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nVidia Soars
Nvidia has published its third quarter earnings and the results are impressive to say the least. With record revenue of $1.2 billion, Nvidia’s net income in Q3 was $209.1 million (GAAP).
Quarterly revenue is up 12.9 percent year-over-year and represents a 15.3 percent sequential bump, beating analyst expectations. However, Nvidia expects its revenue to dip to between $1.02 and $1.17 billion in the fourth quarter.
The company blames the projected slump on a declining PC market. It seems Nvidia does not expect Windows 8 will have a very positive impact on the PC market.
TSMC Makes Expansion Plans
TSMC is expected to spend $10 billion next year in capital works as Apple plans to contract the outfit to build its next-generation processors.
According to the Chinese-language Economic Daily News TSMC has informed the equipment suppliers of its decision to hike capital expenditure for 2013 to US$10 billion. This indicates that TSMC has overcome technical problem with 20nm process, which Apple’s next-generation processors are said to use.
It also suggests that Jobs’ Mob is speeding up its reduction of work it gives Samsung. Apple has reportedly sent around 200 design engineers to help TSMC get familiar with the company’s next-generation processor designs at TSMC’s facility in Central Taiwan Science Park.
IBM Scientist Unveil Terabit Optical Chip
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IBM has designed a prototype optical chipset that transfers one terabit of data per second (1Tbit/s).
IBM scientists revealed today that the chipset, dubbed “Holey Optochip”, is the first parallel optical transceiver to transfer one trillion bits of information – or 500 HD movies – per second.
Speaking at the Optical Fiber Communication Conference taking place in Los Angeles today, the scientists reported that the chipset is eight times faster than other parallel optical components available today.
They estimate that the raw speed of one transceiver is equivalent to the bandwidth consumed by 100,000 users at today’s typical 10Mb/s broadband internet access speed. This means it would take just around an hour to transfer the entire US Library of Congress web archive through the transceiver.
According to the boffins, optical networking offers the potential to significantly improve data transfer rates by speeding the flow of data using light pulses instead of sending electrons over wires.
A single 90nm IBM CMOS transceiver IC with 24 receiver and 24 transmitter circuits becomes a Holey Optochip with the fabrication of 48 through-silicon holes, or “optical vias” – one for each transmitter and receiver channel. Simple post-processing on completed CMOS wafers with all devices and standard wiring levels results in an entire wafer populated with Holey Optochips.
The transceiver chip measures only 5.2×5.8mm. Twenty-four channel, industry-standard 850nm VCSEL (vertical cavity surface emitting laser) and photodiode arrays are directly flip-chip soldered to the Optochip. This direct packaging produces high-performance, chip-scale optical engines. The Holey Optochips are designed for direct coupling to a standard 48 channel multimode fibre array through a microlens optical system that can be assembled with conventional high-volume packaging tools.
Intel To Unleash Shark Bay In 2013
Intel used a saucy word to describe the 2013 Haswell based notebook platform. It tells us that Shark Bay should reinvigorate the notebook experience. Revive would seem to be the more appropriate word in this case.
Shark Bay promises more sensors, faster resume times, Intel smart connect as well as connected stand by. All this will be present on at least some Shark Bay powered notebooks.
Intel also wants to bring more improved connected capabilities to 2013 notebooks. It promises NFC support, Thunderbolt paired up with now standard Intel Wireless display.
With more fuzz about sensors, NFC, all-day battery and thin and light approach Intel’s notebook of the future is basically a tablet with a keyboard that probably costs a bit more money and offers traditional PC functionality.
Most Tegra 2 Tablets Will Get ICS
Sources have confirmed that most Tegra 2 tablets you know will get Ice Cream Sandwich. We are still sniffing around to find out if the ICS is going to end up as Android 4.0 but it will bring phones and tablets much closer and should ship in October or November.
