Sign up for our Technology Newsletter 
Intel Sends Braswell SoC To Partners
Intel announced that it is now shipping the Bay Trail system on a chip (SoC) successor codenamed Braswell to OEM partners.
Announced almost exactly a year ago at Intel’s Developer Forum in Beijing, Braswell is a more powerful version of Bay Trail running on the 14nm fab process, designed to power low-cost devices like Chromebooks and budget PCs.
The chip maker said that devices will hit the market sometime in late summer or autumn.
“We expect Braswell-based systems to be available in the market for the back to school 2015 selling season,” an Intel representative told The INQUIRER. “Specific dates and options will be announced by our OEM partners.”
That’s all Intel will give us for now, but we were told that full details regarding the upcoming chip will be revealed at IDF in Shenzhen next week.
Braswell was expected to arrive at the end of 2014 when it was originally unveiled last year.
Kirk Skaugen, general manager of Intel’s PC Client group, said that it will replace Bay Trail as part of the Atom line, and will feature in over 20 Chromebook designs.
“Last year, we had only four designs on Chrome. Today I can announce that we will have over 20 designs on Chrome,” said Skaugen at the time.
Intel recently announced another 14nm chip, the Atom x range, previously codenamed Cherry Trail, although this will be focused on tablets rather than the value PC market segment and Chromebooks like Braswell.
In terms of power, Braswell is likely to fit snuggly above the Atom x5 and x7 Cherry Trail SoCs and beneath the firm’s recently announced 5th-generation Core products, previously codenamed Broadwell.
Unveiled at Mobile World Congress earlier this year, Intel’s Atom x5 and x7 chips, previously codenamed Cherry Trail, are also updates to the previous Bay Trail Atom line-up, being the first Intel Atom SoCs on 14nm.
These higher-powered SoCs are designed to bring improved 3D performance to mainstream premium handheld devices running full versions of Windows and Android, such as 7in to 10.1in tablets and 2-in-1 hybrid laptops priced at around $119 to $499.
For example, Microsoft quietly announced on Tuesday that the upcoming Surface 3 tablet-laptop hybrid will be powered by an Intel Atom x7. The device is priced at $500.
Intel Debuts The N3000 Series SoC
Intel has launched Intel N3000 series systems on a chip (SoCs), which will kill off Bay Trail-M and Bay Trail-D SoCs on the desktop and mobile PCs.
CPU World also has spotted some other chips which have been revealed to the world.
Intel has also launched desktop and mobile Core i3 and Pentium microprocessors. New mobile models are Pentium 3825U, Core i3-5015U and i3-5020U. These ones are based on Broadwell 14nm.
Core i3-5015U and i3-5020U are dual-cores with Hyper-Threading technology, HD 5500 graphics and ultra low 15 Watt TDP. The processors run at 2.1 GHz and 2.2 GHz. This is 100 MHz higher than the i3-5005U and i3-5010U models, that were launched three months ago.
The i3-5015U and i3-5020U chips offer a 50 MHz higher graphics boost. Official prices of these SKUs are $275 and $281.
The Pentium 3825U incorporates a couple of enhancements on the older Pentium 3805U. It supports Hyper-Threading that allows it to process twice as many threads. It also has base and maximum graphics frequencies increased to 300 MHz and 850 MHz.
The 3805U and 3825U operate at 1.9 GHz and have 2 MB L2 cache. The 3825U processor is rated at 15 Watt TDP, and priced at $161.
Will Intel Challenge nVidia In The GPU Space?
Comments Off on Will Intel Challenge nVidia In The GPU Space?
Intel has released details of its next -generation Xeon Phi processor and it is starting to look like Intel is gunning for a chunk of Nvidia’s GPU market.
According to a briefing from Avinash Sodani, Knights Landing Chief Architect at Intel, a product update by Hugo Saleh, Marketing Director of Intel’s Technical Computing Group, an interactive technical Q&A and a lab demo of a Knights Landing system running on an Intel reference-design system, Nvidia could be Intel’s target.
