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TSMC Moving To 16FF+ Soon
TSMC’s 16nm FinFET process has barely gotten off the ground, but the foundry is already talking about 16nm FinFET Plus, which is due to launch by the end of the year.
The improved 16nm FinFET Plus (16FF+) node is supposed to deliver more efficiency and performance, making TSMC’s node more competitive compared to Samsung’s 14nm node. That is the general idea, but TSMC’s first generation 16nm node has failed to impress in terms of design wins.
TSMC president CC Wei said the new 16FF+ node already has 20 tapeouts, ten of which achieved satisfactory yield performance. Wei said the company expects up to 50 tapeouts by the end of the year. TSMC expects 16FF+ to enter commercial production in the second half of the year.
16FF+ is not the only FinFET node coming from TSMC over the next year. The company plans to introduce 16FFC for compact devices sometime in the second half of 2016. In addition, 10nm FinFET is expected to enter risk production by the end of 2015, reports Digitimes.
Can TSMC Beat Samsung?
TSMC has said that it is confident that it can beat Samsung Electronics in ramping up production on its 10nm lines.
Samsung disclosed during a recent technology forum in the US that the company plans to enter mass production of chips using its 10nm FinFET process by the end of 2016,.
But in a statement TSMC claimed it could the outfit said the way things are shaping up it could beat that time table. TSMC continued that in the 10nm FinFET race, Intel will be its major competitor.
We expect to hear a bit more about TSMC’s plans at its Taiwan Technology Symposium 2015 on May 28. At the upcoming event, the foundry is expected to talk about the progress and development of its FinFET manufacturing nodes.
TSMC chairman Morris Chang remarked earlier in 2015 that TSMC expects to gain a majority of market share in the FinFET segment in 2016.
Intel is also expected to release its first chips made using 10nm process technology as early as in the middle of 2016.
Broadcom Aquired?
It is starting to look Broadcom will get bought out by its rival Avago as deep throats within both outfits think a deal is close.
Avago is in advanced buyout talks to acquire Broadcom, which manufacturers chips for both the smartphone and broadband industries. The two companies are more or less the same size, but at the moment Broadcom is the weaker partner
It has been the subject of previous speculation regarding acquisitions. The company is among the largest maker of chips for mobile systems such as smartphones, tablets and wearables, Internet of things (IoT) devices and automotive technology products.
Such capabilities could give Avago greater traction in fast-growing markets like IoT and mobile devices.
Broadcom announced last year that it was closing its baseband cellular chip business after being unable to gain inroads against such competitors as Qualcomm. The company had $8.4 billion in revenue last year.
It seems everyone wants a lot more consolidation in the chip industry. Intel reportedly resumed buyout talks to acquire Altera earlier this month, with the parties eyeing a potential price that could reach $13 billion. Micron was tipped as a potential buyer of rival SanDisk.
An April report cited a note from Bernstein analyst Mark Newman. According to this report, Newman pointed to SanDisk’s current valuation as making it a prime takeover target for rival NAND chip maker Micron, as well as other players in the market.
Qualcomm Has A Plethora Of Automobile Modems
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Qualcomm had an IoT event in San Francisco yesterday and the company wanted to talk a bit more about IoT, also known as Internet of Things. They started off with a catchy phrase – Internet of Hype to Internet of Everything.
Dave Aberle said that up to a billion dollars in revenue is coming from the non-mobile market. More than 10 pecent of Qualcomm revenue will come from the non-headset market. They call this market Internet of Everything, but we believe that not all of that market should be called IoT.
IoT is not just the wearable market; it is car modems, connected speakers, action cameras, some smart SanDisk storage solutions, home automation kit and more. Aberle mentioned that Qualcomm has 40 car design wins in the market with 15 different OEMs. We saw some names including Audi on the slide, but the list of obviously much longer.
Qualcomm is the leader in connected car and 4G LTE market, while Nvidia is the leader in Infotainment car systems, having some huge customers behind it, including the Volkswagen Group.
Qualcomm wants to expand its presence in IoT, including automotive solutions, and we expect more IoT designs from them in the near future.
Russia Banking On Home Grown CPUs
A Russian firm announced its intention to build its own homegrown CPUs as part of a cunning plan to keep the Americans from spying on the glorious Empire of Tsar Putin and oil oligarchs.
Moscow Centre of SPARC Technologies (MCST) has announced it’s now taking orders for its Russian-made microprocessors from domestic computer and server manufacturers.
