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AMD Goes Virtual With Liquid VR
AMD Liquid VR is not a retail product – it is an initiative to develop and deliver the best Virtual Reality (VR) experience in the industry.
AMD Liquid VR was announced at the Game Developers Conference in San Francisco, and the company describes it is a “set of innovative technologies focused on enabling exceptional VR content development” for hardware based on AMD silicon.
Developers will soon get access to the LiquidVR SDK, which will help them address numerous issues associated with VR development.
Platform and software rather than hardware
If you were expecting to see a sexy AMD VR headset with a killer spec, the announcement may be disappointing. However, if you are a “what’s under the bonnet” kind of geek, there are a few interesting highlights.
AMD has put a lot of effort into minimising motion-to-photon latency, which should not only help improve the experience, but also keep you from experiencing motion sickness, or hurling over that new carpet that really ties the room together.
Headline features of LiquidVR SDK 1.0 include:
Async Shaders for smooth head-tracking enabling Hardware-Accelerated Time Warp, a technology that uses updated information on a user’s head position after a frame has been rendered and then warps the image to reflect the new viewpoint just before sending it to a VR headset, effectively minimizing latency between when a user turns their head and what appears on screen.
Affinity Multi-GPU for scalable rendering, a technology that allows multiple GPUs to work together to improve frame rates in VR applications by allowing them to assign work to run on specific GPUs. Each GPU renders the viewpoint from one eye, and then composites the outputs into a single stereo 3D image. With this technology, multi-GPU configurations become ideal for high performance VR rendering, delivering high frame rates for a smoother experience.
Latest data latch for smooth head-tracking, a programming mechanism that helps get head tracking data from the head-mounted display to the GPU as quickly as possible by binding data as close to real-time as possible, practically eliminating any API overhead and removing latency.
Direct-to-display for intuitively attaching VR headsets, to deliver a seamless plug-and-play virtual reality experience from an AMD Radeon™ graphics card to a connected VR headset, while enabling features such as booting directly to the display or using extended display features within Windows.
You can grab the full AMD LiquidVR presentation here. (pdf)
What’s next for LiquidVR?
It all depends on what you were expecting, and what the rest of the industry does. AMD hopes LiquidVR will be compatible with a broad range of VR devices. LiquidVR will allow hardware makers to implement AMD technology in their products with relative ease, enabling 100Hz refresh rates, the use of individual GPUs per each eye and so on.
To a certain extent, you can think of LiquidVR as FreeSync for VR kit.
Oculus CEO Brendan Irbe said achieving presence in a virtual world is one of the most important elements needed to deliver a good user experience.
He explained where AMD comes in:
“We’re excited to have AMD working with us on their part of the latency equation, introducing support for new features like asynchronous timewarp and late latching, and compatibility improvements that ensure that Oculus’ users have a great experience on AMD hardware.”
Raja Koduri, corporate vice president, Visual Computing, AMD, said content, comfort and compatibility are the cornerstones of AMD’s focus on VR.
AMD’s resident graphics guru said:
“With LiquidVR we’re collaborating with the ecosystem to unlock solutions to some of the toughest challenges in VR and giving the keys to developers of VR content so that they can bring exceptional new experiences to life.”
A picture is worth a thousand words, so here’s 3300 frames of AMD’s virtual reality vision.
Qualcomm Goes Ultrasonic
Qualcomm has unveiled what it claims is the world’s first ‘ultrasonic’ fingerprint scanner, in a bid to improve mobile security and further boost Android’s chances in the enterprise space.
The Qualcomm Snapdragon Sense ID 3D Fingerprint technology debuted during the chipmaker’s Mobile World Congress (MWC) press conference on Monday.
The firm claimed that the new feature will outperform the fingerprint scanners found on smartphones such as the iPhone 6 and Galaxy S6.
Qualcomm also claimed that, as well as “better protecting user data”, the 3D ultrasonic imaging technology is much more accurate than capacitive solutions currently available, and is not hindered by greasy or sweaty fingers.
Sense ID offers a more “innovative and elegant” design for manufacturers, the firm said, owing to its ability to scan fingerprints through any material, be it glass, metal or sapphire.
This means, in theory, that future fingerprint sensors could be included directly into a smartphone’s display.
Derek Aberle, Qualcomm president, said: “This is another industry first for Qualcomm and has the potential to revolutionise mobile security.
“It’s also another step towards the end of the password, and could mean that you’ll never have to type in a password on your smartphone again.”
No specific details or partners have yet been announced, but Qualcomm said that the Sense ID technology will arrive in devices in the second half of 2015, when the firm’s next-generation Snapdragon 820 processor is also tipped to debut.
The firm didn’t reveal many details about this chip, except that it will feature Kryo 64-bit CPU tech and a new machine learning feature dubbed Zeroth.
Qualcomm also revealed more details about LTE-U during Monday’s press conference, confirming plans to extend LTE to unused spectrum using technology integrated in its latest small-cell solutions and RF transceivers for mobile devices.
“We face many challenges as demand for data constantly grows, and we think the best way to fix this is by taking advantage of unused spectrum,” said Aberle.
