The 2nd generation High Bandwidth Memory (HBM 2.0) for high-end GPUs might happen in very late Q4 2016 but realistically it probably won’t ship until 2017 in any volume.

The first card that we expect supporting this feature might be the Greenland, a card that AMD might end up calling Vega. Even according Radeon Technology Group’s official GPU roadmap, Vega / Greenland now look like a 2017 product, or at very best, late 2016 card. Nvidia might make the HBM 2.0 version of the Titan card, but we don’t expect to see a Geforce GTX based on Pascal GPU and HBM 2.0 coming to the market this year.

We managed to talk to some of the memory manufactures and they told us that HBM 2.0 is very limited in supply, and limited supply makes things expensive.

It seems that GPUs of 2016, including the new AMD Polaris and the new Geforce, will be stuck with GDDR5 and in best case scenario with GDDR5X from Micron. The word on the street is that both Geforce GTX based on Pascal and AMD/RTG’s Polaris 10 / Ellesmere and Polaris 11 / Baffin might launch at Computex during last days of May or early June 2016.

Courtesy-Fud

For TSMC, Q1 2016 was marked by a reduction of demand for high-end smartphones, while smartphone demand in China and emerging markets had upward momentum. Beginning Q2 2016 and onward, the company expect to get back onto a growth trajectory and is projected to hit a 5 to 10 percent growth rate in 2016.

“Our 10-nanometer technology development is on track,” said company president and co-CEO Mark Liu during the company’s Q4 2015 earnings call. “We are currently in intensive yield learning mode in our technology development. Our 256-megabit SRAM is yielding well. We expect to complete process and product qualification and begin customer product tape-outs this quarter.”

“Our 7-nanometer technology development progress is on schedule as well. TSMC’s 7 nanometer technology development leverage our 10-nanometer development very effectively. At the same time, TSMC’s 7-nanometer offers a substantial density improvement, performance improvement and power reduction from 10-nanometer.

These two technologies, 10-nanometer and 7-nanometer, will cover a very wide range of applications, including application processors for smartphone, high-end networking, advanced graphics, field-programmable gate arrays, game consoles, wearables and other consumer products.”

In Q1 2016, TSMC reached a gross margin of 44.9 percent, an operating margin of 34.6 percent and a net profit margin of 31.8 percent respectively. Going forward into Q2 2016, the company is expecting revenue between ~$6.65 billion and ~$6.74 billion USD, gross margins between 49 and 51 percent, and operating profit margins between 38.5 and 40.5 percent, respectively.

Chips used for communications and industrial uses represented over 80 percent of TSMC’s revenue in FY 2015. The company was also able to improve its margins by increasing 16-nanometer production, and like many other semiconductor companies, is preparing for an expected upswing sometime in 2017.

In February, a 6.4-magnitude earthquake struck southern Taiwan where TSMC’s 12-inch Fab 14 is located, a current site of 16-nanometer production. The company expected to have a manufacturing impact above 1 percent in the region with a slight reduction in wafer shipments for the quarter.

“Although the February 6 earthquake caused some delay in wafer shipments in the first quarter, we saw business upside resulting from demand increases in mid- and low-end smartphone segments and customer inventory restocking,” said Lora Ho, Senior Vice President and Chief Financial Officer of TSMC.

“We expect our business in the second quarter will benefit from continued inventory restocking and recovery of the delayed shipments from the earthquake.”

In fiscal year 2016, the company will spend between $9 and $10 billion on ramping up the 16-nanometer process node, constructing Fab 15 for 12-inch wafers in Nanjing, China, and beginning commercial production of the 10-nanometer FinFET process at this new facility. Samsung and Intel are also expected to start mass production of 10-nanometer products by the end of 2016.

During its Q4 2015 earnings call, company president and co-CEO Mark Liu stated the company is currently preparing and working on a 7-nanometer process node and plans to begin volume production sometime in 2018. Meanwhile, since January 2015, a separate research and development team at TSMC has been laying the groundwork for a 5-nanometer process which the company expects to bring into commercial production sometime in 1H 2020.

So far in Q1 2016, shipments of 16 and 20-nanometer wafers have accounted for around 23 percent of the company’s total wafer revenues.

Courtesy-Fud

While we would have thought that there would be little choice between Oracle and Apple as evil software outfits, the fact that Apple uncharacteristically made Swift open source might make life a bit brighter for Google. At the moment Oracle is suing Google for silly money for its Java use in Android.

Swift was created as a replacement for Objective C, and is pretty easy-to-write. It was introduced at WWDC 2014, and has major support from IBM as well as a variety of major apps like Lyft, Pixelmator and Vimeo that have all rebuilt iOS apps with Swift.

But since Apple open sourced Swift, Google, Facebook and Uber have al said that they are interested in it. Taking Java out of Android is a big job. Google would also have to make its entire standard library Swift-ready, and support the language in APIs and SDKs. Some low-level Android APIs are C++, which Swift cannot bridge to. Higher level Java APIs would also have to be re-written.

