The new test chip contains ARM’s yet-to-be-announced “Artemis” CPU core which is named after a goddess who will turn you into deer and tear you apart with wild dogs if you ever see her. [The NDA must have been pretty tough on this chip.ed]

In fact things have been ticking along on this project for ages. ARM discloses that tapeout actually took place back in December last year and is expecting silicon to come back from the foundry in the following weeks.

ARM actually implemented a full four-core Artemis cluster on the test chip which should show vendors what is possible for their production designs. The test chip has a current generation Mali GPU implementation with 1 shader core to show vendors what they will get when they use ARM’s POP IP in conjunction with its GPU IP. There is also a range of other IP blocks and I/O interfaces that are used to validation of the new manufacturing process.

TSMC’s 10FF manufacturing process is supposed to increase density with scaling’s of up to 2.1x compared to the previous 16nm manufacturing node. It also brings about 11-12 per cent higher performance at each process’ respective nominal voltage, or a 30 per cent reduction in power.

ARM siad that comparing a current Cortex A72 design on 16FF+ and an Artemis core on 10FF on the new CPU and process can halve the dynamic power consumption. Currently clock frequencies on the new design are still behind the older more mature process and IP, but ARM expects this to improve as it optimizes its POP and the process stabilizes.

Courtesy-Fud

Bristol Ridge and Stoney Ridge sound a little like locations in a Somerset version of Game of Thrones, but they both feature AMD’s Excavator x86 processor cores and Radeon R7 graphics, which AMD sees powering e-sports gaming on laptops.

Bristol Ridge is the more powerful of the two coming in 35W and 15W versions of AMD FX, A12 and A10 processors, offering up to 3.7GHz of processing power. The former two processors are paired with up to eight Graphics Core Next (GCN) cores in the R7 to provide a decent pool of graphics processing power.

Stoney Bridge offers less in the way of processor power, topping out at 3.5GHz, and versions include 15W A9, A6 and E2 processor configurations coupled with lower powered graphics accelerators.

AMD claimed that the new APUs offer a 50 per cent hike in performance over the previous generation Carrizo APUs. However, this rise is over APUs from the early part of Carrizo’s lifecycle, so performance gains over the most recent Carrizo APUs are likely to be 10 to 20 per cent.

AMD also said that its silicon is faster than rival chips from Intel, including the i3-6100U found in several ultraportable laptops.

Many of these tests are subjective and depend on how a hardware manufacture configures and sets up the APUs in a laptop or tablet, but AMD does have its graphics tech to draw on, such as the GCN architecture, which could give it the edge over Intel’s chips when it comes to pushing pixels.

The APUs will be aimed primarily at slim laptops that need low-power consumption chips, much like Intel’s Skylake line.

Bristol Ridge is currently available to end users only in the form of HP’s latest Envy laptop. But now that AMD has debuted the full range of the seventh-generation APUs we can expect to see them in other ultraportable machines before too long.

Courtesy-TheInq

Our well-placed sources are confident that the PC group will be the hardest hit. This is all because the PC market has stopped growing and Intel has to find its way to new markets to supplement loss of this business.

Latest research data from IDC indicates that in 2016 PC market will decline from 275.8 million units in 2015 to 260.8 million units in 2016 and the current projections for 2017 show the PC market slightly decreasing to 257.9 million units. At its peak PC market was at 364.0 million units, but this was in 2011 when things were rosier, kids were polite to their parents, and rock stars played decent music. These times are clearly behind us and Intel knows it.

The PC group downsize is being supervised by Dr. Venkata “Murthy” Renduchintala who is Intel’s number two. He is the bloke who was paid $25 million dollars to defect from Qualcomm. Murthy has already done a high level clean up at PC client group and is believed to be thinking about dusting the top of the corporate bookshelf next.

Another team which will be pummeled is Rene James’s old software outfit. People from software services and the security division formerly known as McAfee are expected to mostly go the same way as the artist formerly known as Prince.

Murthy’s also wants to get Intel to the right course with IoT market. Marketing for that area is expected to grow from $655.8 billion in 2014 to $1.7 trillion in 2020. Intel wants the piece of that cake, and perhaps a few tea and biscuits to go with it and it will be interesting to look the fight in this promising land market.

There is still no killer app to help the IoT market which defines it. IoT right now is nothing and everything.

Courtesy-Fud

A recent Chinese-language Economic Daily News report claims that Mediatek wants the spun off business to drive VR sales. It all sounds pretty good but MediaTek have sort of denied the report.

