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Will Intel Release Skylake This Year?
Intel has confirmed that it will release Core M processors this year based on its new Skylake chip design.
Intel CEO Brian Krzanich said at the Goldman Sachs Technology and Internet conference that the the new Core M chips are due in the second half of the year and will also extend battery life in tablets, hybrids, and laptop PCs.
The new chips will mean much thinner tablets and mobile PCs which will make Apple’s Air look decidedly portly. Intel’s Core M chips, introduced last year, are based on the Broadwell but the Skylake chips should also improve graphics and general application performance.
The Skylake chips will be able to run Windows 10, as well as Google’s Chrome and Android OSes, Krzanich said. But most existing Core M systems run Windows 8.1, and Intel has said device makers haven’t shown a lot of interest in other OSes. So most Skylake devices will probably run Windows 10. Chipzilla is expected to give more details about the new Core M chips in June at the Computex trade show in Taipei.
Skylake systems will also support the second generation of Intel’s RealSense 3D camera technology, which uses a depth sensor to create 3D scans of objects, and which can also be used for gesture and facial recognition. The hope is that the combination of Skylake and a new Windows operating system will give the PC industry a much needed boost.
In related news, Intel announced that socketed Broadwell processors will be available in time for Windows 10.
Qualcomm Goes Ultrasonic
Qualcomm has unveiled what it claims is the world’s first ‘ultrasonic’ fingerprint scanner, in a bid to improve mobile security and further boost Android’s chances in the enterprise space.
The Qualcomm Snapdragon Sense ID 3D Fingerprint technology debuted during the chipmaker’s Mobile World Congress (MWC) press conference on Monday.
The firm claimed that the new feature will outperform the fingerprint scanners found on smartphones such as the iPhone 6 and Galaxy S6.
Qualcomm also claimed that, as well as “better protecting user data”, the 3D ultrasonic imaging technology is much more accurate than capacitive solutions currently available, and is not hindered by greasy or sweaty fingers.
Sense ID offers a more “innovative and elegant” design for manufacturers, the firm said, owing to its ability to scan fingerprints through any material, be it glass, metal or sapphire.
This means, in theory, that future fingerprint sensors could be included directly into a smartphone’s display.
Derek Aberle, Qualcomm president, said: “This is another industry first for Qualcomm and has the potential to revolutionise mobile security.
“It’s also another step towards the end of the password, and could mean that you’ll never have to type in a password on your smartphone again.”
No specific details or partners have yet been announced, but Qualcomm said that the Sense ID technology will arrive in devices in the second half of 2015, when the firm’s next-generation Snapdragon 820 processor is also tipped to debut.
The firm didn’t reveal many details about this chip, except that it will feature Kryo 64-bit CPU tech and a new machine learning feature dubbed Zeroth.
Qualcomm also revealed more details about LTE-U during Monday’s press conference, confirming plans to extend LTE to unused spectrum using technology integrated in its latest small-cell solutions and RF transceivers for mobile devices.
“We face many challenges as demand for data constantly grows, and we think the best way to fix this is by taking advantage of unused spectrum,” said Aberle.
Finally, the chipmaker released details about a new a partnership with Cyanogen, the open-source outfit responsible for the CyanogenMod operating system.
Qualcomm said that it will provide support for the best features and UI enhancements of CyanogenMod on Snapdragon processors, which will be available for the release of Qualcomm Reference Design in April.
The MWC announcements follow the launch of the ARM Cortex-based Snapdragon 620 and 618 chips last month, which promise to improve connectivity and user experience on high-end smartphones and tablets.
Aberle said that these chips will begin to show up in devices in mid to late 2015.
Intel Gives Exascale A Boost
Intel’s exascale computing efforts have received a boost with the extension of the company’s research collaboration with the Barcelona Supercomputing Center.
Begun in 2011 and now extended to September 2017, the Intel-BSC work is currently looking at scalability issues with parallel applications.
Karl Solchenbach, Intel’s director, Innovation Pathfinding Architecture Group in Europe said it was important to improve scalability of threaded applications on many core nodes through the OmpSs programming model.
The collaboration has developed a methodology to measure these effects separately. “An automatic tool not only provides a detailed analysis of performance inhibitors, but also it allows a projection to a higher number of nodes,” says Solchenbach.
