Revenues for the last part of the year will be adversely affected by an about one per cent drop in wafer ASPs and capacity at its plants will slide to 81-83 per cent in the fourth quarter from 89% in the third.

UMC’s had already lowered capacity in the third quarter. At the beginning of the year it was running at 94 percent.

The company’s revenues decreased 7.1 per cent to $1.07 billion in the third quarter, with gross margin slipping below 20 per cent.

UMC net profits were down 62.9 per cent on quarter, as both operating and non-operating income eroded. This is bad news because in the first three quarters of 2015, UMC’s net profits increased 35.8 per cent from a year earlier.

However UMC is continuing to invest in new capital and will spend $1.8 billion.

CEO Po-Wen Yen said that the continuing IC inventory adjustment will dampen fourth quarter wafer shipments, but UMC continues on the path towards long-term growth.

“Throughout 2015, UMC engineers and Fab12A have worked tirelessly to bring several new 28nm product tape-outs into volume production. “UMC is working to bring a timely conversion of new 28nm requirements into production, which will strengthen our business.”
Courtesy-http://www.thegurureview.net/computing-category/will-umc-chip-shipments-drop-in-the-fall.html

The Sparc M7 chip was originally unveiled at last year’s Openworld show in San Francisco, and was touted at the time as a Heartbleed-prevention tool.

A year on, and Oracle announced the Oracle SuperCluster M7, along with Sparc T7 and M7 servers, at the show. The servers are all based on the 32-core, 256-thread M7 microprocessor, which offers Security in Silicon for better intrusion protection and encryption, and SQL in Silicon for improved database efficiency.

Along with built-in security, the SuperCluster M7 packs compute, networking and storage hardware with virtualisation, operating system and management software into one giant cloud infrastructure box.

Oracle CTO Larry Ellison was on hand at Openworld on Tuesday to explain why the notion of building security into the silicon is so important.

“We are not winning a lot of these cyber battles. We haven’t lost the war but we’re losing a lot of the battles. We have to rethink how we deliver technology especially as we deliver vast amounts of data to the cloud,” he told delegates.

Ellison said that Oracle’s approach to this cyber war is to take security as low down in the stack as possible.

“Database security is better than application security. You should always push security as low in the stack as possible. At the bottom of the stack is silicon. If all of your data in the database is encrypted, that’s better than having an application code that encrypts your data. If it’s in the database, every application that uses that database inherits that security,” he explained.

“Silicon security is better than OS security. Then every operating system that runs on that silicon inherits that security. And the last time I checked, even the best hackers have not figured out a way to download changes to your microprocessor. You can’t alter the silicon, that’s really tricky.”

Ellison’s big idea is to take software security features out of operating systems, VMs and even databases in some cases – because software can be changed – and instead push them into the silicon, which can’t be. He is also urging for security to be switched on as default, without an option to turn it back off again.

“The security features should always be on. We provide encryption in our databases but it can be switched off. That is a bad idea. There should be no way to turn off encryption. The idea of being able to turn on and off security features makes no sense,” he said.

Ellison referred back to a debate that took place at Oracle when it first came up with its backup system – should the firm have only encrypted backups. “We did a customer survey and customers said no, we don’t want to pay the performance penalty in some cases,” he recalled. “In that case customer choice is a bad idea. Maybe someone will forget to turn on encryption when it should have been turned on and you lose 10 million credit cards.”

The Sparc M7 is basically Oracle’s answer to this dire security situation. Ellison said that while the M7 has lots of software features built into the silicon, the most “charismatic” of these is Silicon Secured Memory, which is “deceptively simple” in how it works.

“Every time a computer program asks for memory, say you ask for 8MB of memory, we compute a key and assign this large number to that 8MB of memory,” he explained. “We take those bits and we lock that memory. We also assign that same number to the program. Every time the program accesses memory, we check that number to make sure it’s the memory you allocated earlier. That compare is done by the hardware.”

If a program tries to access memory belonging to another program, the hardware detects a mismatch and raises a signal, flagging up a possible breach or bug.

“We put always-on memory intrusion detection into the silicon. We’re always looking for Heartbleed and Venom-like violations. You cannot turn it off,” the CTO warned.

“We’ve also speeded up encryption and decompression, which is kind of related to encryption. It runs at memory speed there’s zero cost in doing that. We turn it on, you can’t turn it off, it’s on all the time. It’s all built into the M7.”

Ellison claimed that running M7-based systems will stop threats like Heartbleed and Venom in their tracks.