Finally, the chipmaker released details about a new a partnership with Cyanogen, the open-source outfit responsible for the CyanogenMod operating system.
Qualcomm said that it will provide support for the best features and UI enhancements of CyanogenMod on Snapdragon processors, which will be available for the release of Qualcomm Reference Design in April.
The MWC announcements follow the launch of the ARM Cortex-based Snapdragon 620 and 618 chips last month, which promise to improve connectivity and user experience on high-end smartphones and tablets.
Aberle said that these chips will begin to show up in devices in mid to late 2015.
Can MediaTek Take On Qualcomm?
While Qualcomm’s 20nm Snapdragon 810 SoC might be the star of upcoming flagship smartphones, it appears that MediaTek has its own horse for the race, the octa-core MT6795.
Spotted by GforGames site, in a GeekBench test results and running inside an unknown smartphone, MediaTek’s MT6795 managed to score 886 points in the single-core test and 4536 points in the multi-core test. These results were enough to put it neck to neck with the mighty Qualcomm Snapdragon 810 SoC tested in the LG G Flex 2, which scored 1144 points in the single-core and 4345 in the multi-core test. While it did outrun the MT6795 in the single-core test, the multi-core test was clearly not kind on the Snapdragon 810.
The unknown device was running on Android Lollipop OS and packed 3GB of RAM, which might gave the MT6795 an edge over the LG G Flex 2.
MediaTek’s octa-core MT6795 was announced last year and while we are yet to see some of the first design wins, recent rumors suggested that it could be powering Meizu’s MX5, HTC’s Desire A55 and some other high-end smartphones. The MediaTek MT6795 is a 64-bit octa-core SoC clocked at up to 2.2GHz, with four Cortex-A57 cores and four Cortex-A53 cores. It packs PowerVR G6200 graphics, supports LPDDR3 memory and can handle 2K displays at up to 120Hz.
As we are just a few days from Mobile World Congress (MWC) 2015 which will kick off in Barcelona on March 2nd, we are quite sure that we will see more info as well as more benchmarks as a single benchmark running on an unknown smartphone might not be the best representation of performance, it does show that MediaTek certainly has a good chip and can compete with Qualcomm and Samsung.
Are Flash Drives Becoming More Secure?
Flash drives in mobile devices are set to become faster and secure thanks to a new standard signed off by the JEDEC Solid State Technology Association.
eMMC version 5.1, will allow for a new mobile storage that will provide faster access. Flash drives based on eMMC 5.1 can handle 4K streaming and more data-intensive tasks.
Samsung has started making 64GB, 32GB and 16GB drives based on the new standard and is shipping units to customers, but has not said whether those drives will be used in the Galaxy S6 smartphone, which will be announced early next month at the Mobile World Congress trade show.
Samsung’s 64GB eMMC 5.1 has a random read performance of 11,000 IOPS (input/output operations per second) and write performance of 13,000 IOPS, compared to a rough performance of 7,000 IOPS for 64GB drives based on the previous eMMC 5.0 standard.
The speed improvements comes through some cache and data-streaming improvements.
There is also something called Secure Write Protection ensures only specific entities are able to access files and lock or unlock storage.
Intel Gives Exascale A Boost
Intel’s exascale computing efforts have received a boost with the extension of the company’s research collaboration with the Barcelona Supercomputing Center.
Begun in 2011 and now extended to September 2017, the Intel-BSC work is currently looking at scalability issues with parallel applications.
Karl Solchenbach, Intel’s director, Innovation Pathfinding Architecture Group in Europe said it was important to improve scalability of threaded applications on many core nodes through the OmpSs programming model.
The collaboration has developed a methodology to measure these effects separately. “An automatic tool not only provides a detailed analysis of performance inhibitors, but also it allows a projection to a higher number of nodes,” says Solchenbach.
BSC has been making HPC tools and given Intel an instrumentation package (Extrae), a performance data browser (Paraver), and a simulator (Dimemas) to play with.
Charlie Wuischpard, VP & GM High Performance Computing at Intel said that the Barcelona work is pretty big scale for Chipzilla.
“A major part of what we’re proposing going forward is work on many core architecture. Our roadmap is to continue to add more and more cores all the time.”
“Our Knights Landing product that is coming out will have 60 or more cores running at a slightly slower clock speed but give you vastly better performance,” he said.
Will AMD’s Kaveri Launch As Godavari?
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The new desktop refresh according to SweClockers is going to end up with A10-8850K branding. The new processor will get a 100MHz faster turbo clock and is based on the same 28nm manufacturing process. The base CPU clock for the A10-8850K is 3.7GHz, the same speed as the AMD A10-7850K, but the Turbo clock will jump to 4.1GHz with the new one. The A10-7850K has 4.0 GHz top turbo clock and 720 MHz GPU speed for its GCN Sea Island GPU.
The new A10-8850K will get the GPU to 856MHz. The memory speed supported stays at 2133MHz and the socket of choice remains FM2+. The TDP stays at 95W.