BSC has been making HPC tools and given Intel an instrumentation package (Extrae), a performance data browser (Paraver), and a simulator (Dimemas) to play with.
Charlie Wuischpard, VP & GM High Performance Computing at Intel said that the Barcelona work is pretty big scale for Chipzilla.
“A major part of what we’re proposing going forward is work on many core architecture. Our roadmap is to continue to add more and more cores all the time.”
“Our Knights Landing product that is coming out will have 60 or more cores running at a slightly slower clock speed but give you vastly better performance,” he said.
MediaTek Shows Off New IoT Platform
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MediaTek had announced a new development platform, as part of its MediaTek Labs initiative.
The LinkIt Connect MT7681 platform is based on the MT7681 SoC, designed for simple and affordable WiFi-enabled Internet of Things (IoT) devices. The company also released a software development kit (SDK) and hardware development kit (HDK) for the new platform.
The HDK includes the LinkIt Connect 7681 development board, which features the MT7681 chipset, micro-USB port and pins for various I/O interfaces. The chipset can be used in WiFi station or access point modes.
In station mode, the chip connects to a wireless access point and communicates with web services or cloud servers, which means it could be used to control smart thermostats. However, in access point mode, the chipset can communicate with devices directly, for example to control smart plugs or light bulbs using a smartphone.
“The world is rapidly moving towards connecting every imaginable device in the home, yet developers often have to spend too much effort on making their products Wi-Fi enabled,” said Marc Naddell, VP, MediaTek Labs. “The MediaTek LinkIt Connect 7681 platform simplifies and accelerates this process so that developers can focus on making innovative home IoT products, whatever their skill level.”
MediaTek Labs was launched in September 2014 and its goal is to promote a range of innovative MediaTek platforms, namely frugal devices such as wearables, IoT and home automation hardware.
Will Intel Assist Apple?
Apple is apparently having problems getting its partners to make 3-D transistors that go.
Drexel Hamilton’s chip analyst Rick Whittington [no really] made a comment that Intel might be getting ready to bail Apple out while he was having a chat about Micron. In passing, Whittington noted problems had by Taiwan Semiconductor and Samsung Electronics trying to produce 3-D transistors in any useful yield.
He noted that Intel has mastered 3-D transistors, and said that it would be very good for Intel if neither Samsung or TSM can do FinFET this next year; puts them in line to supply Apple’s internal foundry needs.
However he admitted that it was more that TSM/Samsung would operate FinFET under very low yield output and keep capacity tight.
Of course if Jobs’ Mob don’t want that they can always rush into the loving arms of Chipzilla – again. As happened with Saphire glass Apple has shown that it can dump a partner quickly if it does not move fast enough.
Intel Investing Big In Isreal
Intel is investing a further $550 million in Israel, more specifically in the upgrade of its Fab 28 in Kiryat Gat.
According to Israel21c, this will bring the total scope of Intel investments in Israel to over $6 billion since 2006. The Kiryat Gat facility is likely to be one of the first Intel 10nm fabs.
Israeli Ministry of Economy official Ziva Eger said the investment will help create thousands of jobs and reinforce the country’s standing as a world leader in technology.
“The agreement signed today between the Industrial Cooperation Authority and Intel is another expression of Intel’s contribution by way of its purchase of equipment, new technologies and Israeli products developed together with Intel,” said CEO of Intel Israel Maxine Fassberg.
Fab 28 currently churns out 22nm silicon for Intel. The fab was passed over for the 14nm upgrade. A source familiar with the matter told us that Israel competes with Ireland for every node upgrade.
“We lost 14nm to Ireland and won 10nm,” the source said.
Israel is currently in a better position to offer incentives and subsidies for such investments, as Ireland’s ‘business-friendly’ tax policies are being scrutinized by the European Union.
Intel is expected to launch the first 10nm CPU in 2016, followed by 7nm parts a couple of years later.
Intel To Add Broadwell To NUC Series
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Intel is planning to update its rather successful NUC (Next Unit of Computing) series and as you can expect, they will come with Broadwell CPUs inside.
Intel isn’t hiding the external design of the new cases and there is a dominant yellow connector at the front of the new NUC, and this one should be providing charging power even when the device is turned off.
