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USB 3.1 Coming Later This Year
The emerging USB 3.1 standard is on track to reach desktops as hardware companies release motherboards with ports that can transfer data twice as fast as the previous USB technology.
MSI recently announced a 970A SLI Krait motherboard that will support the AMD processors and the USB 3.1 protocol. Motherboards with USB 3.1 ports have also been released by Gigabyte, ASRock and Asus, but those boards support Intel chips.
USB 3.1 can shuffle data between a host device and peripheral at 10Gbps, which is two times faster than USB 3.0. USB 3.1 is also generating excitement for the reversible Type-C cable, which is the same on both ends so users don’t have to worry about plug orientation.
The motherboards with USB 3.1 technology are targeted at high-end desktops. Some enthusiasts like gamers seek the latest and greatest technologies and build desktops with motherboards sold by MSI, Asus and Gigabyte. Many of the new desktop motherboards announced have the Type-C port interface, which is also in recently announced laptops from Apple and Google.
New technologies like USB 3.1 usually first appear in high-end laptops and desktops, then make their way down to low-priced PCs, said Dean McCarron, principal analyst of Mercury Research.
PC makers are expected to start putting USB 3.1 ports in more laptops and desktops starting later this year.
Intel Developing Thunderbolt Technology
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A new interconnect technology being developed by Intel could be ready for market by 2015 and will be able to move data between computers at up to five times the speed of its recently launched Thunderbolt technology, an Intel researcher said earlier this week.
The new technology uses silicon photonics, which combines silicon components with optical networking, to transfer data at up to 50 gigabits per second over distances of up to 100 meters, said Jeff Demain, strategy director of circuits and system research at Intel Labs, at a company event in New York.
Intel expects the technology to be ready for use in PCs, tablets, smartphones, televisions and other products by 2015, Demain said. As well as being faster than today’s interconnect technologies, it’s expected to lower costs because the components will be built using existing silicon manufacturing processes.
The technology could possibly be used in TVs and set-top boxes to carry video streams at much higher definition than those available today. Image resolution is likely to quadruple by the middle of the decade, when successors to 1080p have arrived, and that will mean more data has to be pushed to the TV.
It should also enable faster data transfers between smartphones, tablets, PCs and peripherals such as external storage drives.
The technology still has a way to go, but Intel showed its progress at the event in New York Wednesday. It showed what it said were working prototypes of the silicon chips used to transmit and receive the laser signals.