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Kingston Goes 1TB
January 17, 2013 by admin
Filed under Around The Net
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Kingston Technology is claiming the world’s highest capacity USB 3.0 flash drive with the one terabyte (1TB) Datatraveler HyperX Predator 3.0.
Announced by the company’s Kingston Digital Europe affiliate, the Datatraveler HyperX Predator 3.0 is shipping now in a 512GB model, with the 1TB capacity set to be available later in the first quarter.
The new drive is also slated as the fastest USB 3.0 flash drive in the Kingston storage line, with read speeds of up to 240MB/s and write speeds of 160MB/s, according to the firm.
“The large capacity and fast USB 3.0 transfer speeds allow users to save time as they can access, edit and transfer applications or files such as HD movies directly from the drive without any performance lag,” said Ann Keefe, Kingston regional director for the UK and Ireland.
Featuring a casing made of zinc alloy for shock resistance and high-end design, the Datatraveler HyperX Predator 3.0 also comes with a custom Kingston key ring and a HyperX valet keychain.
The new drive is fully certified for Superspeed USB 3.0 operation, while keeping backwards compatibility with USB 2.0 to allow it to be used with older computer hardware.
Will Tegra 4 Launch In Q2?
Tegra 4 was supposed to be production ready in Q4 2012 and the general expectation was that CES 2013 would be marked by the launch of phones and tablets based on the new chipset.
It turns out that the chip needed another re-spin, something that usually creates a delay of roughly a quarter. We don’t know which part of the chip was to blame but our sources claim that Tegra 4 is a complex chip with a lot of components where many things can go wrong.
Nvidia dared to move to 28nm, change the core from A9 to A15 and find a way to make its LTE work. There were a lot of things that could go wrong and obviously some did.
This is why Intel first shrinks the core, for example from 32nm to 22nm, and then in its “tock” cycle goes for a newly designed core. Nvidia doesn’t have that luxury, as making a 28nm version of Tegra 3 would not be enough for the SoC market in 2013.
A few people at Nvidia have been telling us that the chip has been sampled to accounts and Nvidia is planning to have some designs announced at the Mobile World Congress. We managed to confirm this schedule with some Nvidia partners.
Passwords Continue As The Weakest Link
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Passwords aren’t the only failure point in many recent widely publicized intrusions by hackers.
But passwords played a part in the perfect storm of users, service providers and technology failures that can result in epic network disasters. Password-based security mechanisms — which can be cracked, reset and socially engineered — no longer suffice in the era of cloud computing.
The problem is this: The more complex a password is, the harder it is to guess and the more secure it is. But the more complex a password is, the more likely it is to be written down or otherwise stored in an easily accessible location, and therefore the less secure it is. And the killer corollary: If a password is stolen, its relative simplicity or complexity becomes irrelevant.
Password security is the common cold of our technological age, a persistent problem that we can’t seem to solve. The technologies that promised to reduce our dependence on passwords — biometrics, smart cards, key fobs, tokens — have all thus far fallen short in terms of cost, reliability or other attributes. And yet, as ongoing news reports about password breaches show, password management is now more important than ever.
All of which makes password management a nightmare for IT shops. “IT faces competing interests,” says Forrester analyst Eve Maler. “They want to be compliant and secure, but they also want to be fast and expedient when it comes to synchronizing user accounts.”
Intel’s Haswell Goes 13W
Intel’s Haswell Y-series processors as we said a few weeks ago have yet launch. The current plan is to launch two Ivy SKUs in Q1 2013, both dual-cores, and later in 2013 Intel plans to replace them with Haswell Y series parts, with even lower TDP.
The faster one is called Core i7 3689Y and has two cores and two threads, as well as a base clock of 1.5GHz. With the help of Intel Turbo Boost 2.0, the top single-core turbo clock is an impressive 2.6GHz, while the maximum dual-core turbo clock stops at 2.4GHz, which is still impressive. This core comes with Intel HD graphics 4000 clocked between 350MHz and 860MHz with turbo.
