a base clock of 1.5GHz. With the help of Intel Turbo Boost 2.0, the top single-core turbo clock is an impressive 2.6GHz, while the maximum dual-core turbo clock stops at 2.4GHz, which is still impressive. This core comes with Intel HD graphics 4000 clocked between 350MHz and 860MHz with turbo.
This new core supports both DDR3 and DDR3L at 1600MHz, has 4MB of cache and impressively low 13W TDP. We have explained that SDP stands for Standard Dissipation Power and Intel expect it to be at 7W for this part.
The runner up is called Core i5 3439Y and has the same two cores and two threads with 1.5GHz base clock, but the single core turbo clock stops at 2.3GHz, while the dual-core top clock is 2.10GHz. The graphics speed, TDP and memory support remain the same, but there is a difference in cache size. Core i5 3439Y comes with 3MB instead of 4MB for Core i7 Y series 3689Y part.
Is Intel Really Catching ARM?
A new report suggests that Intel is close to matching ARM on power efficiency.
The study by Bernstein Research analysts said that the days of Intel being mocked because its power-hungry chips shortened the battery life of mobile devices could be over. Bernstein noted that the ARM camp has such a commanding lead in phones and tablets that Intel probably won’t make much of a dent in those markets for a couple of years — even with its energy-efficient chips.
But it said that both company’s chip types “are very close in terms of power efficiency and processing power.” It said that the fight between the ARM and Intel camps will heat up meaningfully as early as 2013, with likely damages on both sides and no winner. For its study, Bernstein compared Intel’s chip in a Motorola RAZR phone and a RAZR phone with an ARM chip. It also compared both chips in similar tablets outfitted with the Windows 8.
The bad news in the report for Intel was that ARM’s chips have become more powerful, making them “a very compelling choice” for consumers looking for low-end notebooks.
Intel Details 22nm SoC
Thanks to a long spate of bad luck over at AMD, Intel now finds itself in a rather safe market lead, at least in high-end and server markets. However, in the low-end and mobile, Intel has a lot of catching up to do.
ARM still dominates the mobile market and Intel is looking to take on the British chip designer with new 22nm SoCs of its own. Intel outlined its SoC strategy at the 2012 International Electron Devices Meeting in San Francisco the other day.
The cunning plan involves 3D tri gate transistors and Intel’s 22nm fabrication process, or in other words it is a brute force approach. Intel can afford to integrate the latest tech in cheep and cheerful 22nm Atoms, thus making them more competitive in terms of power efficiency.
Since Intel leads the way with new manufacturing processes it already has roughly a year of experience with 22nm chips, while ARM partners rely on 28nm, 32nm and more often than not, 40nm processes. Intel’s next generation SoCs will also benefit from other off-the-shelf Intel tech, such as 3D tri-gate transistors.
Will Lenovo Go Public In 2K14?
Lenovo’s parent firm Legend Holdings could float an initial public offering (IPO) as soon as 2014, according to the firm’s chairman.
Liu Chuanzhi, chairman of Legend Holdings told China Business News that the firm plans to list on the China A-share market between 2014 and 2016. Chuanzhi also reportedly said the company will invest $3.2bn by 2014 to develop its various businesses.
Legend Holdings is 36 percent owned by the Chinese state controlled Academy of Sciences, with a further 20 percent owned by the private investment firm China Oceanwide Holdings Group.
Legend Holdings also has venture capital and real estate interests outside of Lenovo Group. The firm’s system building operations however have gone from strength to strength since it bought IBM’s PC business back in 2005, and it is now heavily promoting its Yoga tablet-laptop hybrid device.
Earlier this year Gartner reported that Lenovo had overtaken HP to become the largest PC vendor, something that HP disputed by offering IDC’s figures. Regardless of HP’s protestations then, Lenovo is set to overtake HP as its PC business continues to grow while HP’s has been shrinking for some time.
Legend Holdings might want to cash in on Lenovo’s high flying status and a cash injection from an IPO could help the company invest in designing products for the smartphone and tablet markets.
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TSMC To Boost 28nm Production
TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.
TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.
But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.
Lenovo On The Rise
Lenovo has topped off a great 2012 with record sales figures and revenues, and claimed it took 15.6 percent of the PC market.
Lenovo is the PC maker that has bucked the industry trend of a shrinking PC market, posting faster than average industry growth for 14 consecutive quarters. All of that has left the firm announcing an 11 percent increase in second fiscal quarter sales to $8.7bn with profits of $162m, an increase of 13 percent over the same period last year.
Lenovo has managed to maintain the legendary status held by IBM’s Thinkpads and introduce its own low-cost models aimed at consumers. The firm has also been pushing smartphones in China and close to half of its revenues in its second fiscal quarter came from its home market.
Yang Yuanqing, chairman and CEO of Lenovo said, “Our global PC market share reached another historic high, moving us closer to our dream of becoming the worldwide PC leader. With four years’ effort, our consumer PC business has become the world’s number one in this segment for the first time. Our smartphone business in China, which we started only two years ago, has again strengthened its number two position,”
Is The x86 Falling
According to Mercury Research, worldwide shipments of x86 parts saw a sharp decline in Q3. Researchers claim the drop was the biggest seen in more than a decade, 9 percent year-over-year.
Despite the drop, Intel still has something to brag about. Intel’s share hit 83.3 percent, up from 80.6 percent sequentially. AMD’s share dropped to 16.1, down from 18.8 percent, while VIA garnered a 0.6 percent share.
Mercury Research analyst Dean McCarron told PC World that both AMD and Intel experienced declines, but AMD took more of the hit than Intel.
“AMD was simply hit by what OEMs saw in the markets… and hitting the brakes,” he said.
What’s more, the third quarter is supposed to be traditionally strong for x86 chipmakers, thanks to the back-to-school shopping frenzy. However, x86 CPU shipments dropped 4 percent in Q2, followed by 9 percent in Q3. Things aren’t looking good for Q4, either.
“The key is how the macroeconomic situation is, which is not looking good for the next couple of quarters,” McCarron said. “Hopefully things will improve next year.”