The board comes with either M2 storage or single SATA and there will be two different designs one exclusively for M2 drive and the second taller that will be able to take 2.5 inch SSD or HDD as well.
We will probably learn more details at CES 2015 that is about to start in less than three weeks from now, but the Broadwell in this small form factor will get a speed boost and some future prove technologies such as M2 SSD support.
We are running Core i5 4200 powered NUC with Windows 10 and it really works great powered by 240GB Kingston mS200 mSata SSD and Impact SO DIMM memory. These machines takes less than half an hour to assemble and boot into windows, including Windows 10 and make a perfect choice for the lovers of quiet computing.
The new version will obviously run at least slightly faster than the one we are testing and the marketing is excluding about “the one with the yellow USB connector”.
Intel Shows New IoT Platform
Intel showed off a new platform which it claims makes it easier for companies to create Internet-connected smart products using its chips, security and software.
Intel’s platform is like Lego and based on the chipmaker’s components and software for companies to create smart, connected devices. The only difference is that you can’t enact your own Doctor Who scene from it.
Doug Davis, head of Intel’s Internet of Things business, said at a launch event in San Francisco it will make it a doddle to connect to data centres in order analyse data collected from devices’ sensors.
Intel’s chips should compute capability in end-point devices that scale from its highest performance Xeon processor to the Quark family of products.
Intel’s Internet of Things Group had $530 million in revenue in the September quarter. That accounted for just 4 percent of Intel’s total revenue in the quarter, but it grew 14 percent over the previous year, which was faster than the company’s PC business.
Dell, SAP, Tata Consultancy, Accenture and other companies are working with the new reference model, Davis said.
Ericsson Goes After Xiaomi
December 22, 2014 by admin
Filed under Smartphones
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Ericsson has thrown a spanner into Chinese firm Xiaomi’s expansion plans, and has reportedly stopped it from selling handsets in India.
According to reports, this is already happening. We have asked Ericsson to confirm its role and what it wants to say about it. It told us that the reports are true and that it is ready to defend itself.
“It is unfair for Xiaomi to benefit from our substantial R&D investment without paying a reasonable licensee fee for our technology. After more than 3 years of attempts to engage in a licensing conversation in good faith for products compliant with the GSM, EDGE, and UMTS/WCDMA standards, Xiaomi continues to refuse to respond in any way regarding a fair license to Ericsson’s intellectual property on fair, reasonable and non-discriminatory (FRAND) terms,” it said in a statement.
“Ericsson, as a last resort, had to take legal action. To continue investing in research and enabling the development of new ideas, new standards and new platforms to the industry, we must obtain a fair return on our R&D investments. We look forward to working with Xiaomi to reach a mutually fair and reasonable conclusion, just as we do with all of our licensees.”
Xiaomi has responded to Bloomberg but it declined to say too much until it has access too all of the information.
“Our legal team is currently evaluating the situation based on the information we have,” said the spokesperson. “India is a very important market for Xiaomi and we will respond promptly as needed and in full compliance with India laws.”
The banning on the sale of devices was approved by a court in Delhi India, according to reports, and is based on an Ericsson claim on eight patents that it owns.
Xiaomi has bold plans for its own future and sees itself competing against rivals like Samsung and Apple. It has given itself between five and 10 years to do this, and will presumably want to include the Indian market in those plans.
Intel’s Security Exec Jumps Ship
Michael Fey has left Intel Security Group to become chief operating officer at Blue Coat. Blue Coat is apparently not the traditional garb of a British Holiday Camp entertainer, but apparently a privately owned network security company.
Fey was one of the few top McAfee managers to stay with the company after it was bought by Intel in 2011. McAfee is now part of Intel Security Group, where Fey had been chief technology officer. Fey said that his role at Blue Coat would be “very similar” to his old job but he was allowed to focus on the cloud and the advanced threats space more.
“Blue Coat had tremendous growth behind the scenes and now I get to focus on taking that growth and trying to get it to the billion-dollar revenue mark,” he told Reuters.
Since the $7.7 billion acquisition by Intel, McAfee has lost senior managers and key talent in technology development, research and sales. At Blue Coat, Fey will replace David Murphy, who will stay on as a strategic adviser to the board.