Samsung Makes Changes In Mobile

Samsung Electronics Co Ltd, the world’s biggest mobile phone manufacturer, has replaced the head of its mobile design team amid criticism of the latest Galaxy S smartphone.

Chang Dong-hoon offered to resign last week and will be replaced by Lee Min-hyouk, vice president for mobile design, a Samsung spokeswoman said on Thursday.

“The realignment will enable Chang to focus more on his role as head of the Design Strategy Team, the company’s corporate design center which is responsible for long-term design strategy across all of Samsung’s businesses, including Mobile Communications,” Samsung said in a statement.

Lee, 42, became Samsung’s youngest senior executive in 2010 for his role in designing the Galaxy series, a roaring success which unseated Apple Inc’s iPhone as king of the global smartphone market.

Samsung now sells two times more smartphones than Apple, largely thanks to the success of Galaxy range.

But the South Korean firm has also been battling patent litigation the world over, with Apple claiming Samsung copied the look and feel of the U.S. firm’s mobile products.

The Galaxy S5, which debuted globally last month, has received a lukewarm response from consumers due to its lack of eye-popping hardware innovations, while its plastic case design has been panned by some critics for looking cheap and made out of a conveyor belt. The Wall Street Journal said the gold-colored back cover on the S5 looked like a band-aid.

Chang, a former professor who studied at the School of the Art Institute of Chicago, will continue to lead Samsung’s design center which overseas its overall design strategy.

Lee, who acquired the moniker of “Midas” for his golden touch with the Galaxy series, started out designing cars for Samsung’s failed auto joint venture with Renault in the 1990s.

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LG Goes Self-Healing

LG is upping the ante in smartphone technology with a new handset that has a curved touchscreen, along with a special “self healing” technology that the company claims can prevent scratches on the phone’s casing.

The South Korean electronics vendor unveiled the new phone on Monday, calling it the LG G Flex. Digital renderings of the handset were leaked earlier this month. But in its Monday announcement the company offered further details on the phone, showing that it contains a few new technologies, along with its curved display.

The G Flex is the second phone to feature a curved display, the first coming from Samsung Electronics with its Galaxy Round handset. The top and bottom of the G Flex’s 6-inch screen are curved towards the user, while on the Samsung phone it is the sides that are curved towards the viewer.

This makes LG’s handset closer to the curve of a traditional fixed-line phone handset, a design choice LG said is optimized for the contours of a face. Users can more comfortably hold the phone to their mouth and ear, improving its voice and sound quality, according to LG.

The company also touted the design by stating that the phone offers an easier grip, and holds better in a person’s back pocket. In addition, LG said the curved screen gives an “IMAX-like” experience when viewing videos, allowing for a greater field of view.

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New USB Chip Developed

Silicon Motion says it has begun shipping samples of a new USB 3.0 controller chip for flash drives that could boost performance by up to 50%.

The company said the new SM3267 integrated controller is expected to deliver up to 160MB/s read, and 60MB/s write speeds through a single channel; that would be a 30% to 50% performance improvement over today’s USB 3.0 flash drive technology.

Even though the USB 3.0 specification has the capability to support 4.8Gbps throughput speeds, the speed of a USB 3.0-enabled flash drive is dictated by the speed of the accessing flash devices in the drive. Today, most consumer-USB 3.0 flash drives support about 100MB/s read speeds.

We are pleased to announce that SM3267 has received design-ins from most of our current USB controller customers, including many top-tier OEMs, and we expect SM3267-based USB 3.0 flash drives will be commercially available starting in the fourth quarter of 2013,” Wallace Kou, CEO of Silicon Motion, said in a statement.

The new integrated chip will also be able to run at lower voltages, from 5 volts to 1.2 volts, enabling a 25% to 30% lower USB flash drive device temperature compared with other USB 3.0 flash controller products in the market, Silicon Motion said.

The new IC will support the vast majority of NAND flash technology, including new triple-level cell (TLC), multi-level cell (MLC), high speed Toggle, and ONFI DDR NAND manufactured by Samsung, Toshiba, SanDisk, SK Hynix, Micron and Intel.

The new chip has already passed both USB-IF compliance testing and WHCK (Windows Hardware Certification Kit) tests for Windows 7 and Windows 8.

The new IC is available in a Chip-on-Board (COB) and in a 48-pin QFN green package.

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