Of course if it did all this, Apple might realize that its biggest rival was using its own software to club it to death. It might not be be so nice about allowing Swift out to play and eventually Google have to fork Swift and dump the Apple version. This would probably result in an anst-ridden moan album about how life is so unfair which makes a fortune while scoring passive agressive revenge on the dumpee.

Courtesy-Fud

The FCC voted 3-2 last week to approve a notice of proposed rule-making, or NPRM, the first step toward passing new regulations, over the objections of the commission’s two Republicans.

The rules, which will now be released for public comment, require ISPs to get opt-in permission from customers if they want to use their personal information for most reasons besides marketing their own products.

Republican Commissioners Ajit Pai and Michael O’Rielly complained that the regulations target Internet service providers but not social networks, video providers and other online services.

“Ironically, selectively burdening ISPs, who are nascent competitors in online advertising, confers a windfall on those who are already winning,” Pai said. “The FCC targets ISPs, and only ISPs, for regulation.”

The proposed rules could prohibit some existing practices, including offering premium services in exchange for targeted advertising, that consumers have already agreed to, O’Rielly added. “The agency knows best and must save consumers from their poor privacy choices,” he said.

But the commission’s three Democrats argued that regulations are important because ISPs have an incredible window into their customers’ lives.

ISPs can collect a “treasure trove” of information about a customer, including location, websites visited, and shopping habits, said Commissioner Mignon Clyburn. “I want the ability to determine when and how my ISP uses my personal information.”

Broadband customers would be able to opt out of data collection for marketing and other communications-related services. For all other purposes, including most sharing of personal data with third parties, broadband providers would be required to get customers’ explicit opt-in permission.

The proposal would also require ISPs to notify customers about data breaches, and to notify those directly affected by a breach within 10 days of its discovery.

Courtesy- http://www.thegurureview.net/aroundnet-category/fcc-votes-to-tighten-broadband-providers-privacy-rules.html

The Health Information Trust Alliance conducted a study of some 30 mid-sized U.S. hospitals late last year and found that 52 percent of them were infected with malicious software, HITRUST Chief Executive Daniel Nutkis told Reuters.

The most common type of malware was ransomware, Nutkis said, which was present in 35 percent of the hospitals included in the study of network traffic conducted by security software maker Trend Micro Inc.

Ransomware is malicious software that locks up data in computers and leaves messages demanding payment to recover the data. Last month, Hollywood Presbyterian Hospital in Los Angeles paid a ransom of $17,000 to regain access to its systems.

This week, an attack on MedStar Health forced the largest healthcare provider in Washington, D.C., to shut down much of its computer network. The Baltimore Sun reported a ransom of $18,500 was sought. MedStar declined to comment.

HITRUST said it expects such attacks to become more frequent because ransomware has turned into a profitable business for cyber criminals.

The results of the study, which HITRUST has yet to share with the public, demonstrate that hackers have moved away from focusing on stealing patient data, Nutkis said.

“If stuff isn’t working, they move on. If stuff is working, they keep doing it,” said Nutkis. “Organizations that are paying have considered their options, and unfortunately they don’t have a lot of options.”

Extortion has become more popular with cyber criminals because it is seen as a way to generate fast money, said Larry Whiteside, a healthcare expert with cyber security firm Optiv.

Stealing healthcare data is far more labor intensive, requiring attackers to keep their presence in a victim’s network undetected for months as they steal data, then they need to find buyers, he added.

“With ransomware I’m going to get paid immediately,” Whiteside said.

Courtesy- http://www.thegurureview.net/aroundnet-category/hospitals-should-brace-for-surge-in-ransomware-attacks.html

The tear downs will start happening soon but our sources very close to the matter said with high certainly that all iPhone SE come with an updated Qualcomm modem.

Intel is still in the run but apparently Apple still felt confident to continue using Qualcomm even for this generation of the phone. A few analysts did suggested that iPhone 7 and beyond might get Intel LTE hardware, but not with iPhone SE.

Back in December, when we originally wrote that Intel got the iPhone SE deal, our sources did suggest that Apple can still change its mind if it doesn’t feel that Intel modem is ready. This might be the case, but in the future, we are quite confident that Apple will get a second LTE supplier at some point, just as it did with different manufacturing fabs.

Having two suppliers will drive the cost down, and for Apple every dollar or cent they save of components means millions more in its pocket. Apple claims “LTE up to 50 percent faster than iPhone 5s,” but it doesn’t give a real number. The iPhone 5S uses MDM9615 that was first introduced in 2011. This modem is at the technology range of Cat 4, X5 modem that Qualcomm ships in its entry level SoCs or as an external component.

We will have to wait for the first teardowns to appear as it is not easy to get to “ LTE up to 50 percent faster than iPhone 5s.” You would need a modem that is capable of 225 Mbps  and the next of potential candidates for the iPhone SE is the MDM 20nm 9×35. Qualcomm calls this modem X7 these days, it use to call it Gobi back in late 2014 and this is a Cat 6, 300 Mbit per second download and 50 Mbit per second upload capable chip.