As you can see this is a small evolution and you can expect some cool parts for AMD on the desktop side in the latter part of 2016, some eighteen months from now, in 14nm.
AMD’s Carrizo Coming In The Second Quarter
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AMD released its earnings today and one cool question came up about the upcoming Carrizo mobile APU.
Lisa SU, the new AMD President and CEO, told MKM Partners analyst Ian Ing that Carrizo is coming in Q2 2015.
This is a great news and AMD’s Senior VP and outgoing general manager of computing and graphics group John Byrne already shared a few details about his excitement about Carrizo.
There are two Carrizo parts, one for big notebooks and All in Ones called Carrizo and a scaled down version called Carrizo L. We expect that the slower Carrizo-L is first to come but, Lisa was not specific. Carrizo-L is based on Puma+ CPU cores with AMD Radeon R-Series GCN graphics is intended for mainstream configurations with Carrizo targeting the higher performance notebooks.
Usually when a company says that something is coming in Q2 2015 that points to a Computex launch and this Taipei based tradeshow starts on June 2 2015. We strongly believe that the first Carrizo products will showcased at or around this date.
Lisa also pointed out that AMD has “significantly improved performance in battery life in Carrizo.” This is definitely good news, as this was one of the main issues with AMD APUs in the notebook space.
Lisa also said that AMD expects Carrizo to be beneficial for embedded and other businesses as well. If only it could have come a bit earlier, so let’s hope AMD can get enough significant design wins with Carrizo. AMD has a lot of work to do in order to get its products faster to market, to catch up with Intel on power and performance or simply to come up with innovative devices that will define its future. This is what we think Lisa is there for but in chip design, it simply takes time.
Is Qualcomm Overheating?
South Korean smartphone maker LG Electronics Inc said on Thursday that it has not experienced any overheating problems with Qualcomm Inc’s new Snapdragon processor that is powering a curved-screen device going on sale later this month.
“I am very much aware of the various concerns in the market about the (Snapdragon) 810, but the chip’s performance is quite satisfactory,” Woo Ram-chan, LG vice president for mobile product planning, told reporters at a press event for the company’s G Flex2 smartphone.
The comment came after Bloomberg reported a day earlier that Samsung Electronics Co Ltd, the world’s top smartphone maker, decided not to use the new Qualcomm processor for the next flagship Galaxy S smartphone after the chip overheated during testing. Samsung and Qualcomm have declined to comment on the report, which cited unidentified sources.
Samsung is widely expected to unveil the new Galaxy S smartphone in early March, and Bloomberg reported that the Korean firm will use its own processors instead.
But LG’s Woo said on Thursday that internal tests for the G Flex2, powered by the new Qualcomm processor, show that the new product emits less heat than other existing devices. The new phone is scheduled to start selling in South Korea on Jan. 30.
“I don’t understand why there is a issue over heat,” he said.
AMD Headed To The Facial Recognition Space
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AMD has developed facial recognition technology to enable users to organize and search video clips based on the people featured in them.
AMD executive Richard Gayle demonstrated to Tom’s Guide how AMD Content Manager, uses facial recognition to browse through a group of local videos to find specific faces.
There is an index that displays the people’s faces that have been detected throughout the video clips.
The user can edit the names of the people as well as add keyword tags to help improve future searches for specific people.
For instance, if you are searching for videos that feature one person, you can click on his or her respective face to pull up the corresponding videos.
Additionally, if you want to narrow a search to a specific person combined with a keyword tag, you can drag the face icon and click on the desired keyword.
Once you click on the video you wish to view, a player appears in the right windowpane, along with a timeline displayed at the bottom with a list of all the people who appear in the video.
The timeline is separated into various coloured boxes to mark the exact moment in the video when each person first appears on screen, so you do not have to watch the entire video to see the bit you want.
The application also has facial recognition capabilities that allow users to do some basic editing, such as compiling a single montage video of any individual or individuals.
While this is pretty good technology, it probably does not have any major use yet on its own.
Gayle said it is unlikely that AMD will release Content Manager in its current form but will license it to OEMs that are able to rebrand the application before offering it on their respective systems.
He claimed that only AMD processors have sufficient power to operate the application, because of the processor’s ability to have the CPU, GPU and memory controller work closely together.
HP Has Two More Tablets In Route
HP is about to put out two tablets later this year.
The names are expected to be the HP Pro Slate 10 EE G1 and HP Pro Tablet 10 EE G1 and they were found on the world wide wibble by Notebook Italia,.
Both tablets are powered by an Intel quad-core Bay Trail Atom Z3735F processor. Accompanying the processor package is 2GB of RAM, as well as 32GB of internal storage. Both the Pro Slate and Pro Tablet come with 10.1-inch displays, as well as 802.11n Wi-Fi, Bluetooth, and NFC.
The Pro Slate sticks with Android, while the Pro Tablet opts for Windows 8.1. The tablets mean they will each come with a stylus, but it would appear that the stylus is just a stand in for your finger, rather than doing anything useful.
Pro Slate will set you back $400.00 and Pro Tablet cost $499.
HP has yet to officially announce either device.