This new core supports both DDR3 and DDR3L at 1600MHz, has 4MB of cache and impressively low 13W TDP. We have explained that SDP stands for Standard Dissipation Power and Intel expect it to be at 7W for this part.
The runner up is called Core i5 3439Y and has the same two cores and two threads with 1.5GHz base clock, but the single core turbo clock stops at 2.3GHz, while the dual-core top clock is 2.10GHz. The graphics speed, TDP and memory support remain the same, but there is a difference in cache size. Core i5 3439Y comes with 3MB instead of 4MB for Core i7 Y series 3689Y part.
Will Tegra 4 Support USB 3.0?
Wayne, also known as Tegra 4 is coming out at CES 2013, or in some 10 days from now. Nvidia has an event planned days ahead of CES 2013 and the company will likely show some tablets and hybrids based on the new Tegra SoC. Let’s call Wayne Tegra 4 before it gets official.
Nvidia had Wayne ready to launch in Q4 2012 but it had to wait for partners to release the designs based on it, and most of them wanted to do it at CES 2013. European phones based on Wayne are going to show up in February, at the Mobile World Congress.
This is the first quad-core A15 design that will bring a significant performance increase over Tegra 3 and we are hearing that the four-plus-one core will deliver a bigger performance boost than Tegra 3 did over Tegra 2. Also, the fact that the new chip is 28nm and supports DDR3L also promises more efficiency.
USB 3.0 support is something that is getting us excited as usually it is quite slow to transfer anything onto tablets, phones and hybrids. USB 3.0 on tablets will significantly increase the data transfer speed and Tegra 4 will be among the first chips to feature USB 3.0 support, and many consumers will appreciate faster data transfer rates.
The other thing that got our attention is dual display support and you will be able to have two independent screens. On Tegra 3 based devices, you can only mirror the output, not display two independent screens. It could be a very interesting feature for dockable devices.
Is Intel Really Catching ARM?
A new report suggests that Intel is close to matching ARM on power efficiency.
The study by Bernstein Research analysts said that the days of Intel being mocked because its power-hungry chips shortened the battery life of mobile devices could be over. Bernstein noted that the ARM camp has such a commanding lead in phones and tablets that Intel probably won’t make much of a dent in those markets for a couple of years — even with its energy-efficient chips.
But it said that both company’s chip types “are very close in terms of power efficiency and processing power.” It said that the fight between the ARM and Intel camps will heat up meaningfully as early as 2013, with likely damages on both sides and no winner. For its study, Bernstein compared Intel’s chip in a Motorola RAZR phone and a RAZR phone with an ARM chip. It also compared both chips in similar tablets outfitted with the Windows 8.
The bad news in the report for Intel was that ARM’s chips have become more powerful, making them “a very compelling choice” for consumers looking for low-end notebooks.
nVidia’s Tegra 4 Specs Spotted
Here is an interesting leak, just what the doctor ordered to spice up a rather slow news cycle. Chiphell has posted a slide containing a few Tegra 4 specs, but we still don’t know the clocks or a few other interesting details. Of course, the leak should be taken with a grain of salt, but the specs are more or less in line with what we were expecting all along.
Tegra 4, codenamed Wayne, is a 28nm part with revamped graphics and new ARM cores. Although the slide does not directly point to the type of ARM cores used in the design, the new chip is based on ARM’s latest A15 core. Like the Tegra 3, the new chip will also feature an additional companion core to improve energy efficiency. No surprises here really.
In terms of GPU performance, Nvidia promises to deliver a six-fold improvement over the Tegra 3 and a 20x improvement over Tegra 2 chips. Oddly enough, in spite of Nvidia’s graphics prowess, Tegra chips never featured world-beating graphics. This time around they could, thanks to the new 72-core GPU. The GPU will be able to cope with 2560×1600 screens at 120Hz, but it could also take on 4K resolutions, although details are still sketchy. At this point 4K support could only be relevant for next-generation smart TVs, with a huge price tag.
As far as other features go, Tegra 4 brings support for USB 3.0 and DDR3L dual-channel memory. The leak does not mention LTE support.
