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Will Qualcomm Unveil The Snapdragon 820 SoC
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Qualcomm is set to unveil its new Snapdragon 820 SoC on August 11 in LA and more details are being leaked than you would see at a Welsh leak recipe contest.
It appears that the new Snapdragon 820 will have the catchy title MSM8996 and it promises some significant performance improvements in key areas. We already know that it will not be catching fire, but it also has a 40 per cent GPU performance increase with its A530 GPU.
The device is also claimed to have a 30 per cent power improvement with 64b of shared virtual memory with the CPU.
Another big area of improvement is the Hydra CPU, which claims a 35 percent improvement compared to the Snapdragon 810.
The Snapdragon 820 will support 4k60 entertainment and high-speed data connectivity.
There are rumours that there will be a QFE3100 Envelope Tracking system this will not speed up mail in the criminally slow Italian Post Office, but should create a lower power and a thermal footprint. A dedicated low power sensor is integrated for always on use.
Another major upgrade compared to the older SoC is a switch from 20nm to 14nm FinFET manufacturing process. We are still expecting the Xiaomi Mi5 to be the first one to use it.
Will Qualcomm Give Some Workers The Boot?
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Qualcomm is undergoing major restructuring and one side-effect of the overhaul is that some 4,000 jobs might be slashed.
The company, according to our well informed industry sources, will announce this during the upcoming Qualcomm Q3 FY15 earnings conference call that Is scheduled for July 22. We could not find out which jobs will be affected, but we expect that the company will shad more light on it during the call.
In December 2014 the company announced that it would slash some 900 jobs and it ended up slashing roughly 1,500 jobs. This will be the first major announcement and it comes at a bad time, as the company’s sales numbers are not that great. Qualcomm lost its highest end customer, Samsung, and companies like HTC who are using the Snapdragon 810 are not too happy about company’s highest end SoC offering.
Qualcomm has around 31,300 employees, which is still not that much considering that Intel has some 100,000, but its main SoC competitor, MediaTek, has just over 10,000 employees making its operational costs much smaller.
If the number of employees 31,300 didn’t change in recent months, slashing 4,000 jobs would mean cutting the 12.8 percent of the workforce. This is a major adjustment, no question about it.
Still, we believe that the server division will start making some money in 2016 and the new Snapdragon 820 is expected to start shipping later this year. In the long run, the company is more than fine, it is just that the competitors have changed from Nvidia and Intel to MediaTek.
Qualcomm Has No Plans To Split
US chipmaker Qualcomm has told the world that it will not be dumping its “essentially useless chip making” business.
Hedge fund Jana Partners said in April that Qualcomm would make a pile more dosh if it just stuck to being a patent troll and stopped trying to flog “essentially worthless” chips.
Apparently Qualcomm thought about it. Executive Chairman Paul Jacobs the idea has been talked about for a long time, but came to the conclusion that the status quo contained a lot more “synergies.” Apparently synergies are a good thing to have about the place, particularly if you have a breeding pair.
Jacobs was less optimistic about Jana Partners’ idea which was apparently full of dis-synergies which might eat the synergies – or just diss them in public.
Executive Chairman Paul Jacobs said all this intensifying industry competition was not enough to spin off his chip business from its patent-licensing business.
Jacobs said, however, that the company is always evaluating its options and that the situation could change in the future, so maybe there a future for a Qualcomm troll walloping other companies with dis-synergies.
RedHat Goes PaaS With Linux
Red Hat has announced the release of OpenShift Enterprise (OSE) 3, a new version of its Platform-as-a-Service offering.
Based on Red Hat Enterprise Linux (RHEL)7, Openshift is built on Docker Linux containers with Kubernetes orchestration using technology developed in collaboration with Google.
The news comes in a busy week for Red Hat, which has also announced a new productivity tie-up with Samsung and taken a leading role in the formation of a new alliance known as the Open Container Project to standardise containers.
Users will have access to a wide range of apps via the Red Hat Container Certification Programme. Middleware solutions including Red Hat JBoss Enterprise, Web Server (Tomcat) and JBoss A-MQ messaging are also included.
Included are a number of tools to help developers create and collaborate, with web, command line, and integrated development environment interfaces. Options include direct code-push from GIT and source to image building. There is also flexibility for deployment, rollback and integration.
In addition, a preview of Openshift Dedicated has been released. The public cloud service based on OpenShift 3 will succeed Openshift Online, which already hosts 2.5 million applications online, allowing businesses to quickly build, launch and deploy bespoke apps.
Ashesh Badani, vice president and general manager, OpenShift, Red Hat, said, “This release of OpenShift Enterprise 3 employs open source containers and orchestration practices to change the developer experience and move the platform in the direction of what customers are asking for – a flexible platform for a microservices architecture.