Many Asus, Samsung, Toshiba, Lenovo, Sony and any other Android 3.x compatible tablets on market will have a chance to get the new one. The upgrade will come as manufacturers get it ready and customized for its tablets but most tablets will ship with Android 4.0, Ice Cream Sandwich, probably early next year at the latest.
This is good news for many who were brave to buy the first generation of tablets not based on Apple’s architecture and it will help Google to gather even more momentum for 2012. 2012 looks like a year when Google will be ready for real war against Apple, but at the same time, Android supporters fear that Windows 8 will get a lot of attention when it ships in late 2012.
Intel Previews Android Tablet On Atom Chip
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For the first time on Tuesday, Intel unveiled working prototypes of tablets computers with Google’s Android OS and the chip maker’s upcoming Atom low-power chip, code-named Medfield.
The tablet was about 8.9 millimeters (0.3 inches) thick and had a 10.1-inch screen, and was on display during a briefing at the Intel Developer Forum being held in San Francisco. The tablets ran on Android 3.0, code-named Honeycomb, and alpha software developed jointly by Google and Intel.
Earlier on Tuesday, Intel and Google announced they would ally on developing future releases of Android for smartphones and tablets. Intel CEO Paul Otellini showed off a Medfield smartphone running on Android 2.3, code-named Gingerbread.
The Medfield tablet is a reference design for device makers who want to launch tablets, said Steve Smith, vice president at Intel. Smith didn’t say when Medfield tablets would be released, but said Intel is currently optimizing the chips for tablets to balance power and performance.
Intel is banking on Medfield tablets to prove it is improving on power consumption with its tablet and smartphone chips.
Intel already offers tablet chips code-named Oak Trail and Moorestown, which haven’t been successful. Only a few companies such as Cisco and Fujitsu have adopted the chips for business tablets.
AMD Not Chasing Smartphone Market
August 15, 2011 by admin
Filed under Smartphones
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Advanced Micro Devices is not immediately pursuing opportunities within the smartphone markets as it does not align with the company’s strength in technologies like graphics, an executive said on Monday.
Smartphones are constrained on battery, pixels and screen space, and AMD has other areas it can focus on in order to grow, said Rick Bergman, senior vice president and general manager for AMD’s product group during the Pacific Crest Securities Technology Leadership Forum in Vail, Colorado. The company sees an opportunity to apply its graphics and chip technologies to tablets, where customers are demanding better video and battery life.
“We haven’t announced any plans to go in that handheld space. We’ve got plenty of opportunities… in server, notebook and now tablets, that’s our immediate focus. But if the right circumstances come up and we can see a way to impact the market, we’ll obviously continue to look,” Bergman said.
AMD has faced criticism for not aggressively pursuing the booming smartphone or tablet markets. The company in June rushed to release its first dedicated tablet chip, called the Z-series. The chip is a low-power variant of PC chips based on the Fusion microarchitecture, which includes a graphics processor and CPU on a single chip. Based on the x86 architecture, the chip can help tablets deliver a full PC and graphics experience, the company has said.
nVidia’s Tegra 3 Coming To Smartphones
July 18, 2011 by admin
Filed under Smartphones
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It appears as though Nvidia’s next generation quad-core Kal-El (Tegra 3) quad core SoC will also show up on smartphones too. Originally, it was believed that the SoC would only support the ever growing tablet space.
Inside sources have confirmed that projects are already underway and that Tegra 3 aka Kal-El smartphones will be make a debut as well.
Nvidia had hoped to get a lot of play out of Tegra 2, unfortunately the chip was not as embraced as Nvidia had wanted. Even though the Tegra 2 SoC did manage to get a few design wins.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”
Acer Launches Sandy Bridge Notebooks
Acer updated its Timeline notebook series with Intel’s Sandy Bridge family of CPUs. The Timeline X series will come in three sizes, 13.3-inch, 14-inch and 15.6-inch and they are about an inch thick. Furthermore, the notebooks will be equipped with Acer’s PowerSmart Technology that is supposed to provide battery life of up to nine hours on models with integrated graphics and up to eight hours for those models with discrete graphics.