Well we say sort of denied it. What it has told the Taiwan Stock Exchange  that it was not the report’s source, which is not quite the same thing.The spin off could go ahead, but MediaTek is denying that it told the EDN its cunning plans. But then again the EDN did not name its source either. Without a denial from the company we are none the wiser.

MediaTek’s VR unit was set up between end-2015 and early-2016 to focus on the development of the company’s VR solutions for handsets, the EDN thought.

Fundamental research leading towards faster wireless networks, secure low-power technologies for the Internet of Things, and even 3D displays will be the focus of Intel’s collaboration with the French Alternative Energies and Atomic Energy Commission (CEA).

Intel and the CEA already work together in the field of high-performance computing, and a new agreement signed Thursday will see Intel fund work at the CEA’s Laboratory for Electronics and Information Technology (LETI) over the next five years, according to Rajeeb Hazra, vice president of Intel’s data center group.

The CEA was founded in 1945 to develop civil and military uses of nuclear power. Its work with Intel began soon after it ceased its atmospheric and underground nuclear weapons test programs, as it turned to computer modeling to continue its weapons research, CEA managing director Daniel Verwaerde said Thursday.

That effort continues, but the organization’s research interests today are more wide-ranging, encompassing materials science, climate, health, renewable energy, security and electronics.

These last two areas will be at the heart of the new research collaboration, which will see scientists at LETI exchanging information with those at Intel.

Both parties dodged questions about who will have the commercial rights to the fruits of their research, but each said it had protected its rights. The deal took a year to negotiate.

“It’s a balanced agreement,” said Stéphane Siebert, director of CEA Technology, the division of which LETI is a part.

Who owns what from the five-year research collaboration may become a thorny issue, for French taxpayers and Intel shareholders alike, as it will be many years before it becomes clear which technologies or patents are important.

Hazra emphasized the extent to which Intel is dependent on researchers outside the U.S. The company has over 50 laboratories in Europe, four of them specifically pursuing so-called exa-scale computing, systems capable of billions of billions of calculations per second.

Source-http://www.thegurureview.net/mobile-category/intel-look-to-atomic-energy-for-mobile-technologys-future.html

Digitimes’ deep throats claimed TSMC is expected to achieve certification on its 10nm process in the fourth quarter of 2016, and deliver product samples to the customer for validation in the first quarter of 2017.

This means that TSMC could begin small-volume production for Apple’s A11 chips as early as the second quarter of 2017 and building the chips will likely start to generate revenues at TSMC in the third quarter. The A11-series processor will power the iPhone models slated for launch in the second half of 2017.

TSMC is expected to get two-thirds of the overall A11 chip orders from Apple.

The company is officially refusing to comment on Digitimes’ story, but it does fit into what we have already been told about Jobs’ Mob’s plans for next year.

LG said the dispute with Qualcomm has been completely settled, although it did not say how much it had agreed to pay. Earlier it had claimed Qualcomm had overcharged for the chips under a licensing contract.

The news about the lawsuit settlement emerged following Qualcomm’s profit forecast for the second quarter in January, which was below what Wall Street’s tarot readers had predicted.

The company expected its mobile chip shipment to fall by 16-25 per cent in the second quarter. Additionally, it expected 3G and 4G device shipment to decline by 4 to 14 per cent. As for the first quarter of 2016, Qualcomm’s chip shipment fell 10 per cent , with a drop in revenue by 21.6 per cent. Revenue from licensing declined 10.4 per cent, suggests a Reuters report.

An LG spokesperson said that this kind of dispute was “actually nothing” and was similar to the ones that the industries had in the past.

“Qualcomm has lowered its royalty rate to LG in return for LG’s guaranteed purchase of Qualcomm processors, which are currently being used in its flagship handsets and will be used in upcoming flagship models,” added the official.

Qualcomm might have been a little nervy.  LG has invested millions to develop its own chipset, in an attempt to cut down its dependency on Qualcomm for mobile processors.

Courtesy-Fud

The 2nd generation High Bandwidth Memory (HBM 2.0) for high-end GPUs might happen in very late Q4 2016 but realistically it probably won’t ship until 2017 in any volume.

The first card that we expect supporting this feature might be the Greenland, a card that AMD might end up calling Vega. Even according Radeon Technology Group’s official GPU roadmap, Vega / Greenland now look like a 2017 product, or at very best, late 2016 card. Nvidia might make the HBM 2.0 version of the Titan card, but we don’t expect to see a Geforce GTX based on Pascal GPU and HBM 2.0 coming to the market this year.

We managed to talk to some of the memory manufactures and they told us that HBM 2.0 is very limited in supply, and limited supply makes things expensive.