Knights Landing and prior Phi products are leagues apart and more flexible for a wider range of uses. Unlike more specialized processors, Intel describes Knights Landing as taking a “holistic approach” to new breakthrough applications.
The current generation Phi design, which operates as a coprocessor, Knights Landing incorporates x86 cores and can directly boot and run standard operating systems and application code without recompilation.
The test system had socketed CPU and memory modules was running a stock Linux distribution. A modified version of the Atom Silvermont x86 cores formed a Knights Landing ’tile’ which was the chip’s basic design unit consisting of dual x86 and vector execution units alongside cache memory and intra-tile mesh communication circuitry.
Each multi-chip package includes a processor with 30 or more tiles and eight high-speed memory chips.
Intel said the on-package memory, totaling 16GB, is made by Micron with custom I/O circuitry and might be a variant of Micron’s announced, but not yet shipping Hybrid Memory Cube.
The high-speed memory is similar to the DDR5 devices used on GPUs like Nvidia’s Tesla.
It looks like Intel saw that Nvidia was making great leaps into the high performance arena with its GPU and thought “I’ll be having some of that.”
The internals of a GPU and Xeon Phi are different, but share common ideas.
Nvidia has a big head start. It has already announced the price and availability of a Titan X development box designed for researchers exploring GPU applications to deep learning. Intel has not done that yet for Knights Landing systems.
But Phi is also a hybrid that includes dozens of full-fledged 64-bit x86 cores. This could make it better at some parallelizable application categories that use vector calculations.
USB 3.1 Coming Later This Year
The emerging USB 3.1 standard is on track to reach desktops as hardware companies release motherboards with ports that can transfer data twice as fast as the previous USB technology.
MSI recently announced a 970A SLI Krait motherboard that will support the AMD processors and the USB 3.1 protocol. Motherboards with USB 3.1 ports have also been released by Gigabyte, ASRock and Asus, but those boards support Intel chips.
USB 3.1 can shuffle data between a host device and peripheral at 10Gbps, which is two times faster than USB 3.0. USB 3.1 is also generating excitement for the reversible Type-C cable, which is the same on both ends so users don’t have to worry about plug orientation.
The motherboards with USB 3.1 technology are targeted at high-end desktops. Some enthusiasts like gamers seek the latest and greatest technologies and build desktops with motherboards sold by MSI, Asus and Gigabyte. Many of the new desktop motherboards announced have the Type-C port interface, which is also in recently announced laptops from Apple and Google.
New technologies like USB 3.1 usually first appear in high-end laptops and desktops, then make their way down to low-priced PCs, said Dean McCarron, principal analyst of Mercury Research.
PC makers are expected to start putting USB 3.1 ports in more laptops and desktops starting later this year.
SUSE Brings Hadoop To IBM z Mainframes
SUSE and Apache Hadoop vendor Veristorm are teaming up to bring Hadoop to IBM z and IBM Power systems.
The result will mean that regardless of system architecture, users will be able to run Apache Hadoop within a Linux container on their existing hardware, meaning that more users than ever will be able to process big data into meaningful information to inform their business decisions.
SUSE’s Veristorm Data Hub and vStorm Enterprise Hadoop will now be available as zDoop, the first mainframe-compatible Hadoop iteration, running on SUSE Linux Enterprise Server for System z, either on IBM Power12 or Power8 machines in little-endian mode, which makes it significantly easier for x86 based software to be ported to the IBM platform.
SUSE and Veristorm have also committed to work together on educating partners and channels on the benefits of the overall package.
Naji Almahmoud, head of global business development for SUSE, said: “The growing need for big data processing to make informed business decisions is becoming increasingly unavoidable.
“However, existing solutions often struggle to handle the processing load, which in turn leads to more servers and difficult-to-manage sprawl. This partnership with Veristorm allows enterprises to efficiently analyse their mainframe data using Hadoop.”