“The way Venom worked, the floppy disc driver concealed this code. It’s the worst kind of situation, you’re writing into memory you’re not supposed to. You’re writing computer instructions into the memory and you’ve just taken over the whole computer,” he explained. “You can steal and change data. M7 – the second we tried to write that code into memory that didn’t belong to that program, where the keys didn’t match, that would have been detected real-time and that access would have been foiled.

All well and good, except for the fact that nearly every current computer system doesn’t run off the M7 processor. Ellison claimed that even if only three or four percent of servers in the cloud an organisation is using have this feature, they will be protected as they’ll get the early warning to then deal with the issue across non-M7 systems.

“You don’t have to replace every micro processor, you just have to replace a few so you get the information real-time,” he added.

“You’ll see us making more chips based on security, to secure our cloud and to sell to people who want to secure their clouds or who want to have secure computers in their datacentre. Pushing security down into silicon is a very effective way to do that and get ahead of bad guys.”

SuperCluster M7 and Sparc M7 servers are available now. Pricing has not been disclosed but based on normal Oracle hardware costs, expect to dig deep to afford one.

Source-http://www.thegurureview.net/computing-category/oracles-new-m7-processor-has-security-on-silicon.html

Designed for demanding embedded needs, the processors incorporate the newest AMD 64-bit x86 CPU core (“Excavator”), plus third-generation Graphics Core Next GPU architecture, and better power management for reduced energy consumption.

AMD tells us that combined, these chips provide industry-leading graphics performance and key embedded features for next-generation designs. The SOC architecture enables simplified, small form factor board and system designs from AMD customers and a number of third party development platform providers.

What AMD brings to the party is its graphics and multimedia performance, including capability for hardware-accelerated decode of 4K video playback and support for the latest DDR4 memory.
Jim McGregor, principal analyst, TIRIAS Research said that AMDs push into x86 embedded platforms is paying off with an increasing number of customers and applications.

“There is a need for immersive graphics, high-quality visualization, and parallel computing in an increasing number of embedded applications. Across these fronts, the AMD Embedded R-Series SOC is a very compelling solution.”

Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that his outfit’s AMD Embedded R-Series SOC is a strong match for these needs in a variety of industries including digital signage, retail signage, medical imaging, electronic gaming machines, media storage, and communications and networking.

“The platform offers a strong value proposition for this next generation of high-performance, low-power embedded designs.”

The new AMD Embedded R-Series SOCs offer 22 percent improved GPU performance when compared to the 2nd Generation AMD Embedded R-Series APU2 and a 58 percent advantage against the Intel Broadwell Core i7 when running graphics-intensive benchmarks.

AMD released some of the specs for its integrated AMD Radeon graphics including:

Up to eight compute units4 and two rendering blocks

GPU clock speeds up to 800MHz resulting in 819 GFLOPS

•DirectX 12 support

Fully HSA Enabled

The AMD Embedded R-Series SOC was architected with embedded customers in mind and includes features such as industrial temperature support, dual-channel DDR3 or DDR4 support with ECC (Error Correction Code), Secure Boot, and a broad range of processor options.

It has a configurable thermal design power (cTDP) allows designers to adjust the TDPs from 12W to 35W in 1W increments for greater flexibility.

The SOC also has a 35 percent reduced footprint when compared to the 2nd Generation AMD Embedded R-Series APU, making it an excellent choice for small form factor applications.

AMD said that the range is the first embedded processor with dual-channel 64-bit DDR4 or DDR3 with Error-Correction Code (ECC), with speeds up to DDR4-2400 and DDR3-2133, and support for 1.2V DDR4 and 1.5V/1.35V DDR3.

Its dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB) and initiates trusted boot environment before starting x86 cores
It has a high-performance Integrated FCH featuring PCIe Gen3 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, and UART

The AMD Embedded R-Series SOC provides industry-leading ten-year longevity of supply. The processors support Microsoft Windows 7, Windows Embedded 7 and 8 Standard, Windows 8.1, Windows 10, and AMD’s all-open Linux driver including Mentor Embedded Linux from Mentor Graphics and their Sourcery CodeBench IDE development tools.

It will be interesting to see if AMD can make up the ground it has lost on PCs and higher ticket items. Most of the company still appears to be in a holding pattern until Zen arrives.

Courtesy-http://www.thegurureview.net/computing-category/will-amds-newest-soc-save-the-company.html

Chief executive Lisa Su admitted that ARM-based server chips have experienced slower-than-expected reception from the owners of data centres and server farms.

AMD delayed its own ARM-based Opteron microprocessor, code-named Seattle, until the fourth quarter of this year. ARM was having a harder time proving itself to the multibillion-dollar market for high-end server chips.