“Our continued upstream work in the Docker and Kubernetes communities enable us to deliver the most updated technology platform for developers and operators, enabling them to remain competitive through quicker innovation.”
To assist users, Red Hat is offering a range of enterprise administrator courses to teach users how to deploy, configure and manage the system, which can result in a Red Hat Certificate of Expertise in Platform as a Service – a worthy certificate for any office wall.
OpenShift 3 is available now with bespoke pricing models based of socket and core pairings.
Is The Chip Market On The Rebound
Don’t let anyone fool you, the chipmarket is still not doing that well and there are a few problems to be sorted out before real money will be made.
FC Tseng, vice chairman for foundry VIS said that handset makers have too much inventory in their warehouses and the much hyped IoT market boom has not yet arrived.
In fact it is looking like 2015 will not be as good as 2014, which was pretty good at least as far as VIS was concerned.
Semiconductor demand for IoT applications will emerge, but no one has really worked out what the key drivers of IoT market growth will be, Tseng said.
Smartphones, devices such as watches, bracelets and glasses are all being identified as the popular applications when it comes to wearables and the Internet of Things.
VIS forecast that the global 2015 semiconductor market will increase 5 per cent in production value to $358 bn, while the foundry sector will grow by a larger 10 per cent on year to about S$50 bn.
VIS chairman and president Leuh Fang warned that the company has seen a low visibility of customer orders for the third quarter of 2015.
VIS reported record revenues and profits for 2014 and has been spending on capital expenditure like a mad thing in 2015.
Is Intel Supporting Open-Source?
Intel has suddenly made some interesting hardware less interesting to open sourcers by insisting that its i915 DRM kernel graphics driver for upcoming Skylake and Broxton hardware demands some binary-only firmware blobs.
According to Phoronix these first i915 DRM firmware blobs are for Skylake and Broxton for the GuC and DMC.
DMC is the Display Microcontroller used by Skylake (Gen9) within the display engine to save and restore its state when entering into low-power states and then resuming. It saves and restores display registers across low-power states separate of the kernel.
Intel said that the firmware blobs are required by the DRM driver rather than being an optional add-on.
The license of these firmware blobs also indicate that redistribution is only allowed in binary form without modification. Beyond that, “no reverse engineering, decompilation, or dis-assembly of this software is permitted.”
Basically this will kill off any desire for Open Source enthusiasts to touch Skylake, although we doubt Intel will be too worried – they are a very nice couple. In any event AMD apparently uses something similar to protect bits of its operation.
Still Intel is shipping these firmware files early so everyone knows they are there.
Can TSMC Beat Samsung?
TSMC has said that it is confident that it can beat Samsung Electronics in ramping up production on its 10nm lines.
Samsung disclosed during a recent technology forum in the US that the company plans to enter mass production of chips using its 10nm FinFET process by the end of 2016,.
But in a statement TSMC claimed it could the outfit said the way things are shaping up it could beat that time table. TSMC continued that in the 10nm FinFET race, Intel will be its major competitor.
We expect to hear a bit more about TSMC’s plans at its Taiwan Technology Symposium 2015 on May 28. At the upcoming event, the foundry is expected to talk about the progress and development of its FinFET manufacturing nodes.
TSMC chairman Morris Chang remarked earlier in 2015 that TSMC expects to gain a majority of market share in the FinFET segment in 2016.
Intel is also expected to release its first chips made using 10nm process technology as early as in the middle of 2016.
Qualcomm Strengthens IoT Lineup
Qualcomm is wedging its foot more firmly in the Internet of Things (IoT) door by announcing a range of moves to secure its position in the market.
The first announcement sees the firm expanding its Internet of Everything (IoE) platform with the addition of six new ecosystem providers: Ayla Networks, Exosite, Kii, Proximetry, Temboo and Xively by LogMeIn.
“This will further simplify the development of devices that use WiFi to connect to the IoE by increasing cloud service flexibility and making these solutions available in a broader global reach,” Qualcomm said.
Qualcomm has also introduced two connectivity solutions, the QCA401x and QCA4531, which bring WiFi capabilities to connect products across development platforms and “give customers an expedited and cost-effective path to deployment”.
The QCA401x is designed to ease manufacturer demand for increased computing and memory while lowering size, cost and power consumption, Qualcomm said.
It features a fully integrated micro controller unit with up to 800KB of on-chip memory and an expanded set of interfaces to directly interconnect with sensors, display and actuators, further reducing system cost, size and complexity.
The QCA401x also includes a suite of communication protocols including Wi-Fi, IPv6, and HTTP, as well as an advanced security feature designed to maximise security in IoT devices.