Veristorm launched Hadoop for Linux in April of last year, explaining that it “will help clients to avoid staging and offloading of mainframe data to maintain existing security and governance controls”.
Sanjay Mazumder, CEO of Veristorm, said that the partnership will help customers “maximize their processing ability and leverage their richest data sources” and deploy “successful, pragmatic projects”.
SUSE has been particularly active of late, announcing last month that its software-defined Enterprise Storage product, built around the open source Ceph framework, was to become available as a standalone product for the first time.
IBM Debuts New Mainframe
IBM has started shipping its all-new first z13 mainframe computer.
IBM has high hopes the upgraded model will generate solid sales based not only on usual customer patterns but its design focus aimed at helping them cope with expanding mobile usage, analysis of data, upgrading security and doing more “cloud” remote computing.
Mainframes are still a major part of the Systems and Technology Group at IBM, which overall contributed 10.8 percent of IBM’s total 2014 revenues of $92.8 billion. But the z Systems and their predecessors also generate revenue from software, leasing and maintenance and thus have a greater financial impact on IBM’s overall picture.
The new mainframe’s claim to fame is to use simultaneous multi-threading (SMT) to execute two instruction streams (or threads) on a processor core which delivers more throughput for Linux on z Systems and IBM z Integrated Information Processor (zIIP) eligible workloads.
There is also a single Instruction Multiple Data (SIMD), a vector processing model providing instruction level parallelism, to speed workloads such as analytics and mathematical modeling. All this means COBOL 5.2 and PL/I 4.5 exploit SIMD and improved floating point enhancements to deliver improved performance over and above that provided by the faster processor.
Its on chip cryptographic and compression coprocessors receive a performance boost improving both general processors and Integrated Facility for Linux (IFL) cryptographic performance and allowing compression of more data, helping tosave disk space and reducing data transfer time.
There is also a redesigned cache architecture, using eDRAM technology to provide twice as much second level cache and substantially more third and fourth level caches compared to the zEC12. Bigger and faster caches help to avoid untimely swaps and memory waits while maximisng the throughput of concurrent workload Tom McPherson, vice president of z System development, said that the new model was not just about microprocessors, though this model has many eight-core chips in it. Since everything has to be cooled by a combination of water and air, semiconductor scaling is slowing down, so “you have to get the value by optimizing.
The first real numbers on how the z13 is selling won’t be public until comments are made in IBM’s first-quarter report, due out in mid-April, when a little more than three weeks’ worth of billings will flow into it.
The company’s fiscal fortunes have sagged, with mixed reviews from both analysts and the blogosphere. Much of that revolves around IBM’s lag in cloud services. IBM is positioning the mainframe as a prime cloud server, one of the systems that is actually what cloud computing goes to and runs on.
Intel Shows Off The Xeon SoC
Intel has announced details of its first Xeon system on chip (SoC) which will become the new the Xeon D 1500 processor family.
Although it is being touted as a server, storage and compute applications chip at the “network edge”, word on the street is that it could be under the bonnet of robots during the next apocalypse.
The Xeon D SoCs use the more useful bits of the E3 and Atom SoCs along with 14nm Broadwell core architecture. The Xeon D chip is expected to bring 3.4x better performance per watt than previous Xeon chips.
Lisa Spelman, Intel’s general manager for the Data Centre Products Group, lifted the kimono on the eight-core 2GHz Xeon D 1540 and the four-core 2.2GHz Xeon D 1520, both running at 45W. It also features integrated I/O and networking to slot into microservers and appliances for networking and storage, the firm said.
The chips are also being touted for industrial automation and may see life powering robots on factory floors. Since simple robots can run on basic, low-power processors, there’s no reason why faster chips can’t be plugged into advanced robots for more complex tasks, according to Intel.
SUSE Goes OpenStack Cloud 5
SUSE has released OpenStack Cloud 5, the latest version of the its infrastructure-as-a-service private cloud distro.