An engineering sample of AMD’s long awaited 8 core server SOC code named “Hierofalcon” has been spotted and tested and according to WCCTech it looked pretty good. Itis based around 8 ARM-64bit A57 cores running at 2.0Ghz. And although Hierofalcon maxes out at frugal TDP of 30W.

So even the promising reviews aren’t enough for AMD to be optimistic about the ARM based gear.

Su said in an analyst conference call that the company expects to see “modest production shipments” of Seattle in the fourth quarter. Meanwhile, AMD’s Intel-compatible “x86″ server chips will be the company’s mainstay product offering for data centres.

She said that AMD was continuing its ARM efforts and is seeing them as a longer term bet.

Source-http://www.thegurureview.net/computing-category/amds-bet-on-arm-does-not-appear-to-be-helping.html

The outfit has been going through hell lately. Last month AMD ace CPU architect Jim Keller stepped away from the company after completing his work on Zen.

Rogers was one of AMD’s high-ranking technology and engineering corporate fellows, and been responsible for helping to develop the software ecosystem behind AMD’s heterogeneous computing products and the Heterogeneous System Architecture.

He was a public figure for AMD and active on the software development and evangelism side, frequently presenting the latest HSA tech and announcements for AMD at keynotes and conferences.

While he is not the only person working on the software side of HSA at AMD, Rogers’ role in its development is important. Rogers was a major contributor to the HSA Foundation, helping to initially found it in 2012. He served as the Foundation’s president until he left AMD.

It seems his defection was kept secret, and took place sometime this quarter and did not manage to leak.

According to his LinkedIn profile Phil Rogers is now Nvidia’s “Chief Software Architect – Compute Server” which is similar to what he was doing over at AMD. Nvidia is not a member of the HSA Foundation, but they are currently gearing up for the launch of the Pascal GPU family, which has some features that overlap well with Phil Rogers’ expertise.

Pascal’s NVLink CPU & GPU interconnect would allow tightly coupled heterogonous computing similar to what AMD has been working on. It makes a fair bit of sense for Nvidia to bring over a heterogeneous compute specialist makes a great deal of sense.

Rogers’ departure from AMD will have to be mentioned on the earnings call on the 15th. AMD’s Gregory Stoner will probably replace him. Stoner is AMD’s current Senior Director of Compute Solutions Technology and long-time Vice President of the HSA Foundation.

Source-http://www.thegurureview.net/computing-category/is-amd-losing-top-scientist-to-nvidia.html

According to EETimes Paul Boudre, who claimed that SOI is already being used by Apple and Intel even though neither company is broadcasting it. SOI appears to be on track to major market penetration even while the rest of the industry is talking FinFETs.

GlobalFoundries general manager Rutger Wijburg told the SEMICON Europa 2015 that his outfit’s 22-nanometer “22FDX” SOI platform delivers FinFET-like performance but at a much lower power point and at a cost comparable to 28-nanometer planar technologies.

The 300-millimeter $250 million FD-SOI foundry here in the “Silicon Saxony” area of Germany, builds on 20 years of GlobalFoundries’ investments in Europe’s largest semiconductor fabs.

GlobalFoundries said it will extend Moore’s Law by using fully-deleted silicon-on-insulator (FD-SOI) transistors on wafers bought from Soitec.

Many had thought that if GloFlo’s FD-SOI gamble paid off then it would be a while before FinFET would have a serious rival. But Boudre’s claims suggests that SOI is already being used.

Customers like Intel and OEMs supplying fully-deleted silicon-on-insulator (FD-SOI) RF transistors to Apple proves that SOI and Soitec are past the cusp of the growth curve, destined to ramp up exponentially.

The problem for Soitec is no one is really talking about it. Chipzilla is committed to the FinFET, because it is higher performance than FD-SOI, even though it is higher power too.
Boudre said that it was supplying SOI wafers to Intel for other applications that don’t require high-performance. For instance, our wafers are very good for their silicon photonics projects.

Apple is already using SOI for several radio frequency (RF) chips in their front-ends, because they use 20-times less power. The iPhone is still using gallium arsenide (GaAs) for its power amplifier (PA) because it needs the high-power device for good connections, but for other RF front-end chips, and in fact for all the chips that they want to keep “always on,” the lower power consumption of FD-SOI is pushing the smartphone makers to Soitec, Boudre said.

SOI wafers cost three-times as much as bulk silicon but the cost per die is less because of the simplified processing steps including fewer masks.