Dubbed the Elbrus-4C, it was fully designed and developed in MCST’s Moscow labs. It’s claimed to be the most high-tech processor ever built in Russia. They claim it is comparable with Intel’s Core i3 and Intel Core i5 processors, although they do not say what generation as one spec we found claimed it could manage a blistering 1.3 GHz which is slightly less than an average mobile phone.
MCST unveiled a new PC, the Elbrus ARM-401 which is powered by the Elbrus-4C chip and runs its own Linux-based Elbrus operating system. MCST claimed it can run Windows and Linux distributions. Yhe company has built a data centre server rack, the Elbrus-4.4, which is powered by four Elbrus-4C microprocessors and supports up to 384GB of RAM.
MCST said the Elbrus-4.4 is suitable for web servers, database servers, storage systems, servers, remote desktops and high-performance clusters.
Sergei Viljanen, editor in chief of the Russian-language PCWorld website said that the chip was at least five years behind the west.
“Russian processor technology is still about five years behind the west. Intel’s chips come with a 14nm design, whereas the Elbrus is 65 nm, which means they have a much higher energy consumption.”
MCST’s Elbrus-4C chips are powered by a 4-core processors, and come with an interface for hard drives and other peripherals. The company finalized development of Elbrus-4C in April 2014, and began mass production last autumn.
Intel Talks More About Skylake
A new Intel roadmap suggests the first Broadwell LGA parts will launch in Q2, while Skylake-S parts will come in Q3.
The roadmap was published by PC Online and points to two Broadwell LGA launches this quarter – the Core i7-5775C and Core i5-5675C. These two parts will be joined by a total of four Skylake-S products in Q3, the Core i7-6700K, Core i7-6700, Core i5-6600K, Core i5-6600 and the Core i5-6500.
Both Skylake-S and Broadwell LGA will replace the current crop of Haswell parts, including Devil’s Canyon products. However, Broadwell LGA sits one tier above Skylake-S and Haswell-based products.
Starting in Q4, we should see more Broadwell LGA parts, but we don’t have any names yet. In the first quarter of 2016, we can also expect new Skylake-S parts.
Speaking of 2016, Intel plans to unleash the Broadwell-E in the first quarter of 2016. Little is known about Broadwell-E, but the new 14nm flagship is expected to sport eight cores. Clocks remain unknown, although the 14nm node promises substantial gains.
Qualcomm Gives Snapdragon More Umph
Qualcomm has released a new Trepn Profiler app for Android which will profile Snapdragon processors and tinker with them.
The Trepn Profiler app identifies apps that overwork the CPU or are eating too much data. The app will pinpoint which of the apps drain the battery faster.
All data that will be obtained by this app can provide information you need to know which program is slowing down your phone.
Most Android phone users will not give a damn, but developers will find it useful. Those who are interested in testing roms, custom kernels, and their own apps can use the data gathered by the Trepn Profiler.
Developers can measure optimisation and performance on Snapdragon-powered mobile devices. Data are real-time include network usage, battery power, GPU frequency load, and CPU cores’ load. Key features also include six fast-loading profiling presets, and an advanced mode to manually select data points and save for analysis.
The Advanced Mode allows profiling a single app or device, offline data analysis, and increasing of data collection interval. This special mode also allows longer profiling sessions, displaying two data point in one overlay, and viewing of profile data.
All up this should enable developers to come up with more Snapdragon friendly apps.
AMD To Power Samsung’s Digital Media
AMD’s Embedded R-Series accelerated processing unit, previously codenamed “Bald Eagle,” is powering Samsung’s latest set-back-box digital media players.
Bald Eagle was designed for high performance at low power with broad connectivity but mostly for digital signage.
It seems that new Samsung SBB-B64DV4 is intended for demanding signage applications that transform Samsung SMART Signage Displays into digital tools for a wide range of business needs.
The chipmaker claimed that by using its Embedded R-Series APUs, Samsung SBB media players for digital signage can manage HD graphics performance and support multivideo stream capabilities up to two displays, in a power efficient and ultra-compact form factor.
Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that digital signage is a key vertical for the AMD Embedded business.
“The AMD Embedded R-Series APU enables leading digital signage providers to harness high levels of compute and graphics performance within a low-power design envelope. AMD Embedded Solutions help designers at Samsung achieve aggressive form factor goals and drive down system costs while providing the rich multimedia their digital signage customers’ demand,” he said.
The AMD Embedded RX-425BB APU combines an x86 CPU with an integrated, discrete-class AMD Radeon R6 graphics processing unit in a low-power configuration to minimize heat dissipation constraints and meet energy efficiency requirements.