The fact that Apple continues the exclusive deal with Qualcomm is bad news for Intel, but we are sure that the team blue will keep working on getting inside of iPhone.

Courtesy-Fud

The Samsung PM971 built using the company’s Photon controller and runs MLC 3D V-NAND (contrary to the picture above, PC Watch claims it is actually 3-bits per cell). The drive will be available in 128GB, 256GB and 512GB storage capacities and will feature sequential reads up to 1,500MB/s, sequential writes up to 600MB/s, random reads up to 190,000 IOPS and random writes up to 150,000 IOPS.In general, SSDs with BGA packaging are considerably smaller than those using the M.2 form factor, and Intel has claimed that using a PCI-E BGA SSD could allow an increase in battery size by around 10-percent compared to using an M.2 2260 SSD (with GPIO using 1.8v power rail instead of 3.3v), lower thermals than M.2 (from BGA ball conduction to motherboard instead of through M.2 mounting screws), and a vertical height savings of 0.5mm to 1.5mm in notebook devices.

The nice thing about BGA SSDs is that they are “complete” storage solutions and integrate NAND flash memory, the NAND controller and DRAM all into a single package. Currently, there are several BGA M.2 form factors being proposed that will make single-chip SSDs a reality sooner than later as the result of a collaboration between HP, Intel, Lenovo, Micron, SanDisk, Seagate and Toshiba. The four BGA SSD packages proposed are Type 1620, Type 2024, Type 2228 and Type 2828, ranging anywhere between 16 x 20 millimeters and 28 x 28 millimeters with up to 2-millimeter vertical height. It is currently unknown whether the Samsung PM971 adopts any of these proposed BGA M.2 standards.

Based on the demonstration at the 2016 Samsung SSD Forum in Japan, the PM971 offers decent performance thanks to a PCI-E 3.0 x4 interface and the company’s new Photon controller. According to the PC Watch website, the drive is physically smaller than an SD card and Samsung expects device manufacturers and OEMs to begin adoption in the second half of 2016 or the first half of 2017.

Courtesy-Fud

At the GDC 2016 show in San Francisco, Razer has announced that the Core will be ready in April and have a price of US $499. As expected, it has been only validated on Razer Blade Stealth and the newly introduced Razer Blade 2016 Edition notebooks but as it uses Thunderbolt 3 interface, it should be compatible with any other notebook, as long as manufacturer wants it.

With dimensions set at 105 x 353 x 220mm, the Razer Core is reasonably portable. It comes with a 500W PSU and features four USB 3.0 ports, Gigabit Ethernet and Thunderbolt 3 port which is used to connect it to a notebook.

As far as graphics cards support is concerned, Razer says that the Core will work with any AMD Radeon graphics card since Radeon 290 series, including the latest R9 Fury, R9 Nano and Radeon 300 series, as well as pretty much all Nvidia Maxwell GPU based graphics cards since Geforce GTX 750/750 Ti, although we are not sure why would you pair up a US $500 priced box with a US $130 priced graphics cards. The maximum TDP for the graphics card is set at 375W, which means that all dual-GPU solutions are out of the picture, so it will go as far as R9 Fury X or the GTX Titan X.

There aren’t many notebooks that feature a Thunderbolt 3 ports and we have heard before that Thunderbolt 3 might have certain issues with latency, which is probably why other manufacturers like MSI and Alienware, went on with their own proprietary connectors. Of course, Razer probably did the math but we will surely keep a closer eye on it when it ships in April. Both AMD and Nvidia are tweaking their drivers and already have support for external graphics, so it probably will not matter which graphics card you pick.

According to Razer, the Razer Core will be available in April and priced at US $499. Razer is already started taking pre-orders for the Razer Core and offers a US $100 discount in case you buy it with one of their notebooks, Razer Blade 2016 or Blade Stealth.

Courtesy-Fud

Meizu is expected to be one of the first companies to use the X25. Last year it was also the first to use MTK 6795T for its Meizu MX5 phone. In that case the “T” suffix stood for Turbo. This phone was 200 MHz faster than the standard Helio X10 “non T” version.

In 2016 is that MediaTek decided to use the new Helio X25 name because of a commercial arrangement. MediaTek didn’t mention any of the partners, but confirmed that the CPU and GPU will be faster. They did not mention specific clock speeds. Below is a diagram of the Helio X20, and we assume that the first “eXtreme performance” cluster will get a frequency boost, as well as the GPU.

The Helio X25 will not have any architectural changes, it is just a faster version of X20, just like MTK 6795T was faster version of MTK 6795. According to the company, the Helio X25 will be available in May.

This three cluster Helio X25 SoC has real potential and should be one of the most advanced mobile solutions when it hits the market.The first leaked scores of the Helio X20 suggest great performance, but the X25 should have even better scores. There should be a dozen design wins with Helio X20/ X25 and most of them are yet to be announced. There should be a few announcements for the Helio X25 soon, but at least we do know that now there will be a even faster version of three cluster processor.

Courtesy-Fud