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TI Shows Off New Multi-Core DSPs
Texas Instruments has released two evaluation modules sporting its TMS320C665x multi-core digital signal processor (DSP) chips.
Texas Instruments has been pushing its line of DSPs for many years and while the firm now offers DSP and ARM processing on a single board, it still makes a considerable amount of money flogging its C6000 series DSPs. The company has been promoting its multi-core TMS320C665x series DSPs recently and has now released two test boards to help developers get started.
Texas Instruments said the TMDSEVM6657L and TMDSEVM6657LE evaluation modules will include its Multicore Software Development Kit, the Code Composer Studio development environment and demonstration codes. The firm said the difference between the two boards is in their emulators, with the TMDSEVM6657LE having the faster XDS560V2 emulator while the TMDSEVM6657L features a XDS100 emulator.
Ramesh Kumar, business manager of multicore processors at Texas Instruments said, “Our goal has always been to make multicore programming easier and more accessible to developers. With the availability of our new, low-priced C665x EVMs, we are driving our Keystone devices into smaller and more portable products, enabling developers to take advantage of multicore in a wider range of high-performance and portable applications.”
Intel Goes Wireless
Maho Bay is a desktop platform wrapped around the recently launched Ivy Bridge desktop processor and Intel plans to enrich this platform with a Wireless mini card offer of its own.
The plan is to make new SKUs based on half Minicard (mPCIe) standard and offer it with its boards that have support for PCIe 1X or faster. Maho Bay also allows some combinations with Sandy Bridge processors and will allow the use of these mini Wireless cards on older processors with new boards. It looks like the Panther Point chipset is necessary even for older Sandy Bridge processors on Maho Bay platform.
The top range card with premium performance is Intel Centrino Ultimate N 6300, and the card has virtually the same specification like its mobile brother. It supports Intel Wireless Display as well as Intel My Wifi technology and quick driver connect.
Since it is using 3×3 antennas and MIMO standard it us capable of achieving speeds of 450Mbits per second and it does support multiple streams. It supports dual band 2.4 + 5 GHz and Intel Vpro. This is still a 802.11n based product as Intel hasn’t really jumped the gun to support 802.11ac in 2012.
It looks like it is too early for Intel to embrace this new standard due to its very limited market penetration.
AMD’s 8350 Clocked At 4.0GHz
We have got some information about AMD’s upcoming FX 8350.
However, today we learned that AMD will push this CPU from Q3 to early Q4 2012 as now it claims that it can launch this processor in late October. AMD FX 8350 is an eight-core with 16MB cache, Vishera based 32nm core with 4.0GHz default clock and ability to jump to 4.2GHz with turbo core automatic overclocking.
This is an impressive frequency jump as the AMD FX 8150 works at 3.6GHz default and with turbo gets to 4.2GHz. The FX 8350 is supposed to replace the 8150 as AMD’s flagship processor.
According to current schedule production ready samples are expected in roughly a month (early August). Mass production starts in early August, probably days after they finalize the clocks and give it a green light for mass production but the launch is pushed for late October 2012.
Intel Buys Patents
Intel on Monday spent US$375 million to purchase nearly 1,700 wireless networking patents from subsidiaries of digital communications company Interdigital.
Intel will get patents that cover a range of 3G, LTE and Wi-Fi technologies from Interdigital. The patents should boost Intel’s product mobile product portfolio as the company establishes a presence in the smartphone and tablet markets, which is currently ruled by ARM.
Intel has said it will integrate 3G and 4G LTE capabilities along with its Atom microprocessor in devices like smartphones and tablets. Intel made its first entry into the smartphone market earlier this year with its Atom chip code-named Medfield, which is being used in handsets from Lenovo, Orange and Lava International.
Intel later this year will release a dual-core Atom Z2580 processor with 3G, 4G and LTE capabilities. Intel’s upcoming Atom chip for tablets, code-named Clover Trail, will also come with mobile broadband options.
Intel started building its wireless business following the acquisition of Infineon Wireless for $1.4 billion, which was completed last year.
Wireless is a fast-changing market, and the company is making this investment to support the business, according to Chuck Mulloy, an Intel spokesman.
“This was an opportunity to add some value to our patent portfolio. That’s over and above what we have,” Mulloy said.
Intel Increasing Supplier Audits
Intel has audited almost five times as many of its suppliers in 2011 than it did the previous year.
Chipzilla set itself a target of visiting 50 on-site, third-party audits of its suppliers during the last year. It had that target last year as well, but missed it by only carrying out 49 audits, while one had to be rescheduled.
In comparison Intel only carried out eight visits in 2010. The company also conducted 249 in-depth assessments and 289 self-assessments by suppliers.
But the findings were not that great. Intel found 426 priority and major findings, the highest class of non-compliance as defined by the company.
Most of the non-compliance related to management systems such as a lack of documentation and systems for CSR, inadequate communication with workers or suppliers and a lack of audits. But there were also 112 instances of labour abuse, which included working hours of more than 60 hours per week, and workers not being given at least one day off a week. There were also 28 issues relating to ethics, such as not having an anonymous reporting line for employees to raise issues or concerns through.