Normally GPS chips run on 0.8 volts and consume over 20 milliamps, so they must be turned off most of the time. But when they are made with SOI wafers, they can run on 0.4 volts and consume only 1 milliamp. The mobile device to leave them on all the time and new and more accurate location sensing and new kinds of location-based applications can be developed.

What is amusing then is that Intel’s reason for going with FinFETs was that SOI wafers were too expensive but it did find a use for it.

GlobalFoundries’ Saxony fab will offer four varieties of its 22FDX process.

FDX-ulp for the mainstream and low-cost smartphone market. This will use body-biasing to beat FinFETs on power, but equal them in performance.

FDX-uhp for networking applications using analogue integration to match FinFETs while minimizing energy consumption

FDX-ull for ultra-low power required by wearables and Internet of Things applications. This will have a 1 picoamp per micron leakage

DDX-rfa for radio frequency (RF) analogue applications delivering 50 percent lower power and reduced system costs for LTE-A cellular transceivers, high-order multiple-input/multiple-output (MIMO) WiFi combo chips and millimeter wave radar.

Courtesy-http://www.thegurureview.net/computing-category/ibm-and-intel-going-goflo-soi.html

Actually AMD is pretty cheap right now and if it was not for the pesky arrangement that prevents AMD’s buyer getting its x86 technology then it would have been snapped up a while ago. But with, or without AMD, Samsung could still make a good fist of chipmaking if it put its mind to it. At the moment its chipmaking efforts are one of the better things on its balance sheet.

Its high-margin semiconductor business is more than making up for the shortfall in smartphones. Selling chips to rivals would be more lucrative if they were not spinning their own mobile business. The products it have are worth $11.7 billion this year, more than half the company’s total.

Growing demand for chips and thin-film displays is probably the main reason that Samsung now expects operating profit to have reached $6.3 billion. After applying Samsung’s 16 percent corporate tax rate, its chip division is likely to bring in net income of slightly less than $10 billion.

To put this figure into perspective Intel expects to earn $10.5 billion in this year. Samsung is also sitting on a $48 billion net cash pile. Samsung could see its handset and consumer electronics business as a sideline and just focus on bumping off Intel.

The two sides of such a war would be fascinating. Intel has its roots in the PC chip market which is still suffering while Samsung is based in the mobile chip market which is growing. Intel has had no luck crossing into the mobile market, but Samsung could start looking at server and PC chips.

AMD is still dying and unable to offer Intel any challenge but there is a large market for those PC users who do not want to buy Intel. What Samsung should have done is use its huge cash pile to buy its way into the PC market. It might have done so with the IBM tech which went to Lenovo. It is still not out of the running on that front. Lenovo might be happy to sell IBM tech to Samsung.

Another scenario is that it might try to buy an x86 licence from Intel. With AMD dying, Intel is sitting on a huge monopoly for PC technology. It is only a matter of time before an anti-trust suit appears. Intel might think it is worthwhile to get a reliable rival to stop those allegations taking place. Samsung would be a dangerous rival, but it would take a while before it got itself established. Intel might do well to consider it. Of course Samsung might buy AMD which could sweeten that deal for Intel.

Samsung could try adapting its mobile chip technology for the PC/server market – it has the money to do it. Then it has a huge job marketing itself as the new Intel.

Source-http://www.thegurureview.net/computing-category/can-samsung-compete-with-intel-in-the-x86-chip-space.html

Google and Microsoft have reached a broad agreement on patent matters, with a legal settlement ending some 20 lawsuits between the companies in the U.S. and Germany. Financial terms weren’t disclosed, but the deal brings a laundry list of lawsuits to a close.

“Microsoft and Google are pleased to announce an agreement on patent issues,” they said in a joint statement. “As part of the agreement, the companies will dismiss all pending patent infringement litigation between them, including cases related to Motorola Mobility.”

They also agreed to collaborate on patent matters and work together “to benefit our customers.”

The suits that have been settled include those related to mobile phones, video encoding and Wi-Fi technologies. That doesn’t mean Microsoft has given up its campaign to collect royalties from Android device makers for the mobile operating system’s alleged infringement of Microsoft patents.

It’s not clear from the statement what patent matters the companies will be working on together in the future, but changes have already begun. The two companies agreed earlier this month to work together (alongside other firms like Netflix and Mozilla) on a royalty-free video codec.

It remains to be seen if the settlement will lead to more work between Microsoft and Google in other areas. A major sticking point for consumers has been the lack of a Google-made YouTube app for smartphones and tablets running Windows.

Source-http://www.thegurureview.net/aroundnet-category/microsoft-google-cease-fire-in-global-patent-deal.html