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Intel Makes Changes To Haswell
Intel has started dividing its mobile market segments into processors lines, where the Y processor line goes up to 11.5W TDP, U line covers chips in the 15W to 25W range, while the M line covers 37W, 47W as well as 57W TDP space, with two to four cores and graphics up to GT2.
The high performance H processor line is yet another BGA package processor line that also aims for 37W, 47W and 57W TDPs, with quad-core processors and up to GT3 graphics with on-package cache memory.
Intel expects that high performing gaming and workstation PCs will go use these processors and they fit some thick clamshell designs, no Ultrabooks with 57W unless you would want to use one for welding.
Intel currently doesn’t detail the processor number and the number of SKUs but it is obvious that they will end up with quad-core Core i7 branding for QC1+ and QC2+ market segments.
Intel’s Haswell Goes 13W
Intel’s Haswell Y-series processors as we said a few weeks ago have yet launch. The current plan is to launch two Ivy SKUs in Q1 2013, both dual-cores, and later in 2013 Intel plans to replace them with Haswell Y series parts, with even lower TDP.
The faster one is called Core i7 3689Y and has two cores and two threads, as well as a base clock of 1.5GHz. With the help of Intel Turbo Boost 2.0, the top single-core turbo clock is an impressive 2.6GHz, while the maximum dual-core turbo clock stops at 2.4GHz, which is still impressive. This core comes with Intel HD graphics 4000 clocked between 350MHz and 860MHz with turbo.
This new core supports both DDR3 and DDR3L at 1600MHz, has 4MB of cache and impressively low 13W TDP. We have explained that SDP stands for Standard Dissipation Power and Intel expect it to be at 7W for this part.
The runner up is called Core i5 3439Y and has the same two cores and two threads with 1.5GHz base clock, but the single core turbo clock stops at 2.3GHz, while the dual-core top clock is 2.10GHz. The graphics speed, TDP and memory support remain the same, but there is a difference in cache size. Core i5 3439Y comes with 3MB instead of 4MB for Core i7 Y series 3689Y part.
Is The x86 Falling
According to Mercury Research, worldwide shipments of x86 parts saw a sharp decline in Q3. Researchers claim the drop was the biggest seen in more than a decade, 9 percent year-over-year.
Despite the drop, Intel still has something to brag about. Intel’s share hit 83.3 percent, up from 80.6 percent sequentially. AMD’s share dropped to 16.1, down from 18.8 percent, while VIA garnered a 0.6 percent share.
Mercury Research analyst Dean McCarron told PC World that both AMD and Intel experienced declines, but AMD took more of the hit than Intel.
“AMD was simply hit by what OEMs saw in the markets… and hitting the brakes,” he said.
What’s more, the third quarter is supposed to be traditionally strong for x86 chipmakers, thanks to the back-to-school shopping frenzy. However, x86 CPU shipments dropped 4 percent in Q2, followed by 9 percent in Q3. Things aren’t looking good for Q4, either.
“The key is how the macroeconomic situation is, which is not looking good for the next couple of quarters,” McCarron said. “Hopefully things will improve next year.”
Intel’s Core i7 2700K Discontinued
The Core i7 2700K, an unlocked 3.5GHz Sandy Bridge part, will meet its marker even sooner than many expected. Intel has decided that this processor launched in Q4 2011 and currently priced at $342 for boxed version is ready for processor discontinuance notice as soon as Q4 2012.
This means that in this quarter Intel plans to take last orders for the processor and will continue to ship them to customers until the EOL or end of lifecycle for this product that is planned in Q2 2013, or two quarters later.
If Intel ends up with some extra stock, it will surely ship it to customers but these are the official rules.
Core i7 2700K is not alone in PDN and EOL plans. Core i7 2600 and 2500K will also get product discontinuance notice in Q4 2012 and will reach the end of its professional career in Q2 2013 and it’s no coincidence that this happens days before scheduled Haswell launch.
Intel Changes Course
Intel has changed its strategy when it comes to talking about its next generation technology. Back at IDF 2012, the company mentioned Haswell second generation 22nm CPUs and even explained some of its core technology, although it didn’t actually show any demos.
People got excited about Core i5 and Core i7 next generation Haswell parts that can ship with 10W TDP, but Intel hasn’t actually shown anything. When we asked a few people inside the company, they said that Intel isn’t planning on revealing too much, as they want to surprise the competition a bit more than they used to.
It’s quite clear that Haswell has every chance to beat AMD’s including 2013 Vishera successors. Intel obviously wants to see the market’s reaction to many ARM competitors, since some of them run Windows 8 RT just fine.
Intel Going High-Performance
Intel has been hinting that it is developing high-performance lower power server chips to speed up cloud services or data-intensive applications like analytic.
Apparently this will involve the integration of a converged fabric controller inside future server chips. This will make server communication faster while helping data centers operate at peak efficiency.
Raj Hazra, vice president of the Intel Architecture Group said that Fabric virtualises I/O and ties together storage and networking in data centres. If you add in an integrated controller you get a wider pipe to scale performance on cloud platforms. He said that the integrated fabric controller will appear in the company’s Xeon server chips in a few years as part of Intel’s cunning plan to bring the controller to the transistor layer.
Intel Increasing Supplier Audits
Intel has audited almost five times as many of its suppliers in 2011 than it did the previous year.
Chipzilla set itself a target of visiting 50 on-site, third-party audits of its suppliers during the last year. It had that target last year as well, but missed it by only carrying out 49 audits, while one had to be rescheduled.
In comparison Intel only carried out eight visits in 2010. The company also conducted 249 in-depth assessments and 289 self-assessments by suppliers.
But the findings were not that great. Intel found 426 priority and major findings, the highest class of non-compliance as defined by the company.
Most of the non-compliance related to management systems such as a lack of documentation and systems for CSR, inadequate communication with workers or suppliers and a lack of audits. But there were also 112 instances of labour abuse, which included working hours of more than 60 hours per week, and workers not being given at least one day off a week. There were also 28 issues relating to ethics, such as not having an anonymous reporting line for employees to raise issues or concerns through.
The report was interesting because it must have covered Foxconn, which has been the subject of criticism over its treatment of workers. During 2011, Intel carried out audits at three Foxconn facilities and found them about as bad as others in the region. Most of the breaches of rules were in the areas of labour conditions, safety systems, and management systems.
Is Intel Ready For The USB 3.0 Standard?
Comments Off on Is Intel Ready For The USB 3.0 Standard?
The USB Implementers Forum has ruled that the Ivy Bridge 7 Series Chipset and other Intel chipsets have achieved USB 3.0 certification. USB 3.0 delivers up to 10 times the data transfer rate of USB 2.0, as well as improved power efficiency. Intel’s Ivy Bridge will ship in Windows PCs in the April and will be the first to have USB 3.0 as a standard feature for the first time. USB 3.0 has been seen on laptops and desktops from AMD or NEC.
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