The report was interesting because it must have covered Foxconn, which has been the subject of criticism over its treatment of workers. During 2011, Intel carried out audits at three Foxconn facilities and found them about as bad as others in the region. Most of the breaches of rules were in the areas of labour conditions, safety systems, and management systems.
AMD Officially Launches Trinity Mobile
AMD has finally and officially lifted an NDA veil off its mobile Trinity A-series APU lineup based on the 2nd-gen Bulldozer CPU core, aka Piledriver, and VLIW4 Northern Islands GPU squeezed together on a 32nm SOI die.
Architecture-wise, AMD’s Trinity combines two to four Piledriver x86 cores combined with up to 384 VLIW4 Radeon cores on a 32nm die which ends up as a 246mm2 chip with 1.303B transistors, slightly more than Llano’s 228mm2/1.178B. Since it is made in the same 32nm manufacturing process as Llano, the greatest win for Trinity are actual CPU and GPU performance improvements as well as impressive power consumption improvements when compared to Llano APUs.
Same as the FX-series desktop parts based on the Bulldozer architecture, AMD’s Trinity CPU part has a 2+1 integer/floating point design where you get two integer cores that share a single floating point scheduler. Although it appears to the OS as two cores, each Piledriver module actually has less resources than traditional core design. But with Piledriver, those Bulldozer kinks got ironed out as much as possible, improving IPC (instruction per cycle), reducing leakage, reducing CAC and giving it a slight frequency uplift.
As far as the GPU is concerned, we are looking at quite familiar Northern Islands VLIW4 part, a same one that was behind Cayman Radeon HD 6970 graphics card. Of course, the GPU has been cut down to up to 384 stream processors (organized in 6 SIMDs) with 24 texture units and 8 ROPs. The clocks have also gone down to 497MHz base clock that can “turbo” up to 686MHz.
Trinity Launching On Desktops This Summer
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AMD is expected to introduce its new mobile Trinity APU in a week or so and now we are hearing some timeframes for desktop parts as well.
According to Digitimes, desktop Trinity parts are coming in August, while Brazos 2.0 chips are expected in June. There is no word on Trinity ULV parts yet and we believe they will be the most interesting of the lot.
Is Moore’s Law Dead?
May 11, 2012 by admin
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Physicist Michio Kaku says that Moore’s law will be dead within about 10 years.
Kaku, professor of theoretical physics at City University of New York told BigThink.com that we are already seeing a slowing down of Moore’s Law. He said that computing power simply cannot maintain this rapid, exponential rise using standard silicon technology.
Kaku said that the latest CPUs from Intel, which use a unique three-dimensional design, do continue roughly doubling processors. But he points out that the new design is nonetheless proof that the Law is winding down.
The two basic problems are heat and leakage and that is why the age of silicon will eventually come to a close.
By continuing to shrink the parts that go into processors, heat becomes concentrated. At a point in the near future, the heat generated will be so intense that the chip will melt. You can literally fry an egg on top of the chip, and the chip itself begins to disintegrate, he said.
Intel’s Itanium Processor Available Until 2022
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HP will have access to Intel’s Itanium processor until 2022, according to Intel’s Kirk Skaugen.
Skaugen, who used to be VP of Intel’s Datacentre and Connected Systems Group, testified under oath during the HP versus Oracle lawsuit that HP and Intel had an arrangement that “enabled HP to have access to the Itanium microprocessor through 2022, and that HP could extend even longer”. Skaugen’s testimony was submitted as part of court documents filed on 23 April and gives some indication of how long both HP and Intel were expecting to push Itanium.
Oracle, which has been involved in an increasingly bitter spat with HP over Itanium and the hiring of its current co-president and former HP CEO Mark Hurd, claims Intel’s Itanium was on its way out, alleging that HP mislead it and customers, leading to its decision to drop support for the IA64 architecture.
However, according to HP, “Oracle resorts to mischaracterising HP’s statements, taking them out of appropriate context, or misstating the relevant timeline.”
HP claims Skaugen’s comments show that when HP said Itanium had a long future it wasn’t lying. “By any measure, all of HP’s statements regarding the length of its roadmap and the future of the Itanium microprocessor were true,” HP said in documents filed with the court.
Skaugen’s comments are something of a surprise, not because they show an agreement between HP and Intel – HP already admitted that one existed – but the length of Intel’s commitment to HP on Itanium and the fact that HP could extend it.
HP’s language suggests that it, as the customer, had the upper hand in the contract with Intel, with the firm saying, “Intel was committed by contract to continue producing Itanium microprocessors”. Skaugen’s testimony in court supports HP’s claim.
Is Samsung Pursuing The Server Market?
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It is certain that Korean electronics giant Samsung will soon be entering the server chip market.
Reports are coming in that the company has been picking up key server personnel from Intel and AMD. Samsung has been focused on developing ARM chips and stayed clear of the x86 architecture used by Intel and AMD.
But the companies latest hires seem to indicate that might change.
Samsung’s latest recruits include veterans of the chip business like Jim Mergard, Frank Helms, who is a Fusion APU architect, Brad Burgess who designed the Bobcat APU and Patrick Patla (VP of AMD’s server business). Patla was behind the success of the Opteron chip set and has done well using the x86-server system.