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Intel Going High-Performance
Intel has been hinting that it is developing high-performance lower power server chips to speed up cloud services or data-intensive applications like analytic.
Apparently this will involve the integration of a converged fabric controller inside future server chips. This will make server communication faster while helping data centers operate at peak efficiency.
Raj Hazra, vice president of the Intel Architecture Group said that Fabric virtualises I/O and ties together storage and networking in data centres. If you add in an integrated controller you get a wider pipe to scale performance on cloud platforms. He said that the integrated fabric controller will appear in the company’s Xeon server chips in a few years as part of Intel’s cunning plan to bring the controller to the transistor layer.
TSMC Makes Expansion Plans
TSMC is expected to spend $10 billion next year in capital works as Apple plans to contract the outfit to build its next-generation processors.
According to the Chinese-language Economic Daily News TSMC has informed the equipment suppliers of its decision to hike capital expenditure for 2013 to US$10 billion. This indicates that TSMC has overcome technical problem with 20nm process, which Apple’s next-generation processors are said to use.
It also suggests that Jobs’ Mob is speeding up its reduction of work it gives Samsung. Apple has reportedly sent around 200 design engineers to help TSMC get familiar with the company’s next-generation processor designs at TSMC’s facility in Central Taiwan Science Park.
Oracle Agrees To Support Itanium
Oracle has committed to supporting the Intel Itanium processor on servers, ending what has been a long running feud with HP.
Oracle’s announcement is well timed because it was just a few weeks ago that a court ordered it to do just that. It did say however, that it will appeal the court’s judgment.
This should put an end to what has been a rather grubby row between Oracle and HP that centered around whether or not the two firms have an agreement about developing software for the IA-64 architecture.
The row, which was not helped by former HP CEO Mark Hurd’s abrupt firing from HP and hiring at Oracle, pulled in Intel and saw Oracle force HP into admitting that it had a secretive deal with Intel for development.
Upon hearing the court’s decision in August, Oracle couldn’t resist taking another dig at HP and its insistence that Oracle continue supporting a processor that as far as it was concerned could die.
“We know that Oracle did not give up its fundamental right to make platform engineering decisions in the 27 words HP cites from the settlement of an unrelated employment agreement. HP’s argument turns the concept of Silicon Valley ‘partnerships’ upside down,” said Oracle spokeswoman Deborah Hellinger then. “We plan to appeal the Court’s ruling while fully litigating our cross claims that HP misled both its partners and customers.”
It looks like Oracle has no choice however, and in a statement it said that it will abide by the decision of the court.
“Previously, Oracle announced that it would stop developing new versions of its software on Itanium microprocessors. For example, that meant version 12c of the Oracle database due out in early 2013 would not be available on Itanium,” it said.
Samsung Goes HSA
It seems that the IFA 2012 show in Berlin was a good show for AMD as well, or to be precise, it was good for the HSA (Heterogeneous System Architecture) Foundation founded by AMD, ARM, Texas Instruments, Imagination and Mediatek. Samsung has joined up alongside six new members.
The HSA Foundation was created back in June at AMD’s Fusion Developer Summit as a foundation that will deliver new user experiences through advances in computing architectures in order to improve power efficiency, performance, programmability, portability across computing devices and general support of software across a broad spectrum of devices in order to remove the need for code rewriting for various different platforms.
Senior Manager of Technology Marketing at AMD, Sasa Marinkovic, noted on the AMD blog that there is no doubt that the HSA Foundation is off to a good start and in addition to Samsung, they are more than happy to welcome six additional companies including Apical, Arteris, MulticoreWare, Sonics, Symbio and Vivante.
Will Qualcomm Buy AMD?
This wild rumor is not completely without merit, as Qualcomm did acquire a piece of AMD, or AMD’s handheld graphics business to be precise, and it would not be too surprising to see Qualcomm after the whole company sometime in the future.
Samsung on the other hand is not an entirely impossible choice, but at this point it won’t be acquiring AMD either.
It looks like market players want to see the acceptance of Windows RT that will finally prove how important ARM processors really are and knowing AMD, the worst is behind them, as 2012 was the year of many chances, cancelation and anything but good execution for them.