Version 5 adds the OpenStack brand front and centre, and its credentials are based on the latest Juno build of the OpenStack open source platform.
This version includes enhanced networking flexibility, with additional plug-ins available and the addition of distributed virtual routing. This enables individual computer nodes to handle routing tasks together, or if needs be, clustering together.
Increased operational efficiency comes in the form of a new seamless integration with existing servers running outside the cloud. In addition, log collection is centralized into a single view.
As you would expect, SUSE OpenStack 5 is designed to fit perfectly alongside the company’s other products, including the recently launched Suse Enterprise Storage and Suse Linux Enterprise Server 12 as well as nodes from earlier versions.
Deployment has also been simplified as part of a move to standardise “as-a-service” models.
Also included is the company’s new Sahara data processing project designed to run Hadoop and Spark on top of OpenStack without degradation. MapR has released support for its own service by way of a co-branded plug-in.
“Furthering the growth of OpenStack enterprise deployments, Suse OpenStack Cloud makes it easier for customers to realise the benefits of a private cloud, saving them money and time they can use to better serve their own customers and business,” said Brian Green, managing director, UK and Ireland, at Suse.
“Automation and high availability features translate to simplicity and efficiency in enterprise data centers.”
Suse OpenStack Cloud 5 becomes generally available from today.
Will Intel Release Skylake This Year?
Intel has confirmed that it will release Core M processors this year based on its new Skylake chip design.
Intel CEO Brian Krzanich said at the Goldman Sachs Technology and Internet conference that the the new Core M chips are due in the second half of the year and will also extend battery life in tablets, hybrids, and laptop PCs.
The new chips will mean much thinner tablets and mobile PCs which will make Apple’s Air look decidedly portly. Intel’s Core M chips, introduced last year, are based on the Broadwell but the Skylake chips should also improve graphics and general application performance.
The Skylake chips will be able to run Windows 10, as well as Google’s Chrome and Android OSes, Krzanich said. But most existing Core M systems run Windows 8.1, and Intel has said device makers haven’t shown a lot of interest in other OSes. So most Skylake devices will probably run Windows 10. Chipzilla is expected to give more details about the new Core M chips in June at the Computex trade show in Taipei.
Skylake systems will also support the second generation of Intel’s RealSense 3D camera technology, which uses a depth sensor to create 3D scans of objects, and which can also be used for gesture and facial recognition. The hope is that the combination of Skylake and a new Windows operating system will give the PC industry a much needed boost.
In related news, Intel announced that socketed Broadwell processors will be available in time for Windows 10.
IBM Goes Bare Metal
IBM has announced the availability of OpenPower servers as part of the firm’s SoftLayer bare metal cloud offering.
OpenPower, a collaborative foundation run by IBM in conjunction with Google and Nvidia, offers a more open approach to IBM’s Power architecture, and a more liberal licence for the code, in return for shared wisdom from member organisations.
Working in conjunction with Tyan and Mellanox Technologies, both partners in the foundation, the bare metal servers are designed to help organisations easily and quickly extend infrastructure in a customized manner.
“The new OpenPower-based bare metal servers make it easy for users to take advantage of one of the industry’s most powerful and open server architectures,” said Sonny Fulkerson, CIO at SoftLayer.
“The offering allows SoftLayer to deliver a higher level of performance, predictability and dependability not always possible in virtualised cloud environments.”
Initially, servers will run Linux applications and will be based on the IBM Power8 architecture in the same mold as IBM Power system servers.
This will later expand to the Power ecosystem and then to independent software vendors that support Linux on Power application development, and are migrating applications from x86 to the Power architecture.
OpenPower servers are based on open source technology that extends right down to the silicon level, and can allow highly customised servers ranging from physical to cloud, or even hybrid.
Power systems are already installed in SoftLayer’s Dallas data centre, and there are plans to expand to data centres throughout the world. The system was first rolled out in 2014 as part of the Watson portfolio.
Prices will be announced when general availability arrives in the second quarter.