It seems that GPUs of 2016, including the new AMD Polaris and the new Geforce, will be stuck with GDDR5 and in best case scenario with GDDR5X from Micron. The word on the street is that both Geforce GTX based on Pascal and AMD/RTG’s Polaris 10 / Ellesmere and Polaris 11 / Baffin might launch at Computex during last days of May or early June 2016.

Courtesy-Fud

For TSMC, Q1 2016 was marked by a reduction of demand for high-end smartphones, while smartphone demand in China and emerging markets had upward momentum. Beginning Q2 2016 and onward, the company expect to get back onto a growth trajectory and is projected to hit a 5 to 10 percent growth rate in 2016.

“Our 10-nanometer technology development is on track,” said company president and co-CEO Mark Liu during the company’s Q4 2015 earnings call. “We are currently in intensive yield learning mode in our technology development. Our 256-megabit SRAM is yielding well. We expect to complete process and product qualification and begin customer product tape-outs this quarter.”

“Our 7-nanometer technology development progress is on schedule as well. TSMC’s 7 nanometer technology development leverage our 10-nanometer development very effectively. At the same time, TSMC’s 7-nanometer offers a substantial density improvement, performance improvement and power reduction from 10-nanometer.

These two technologies, 10-nanometer and 7-nanometer, will cover a very wide range of applications, including application processors for smartphone, high-end networking, advanced graphics, field-programmable gate arrays, game consoles, wearables and other consumer products.”

In Q1 2016, TSMC reached a gross margin of 44.9 percent, an operating margin of 34.6 percent and a net profit margin of 31.8 percent respectively. Going forward into Q2 2016, the company is expecting revenue between ~$6.65 billion and ~$6.74 billion USD, gross margins between 49 and 51 percent, and operating profit margins between 38.5 and 40.5 percent, respectively.

Chips used for communications and industrial uses represented over 80 percent of TSMC’s revenue in FY 2015. The company was also able to improve its margins by increasing 16-nanometer production, and like many other semiconductor companies, is preparing for an expected upswing sometime in 2017.

In February, a 6.4-magnitude earthquake struck southern Taiwan where TSMC’s 12-inch Fab 14 is located, a current site of 16-nanometer production. The company expected to have a manufacturing impact above 1 percent in the region with a slight reduction in wafer shipments for the quarter.

“Although the February 6 earthquake caused some delay in wafer shipments in the first quarter, we saw business upside resulting from demand increases in mid- and low-end smartphone segments and customer inventory restocking,” said Lora Ho, Senior Vice President and Chief Financial Officer of TSMC.

“We expect our business in the second quarter will benefit from continued inventory restocking and recovery of the delayed shipments from the earthquake.”

In fiscal year 2016, the company will spend between $9 and $10 billion on ramping up the 16-nanometer process node, constructing Fab 15 for 12-inch wafers in Nanjing, China, and beginning commercial production of the 10-nanometer FinFET process at this new facility. Samsung and Intel are also expected to start mass production of 10-nanometer products by the end of 2016.

During its Q4 2015 earnings call, company president and co-CEO Mark Liu stated the company is currently preparing and working on a 7-nanometer process node and plans to begin volume production sometime in 2018. Meanwhile, since January 2015, a separate research and development team at TSMC has been laying the groundwork for a 5-nanometer process which the company expects to bring into commercial production sometime in 1H 2020.

So far in Q1 2016, shipments of 16 and 20-nanometer wafers have accounted for around 23 percent of the company’s total wafer revenues.

Courtesy-Fud

According to beancounters at IBS, the news comes on the heels of an announcement that the three-month average of the global market for semiconductors ending in February fell 6.2 percent compared with the same figure in 2015, down from a 5.8 percent decline in January.

IBS chief executive Handel Jones said:

“Based on talking to customers about buying patterns, we see softness,” said. “Smartphone sales are slowing, and the composition of the market is changing with about half all chips bought by companies in China who want low-end devices In addition, over the past year memory prices have fallen by nearly half both for DRAMs and NAND-based solid-state drives as vendors try to buy market share, said Jones. “It’s more of a price issue because volumes are up.”

Jones expects softness in the PC market will continue through this year. Demand for chips is rising in automotive and for the emerging Internet of Things, but so far both sectors are relatively small, he added.

Data shows that the gap between the market share of these Intel and Samsung firms is narrowing. In 2012, the gap between Intel and Samsung was 5.3 percent. This narrowed to 4.2 percent in 2013, and is now 3.2 percent in 2015. SK Hynix, which now stands as the third largest semiconductor brand in the world, beat Qualcomm with a market share of 4.8 percent.

Courtesy-Fud