Tegra 4 will have to take on the likes of Samsung’s upcoming Exynos 5440, which should also debut in early 2013. Nvidia was first to market with a quad-core A9 chip, but this time around it will have to face off against the new Exynos and A15 quad-cores from other vendors.
Nvidia is expected to showcase the new chip at CES and we’ll be there to check it out.
Raspberry Pi Gets A Store
Raspberry Pi Foundation has opened a store to enable users to easily download applications that run on the credit-card sized computer.
The Raspberry Pi Foundation said it partnered with Indiecity and Velocix to create a store for applications that run on the Raspberry Pi computer. The Foundation said that the store itself is an application that runs under its Raspbian Linux distribution and at launch has 23 applications available for download.
The Raspberry Pi Store contains games such as Freeciv alongside applications such as Libreoffice and Asterisk. The Raspberry Pi Foundation said its store accepts compiled binaries, Python code, images, audio and video.
The Raspberry Pi Store will allow developers to charge for applications, with the Foundation saying that it hopes to see a mix of hobbyist and commercial software. The Foundation also asked users that download applications to review them in order to improve the results put out by its recommendations system.
While the Raspberry Pi was initially intended to help teach people how to program, the device has gained wider popularity due to the fact that its hardware can run many typical PC desktop applications. The Foundation’s Raspberry Pi Store will make it easier for users to find and install applications on the device, which can only be a good thing for the Raspberry Pi Foundation and Linux adoption.
AMD Offers More Radeon Chips
AMD has announced four Radeon HD 8000M series GPU chips sporting its latest Graphics Core Next (GCN) architecture.
AMD’s GCN architecture made its first appearance in the firm’s ultra high-end mobile chips, however next month’s CES show will see the firm show off laptops featuring four Radeon HD 8000M series chips. The firm’s four Radeon HD 8000M chips are pitched at the mainstream and gaming laptop markets, though the company said that Asus already has a laptop announced that will use the chips in an ‘ultrathin’ design.
AMD’s Radeon HD 8000M series sees the firm split three chips with the same number of stream processors and memory clock speeds that scale up to 1.25GHz but differentiated by their core speeds. The firm’s Radeon HD 8500M, Radeon HD 8600M and Radeon HD 8700M all have 384 stream processors but are clocked up to 650MHz, 775MHz and between 650MHz and 850MHz, respectively.
Topping AMD’s present range is the Radeon HD 8800M, which has 640 stream processors and is clocked at between 650MHz and 700MHz, while its GDDR5 memory is also clocked at 1.25GHz. All of the firm’s chips, by virtue of being based on the GCN architecture, support DirectX 11.1.
AMD said it will launch three more chips in the Radeon HD 8000M series in the second quarter of 2013. According to the firm’s roadmap, two of those chips will sit above the Radeon HD 8800M in terms of performance while the third will straddle somewhere between the Radeon HD 8600M and Radeon HD 8700M.
AMD was tight-lipped on the power figures for its chips, saying that full details of its Radeon HD 8000M series chips will appear at CES, where its partners will tip up with laptops sporting the chips.
Intel Details 22nm SoC
Thanks to a long spate of bad luck over at AMD, Intel now finds itself in a rather safe market lead, at least in high-end and server markets. However, in the low-end and mobile, Intel has a lot of catching up to do.
ARM still dominates the mobile market and Intel is looking to take on the British chip designer with new 22nm SoCs of its own. Intel outlined its SoC strategy at the 2012 International Electron Devices Meeting in San Francisco the other day.
The cunning plan involves 3D tri gate transistors and Intel’s 22nm fabrication process, or in other words it is a brute force approach. Intel can afford to integrate the latest tech in cheep and cheerful 22nm Atoms, thus making them more competitive in terms of power efficiency.
Since Intel leads the way with new manufacturing processes it already has roughly a year of experience with 22nm chips, while ARM partners rely on 28nm, 32nm and more often than not, 40nm processes. Intel’s next generation SoCs will also benefit from other off-the-shelf Intel tech, such as 3D tri-gate transistors.