The QCA4531 is a low-cost turnkey solution that brings high-performance connectivity with a user-programmable Linux/OpenWRT environment.
It is designed to serve as an IoT node taking advantage of the Linux framework and as a hub to enable an IoT Ecosystem.
“As the [IoT] ecosystem expands, the QCA4531 is ideal for multi-protocol bridging and communication, bringing together multiple wireless medium and bridging between different ecosystems,” said Qualcomm.
The QCA4531 can function as an Access Point supporting up to 16 simultaneous devices, and is also power-optimised to enable appliances to meet international standards for energy efficiency.
The firm also banged on about the development of its subsidiaries Qualcomm Technologies, Qualcomm Atheros, Qualcomm Life, and Qualcomm Connected Experiences, and their progress across its range of IoT technologies.
Broadly, this includes an increased focus on providing better connectivity in the smart home with the AllSeen Alliance, as well as the development of more wearables in more countries, deploying more connected cars, more active engagements in smart city developments and partnering with more customers for connected healthcare.
“Driven by the significant growth and diversity of interconnected devices, Qualcomm companies are delivering the solutions and collaborating with technology leaders to empower manufacturers to create the best connected experiences in homes, businesses, cars and cities,” the firm said.
Qualcomm also announced additional features in its AllPlay smart media platform, including Bluetooth to WiFi re-streaming, custom audio settings and optimised synchronisation. The new AllPlay feature combines Bluetooth and WiFi for “whole home streaming”.
This means that all local or cloud-based music on a consumer’s smartphone can be streamed to any Bluetooth-compatible AllPlay speaker and then re-streamed over WiFi to multiple AllPlay speakers, all in sync.
This allows simple wireless connectivity to individual speakers or an entire home audio system over the user’s existing home WiFi network, providing an advantage over Bluetooth-only speakers which are limited to one-to-one streaming.
“The range and capacity of WiFi, coupled with the ubiquity of Bluetooth, is a game-changing combination for manufacturers and consumers alike,” said Sy Choudhury, senior director of product management at Qualcomm.
“AllPlay device manufacturers like Hitachi and Monster can now offer their customers more connectivity options and access to myriad streaming services throughout their home with this new capability.”
Qualcomm announced last month that it has teamed up with Dutch semiconductor maker NXP to bolster its near field communication offering, expanding the technology outside the smartphone and into IoT devices.
NXP’s embedded secure element will be integrated across Qualcomm’s Snapdragon 800, 600, 400 and 200 processor-based platforms.
The new offering features a module variant derived from the recently launched NXP PN66T NQ220 module, now named the NQ220.
Qualcomm Has A Plethora Of Automobile Modems
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Qualcomm had an IoT event in San Francisco yesterday and the company wanted to talk a bit more about IoT, also known as Internet of Things. They started off with a catchy phrase – Internet of Hype to Internet of Everything.
Dave Aberle said that up to a billion dollars in revenue is coming from the non-mobile market. More than 10 pecent of Qualcomm revenue will come from the non-headset market. They call this market Internet of Everything, but we believe that not all of that market should be called IoT.
IoT is not just the wearable market; it is car modems, connected speakers, action cameras, some smart SanDisk storage solutions, home automation kit and more. Aberle mentioned that Qualcomm has 40 car design wins in the market with 15 different OEMs. We saw some names including Audi on the slide, but the list of obviously much longer.
Qualcomm is the leader in connected car and 4G LTE market, while Nvidia is the leader in Infotainment car systems, having some huge customers behind it, including the Volkswagen Group.
Qualcomm wants to expand its presence in IoT, including automotive solutions, and we expect more IoT designs from them in the near future.
ARM Sets New mBed Standard
ARM has bought in a new assurance standard to work with embedded devices.
The ARM mbed Enabled program aims to increase the deployment rate of Internet of Things (IoT) products and supporting technologies by giving partners the ability to label them as interoperable mbed-based devices.
Arm said that the accreditation program will cover solutions entering a broad range of developer markets; from silicon and modules to OEM products and innovative cloud services. Accreditation will be free of charge.
ARM Zach Shelby, vice president of IoT business marketing, said that ARM mbed Enabled accreditation will assure the diverse IoT ecosystem that they are using technologies backed up by an expert community of innovators,.
“This will also instill confidence in end markets where interoperability, trust and security standardisation is required to unlock commercial potential.”
Since the ARM mbed IoT Device Platform was announced in October 2014, the mbed Partner ecosystem has continued to grow from the initial 24 launch partners. Today, 8 new partners are being announced including Advantech, Athos, Captiva, Espotel, Maxim Integrated, MegaChips, SmeshLink, and Tieto.