The processor uses AMD’s latest Graphics Core Next architecture, created for advanced graphics applications and parallel processing capabilities.
Samsung Producing NVMe PCIe SSDs
Samsung Electronics has started mass production of what it claims is the industry’s first Non-Volatile Memory Express (NVMe) PCIe solid state drive (SSD), which has an M.2 form factor for use in PCs and workstations.
Samsung said in an announcement that it is “the first in the industry” to bring NVMe SSDs to OEMs for the PC market.
The SM951-NVMe operates at low power in standby mode and is the most compact of any NVMe SSD out there, according to the firm.
“Our new NVMe SSD will allow for faster, ultra-slim notebook PCs with extended battery use, while accelerating the adoption of NVMe SSDs in the consumer marketplace,” said SVP of memory marketing Jeeho Baek.
“Samsung will continue to stay a critical step ahead of others in the industry in introducing a diversity of next-generation SSDs that contribute to an enhanced user experience through rapid popularisation of ultra-fast, highly energy-efficient, compact SSDs.”
Samsung has added an NVMe version of the SM951 SSD after making a AHCI-based PCIe 3.0 version available since early January. This, Samsung said, will form an even stronger SSD portfolio.
The new NVMe-based SM951 SSD boasts a sequential data read and write speed of up to 2,260MBps and 1,600MBps respectively, while taking advantage of the firm’s own controller technology.
“These performance figures are the industry’s most advanced, with speeds four and three times faster than those of a typical SATA-based M.2 SSD which usually moves data at up to 540MBps and 500MBps respectively,” Samsung added.
The drive achieves these high speeds by using four 8Gbps lanes of simultaneous data flow. This allows for a data transfer rate of 32Gbps and a maximum throughput of 4GBps, giving the new drive a huge advantage over SATA-based M.2 SSDs, which can only transfer data at up to 600MBps.
When it comes to random read operations, the SM951-NVMe can process 300,000 IOPS operations, which is more than twice as fast as the 130,000 rate of its AHCI-based predecessor, Samsung said, while being more than three times faster than the 97,000 IOPS of a SATA-based SSD.
“Meeting all M.2 form factor requirements, the drive’s thickness does not exceed 4mm. [It] also weighs less than 7g, which is lighter than two nickels and only a tenth the weight of a 2.5in SSD. Capacities are 512GB, 256GB and 128GB,” Samsung explained.
Samsung said that the company plans to incorporate 3D V-NAND technology into its NVMe SSD line-up, which could see even higher densities and performance.
Earlier this week HP unveiled the HP Z Turbo Drive G2, a storage solution featuring Samsung’s NVMe SSDs to process large datasets.
The HP Z Turbo Drive G2 PCIe SSD is said to deliver four times traditional SATA SSD performance at a similar cost to previous devices. This will allow workstation users to “super-charge” the productivity and creativity of workflows, according to HP.
MidiaTek Developing Two SoC’s for Tablets
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MediaTek is working on two new tablet SoCs and one of them is rumored to be a $5 design.
The MT8735 looks like a tablet version of Mediatek’s smartphone SoCs based on ARM’s Cortex-A53 core. The chip can also handle LTE (FDD and TDD), along with 3G and dual-band WiFi. This means it should end up in affordable data-enabled tablets. There’s no word on the clocks or GPU.
The MT8163 is supposed to be the company’s entry-level tablet part. Priced at around $5, the chip does not appear to feature a modem – it only has WiFi and Bluetooth on board. GPS is still there, but that’s about it.
Once again, details are sketchy so we don’t know much about performance. However, this is an entry-level part, so we don’t expect miracles. It will have to slug it out with Alwinner’s $5 tablet SoC, which was announced a couple of months ago
According to a slide published by Mobile Dad, the MT8753 will be available later this month, but we have no timeframe for the MT8163.
But there’s nothing to see here as far as Torvalds is concerned. It’s just another day in the office. And all this in “Back To The Future II” year, as well.
Meanwhile under the bonnet, the community are already slaving away on Linux 4.1 which is expected to be a far more extensive release, with 100 code changes already committed within hours of Torvalds announcement of 4.0.
But there is already some discord in the ranks, with concerns that some of the changes to 4.1 will be damaging to the x86 compatibility of the kernel. But let’s let them sort that out amongst themselves.
After all, an anti-troll dispute resolution code was recently added to the Linux kernel in an effort to stop some of the more outspoken trolling that takes place, not least from Torvalds himself, according to some members of the community.