Meanwhile Qualcomm is doing great in the ARM market, although its Snapdragon S4 line suffers from insufficient 28nm production, but due to its on-chip LTE implementation the chips are sought after, especially in the United States market.
Intel Preparing New SSDs
In addition to the recent price drop for its 320, 330 and 520 series SSDs, Intel is preparing a slight refresh scheduled to launch in Q3 and Q4 2012, according to the recently leaked roadmap at Chinese.VR-Zone.com.
The roadmap kicks off with a rather interesting entry-level 300 series that will apparently get a new 335 series update in Q3 2012. According to the roadmap, the 335 series will initially launch in 240GB capacity and get 80 and 180GB model update in Q1 2013. The new 335 series will most likely still be based on the same SF-2281 controller, be available in 2.5-inch form factor with the SATA 6Gbps interface, and will probably be paired up with a tweaked firmware and a new 20nm NAND flash memory.
Super Talent Outs New SSDs
Super Talent has announced a new line of SATA III SSDs, the Super Talent SuperNova. Aimed at the business market, SuperNova SSDs will be available in 128 and 256GB capcities.
Although it has not announced any details regarding the new SuperNova lineup in its official press release, Super Talent did note that SuperNova features high transfer speeds and “the most secure encryption” on the planet, as well as the proprietary RAISE technology that virtually eliminates unrecoverable read errors.
After some digging around we managed to find that SuperNova is based on Sandforce SF-2200 controller paired up with ONFI Synchronous MLC NAND chips that should provide enterprise level of reliability. The sequential performance is set at 555MB/s read and 525MB/s for write while random 4K performance is at 90K IOPS read and 85K IOPS write, for both 128 and 256GB models.
Sprint To Offer Ultrabooks
Sprint has become the first U.S. mobile operator to offer an ultrabook, which is being sold with a 3G/4G mobile hotspot device at no added cost.
Sprint and Lenovo announced the 13.3-in. IdeaPad U310 ultrabook with a hotspot device for $799.99, subject to a two-year Sprint mobile broadband service agreement, the companies said. Three months of broadband service will be available for free.
The hotspot is either a MiFi 3G/4G mobile hotspot by Novatel Wireless or the Overdrive Pro 3G/4G mobile hotspot by Sierra Wireless. Data plans for the hotspot start at $35 a month for 3GB, or $50 for 6GB.
Sprint said the offer is focused on small business users and students. It will be available through Sprint telesales at 800-Sprint1, Sprint business sales and business partners and on the Sprint ultrabook Web site.
The IdeaPad U310 features Lenovo RapidBoot, allowing it to resume from hibernate status in less than seven seconds, and BootShield for fast booting even with multiple apps installed.
Intel Goes Wireless
Maho Bay is a desktop platform wrapped around the recently launched Ivy Bridge desktop processor and Intel plans to enrich this platform with a Wireless mini card offer of its own.
The plan is to make new SKUs based on half Minicard (mPCIe) standard and offer it with its boards that have support for PCIe 1X or faster. Maho Bay also allows some combinations with Sandy Bridge processors and will allow the use of these mini Wireless cards on older processors with new boards. It looks like the Panther Point chipset is necessary even for older Sandy Bridge processors on Maho Bay platform.
The top range card with premium performance is Intel Centrino Ultimate N 6300, and the card has virtually the same specification like its mobile brother. It supports Intel Wireless Display as well as Intel My Wifi technology and quick driver connect.
Since it is using 3×3 antennas and MIMO standard it us capable of achieving speeds of 450Mbits per second and it does support multiple streams. It supports dual band 2.4 + 5 GHz and Intel Vpro. This is still a 802.11n based product as Intel hasn’t really jumped the gun to support 802.11ac in 2012.
It looks like it is too early for Intel to embrace this new standard due to its very limited market penetration.
Will Chipmakers Make Cuts This Year?
Gartner is warning that worldwide wafer fab equipment spending is on pace to total $33 billion in 2012 which is a decline of 8.9 percent from 2011.
Gartner analysts warned that this is a sign of an industry in downturn and said the market will return to growth in 2013 with WFE spending projected to surpass $35.4 billion, a 7.4 percent increase from 2012. Bob Johnson, research vice president at Gartner said 2012 spending was strong at the beginning of the year, as foundries and other logic manufacturers ramped up sub-30-nm production.