Samsung’s new HBM solution will be used in high-performance computing (HPC), advanced graphics, network systems and enterprise servers, and is said to offer DRAM performance that is “seven times faster than the current DRAM performance limit”.

This will apparently allow faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.

“By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies,” said Samsung Electronics’ SVP of memory marketing, Sewon Chun.

“Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market.”

The 4GB HBM2 DRAM, which uses Samsung’s 20nm process technology and advanced HBM chip design, is specifically aimed at next-generation HPC systems and graphics cards.

“The 4GB HBM2 package is created by stacking a buffer die at the bottom and four 8Gb core dies on top. These are then vertically interconnected by TSV holes and microbumps,” explained Samsung.

“A single 8Gb HBM2 die contains over 5,000 TSV holes, which is more than 36 times that of an 8Gb TSV DDR4 die, offering a dramatic improvement in data transmission performance compared to typical wire-bonding based packages.”

Samsung’s new DRAM package features 256GBps of bandwidth, which is double that of an HBM1 DRAM package. This is equivalent to a more than seven-fold increase over the 36GBps bandwidth of a 4Gb GDDR5 DRAM chip, which has the fastest data speed per pin (9Gbps) among currently manufactured DRAM chips.

The firm’s 4GB HBM2 also enables enhanced power efficiency by doubling the bandwidth per watt over a 4Gb GDDR5-based solution, and embeds error-correcting code functionality to offer high reliability.

Samsung plans to produce an 8GB HBM2 DRAM package this year, and by integrating this into graphics cards the firm believes designers will be able to save more than 95 percent of space compared with using GDDR5 DRAM. This, Samsung said, will “offer more optimal solutions for compact devices that require high-level graphics computing capabilities”.

Samsung will increase production volume of its HBM2 DRAM over the course of the year to meet anticipated growth in market demand for network systems and servers. The firm will also expand its line-up of HBM2 DRAM solutions in a bid to “stay ahead in the high-performance computing market”.

Courtesy-TheInq

What makes it interesting is that it has a built-in keypad that allows it to be PIN protected when inserted into any device and can be set to ‘self-destruct’ after 10 incorrect log-in attempts. Better still, it comes with an aluminium cover to prevent the self-destruct accidentally being triggered in your bag.

Compatible with USB up to 3.1, it offers speeds of up to 135MBps read and 40MBps write. It is also designed to be OS independent, and includes up to 256-bit AES protection without any drivers on the host device.

“We are excited to add DataTraveler 2000 to our existing line-up of fast and encrypted USB flash drives for organisations and SMBs,” said Valentina Vitolo, flash business manager at Kingston. “It is the perfect option to deploy in the workforce where a uniform encrypted data storage solution that works on many different operating systems is in use.”

The device will be available later in the quarter. Prices are to be announced, but capacities will range from 16GB to 64GB.

Next up is the KC400, the latest addition to the SSDNow range powered by an eight-channel Phison controller and quad-core internal processor. It will be available is capacities from 128GB to 1TB with speeds of 550/540MBps read/write on the 256GB drive.

The MobileLite range of WiFi-enabled SD card readers has been expanded with the addition of the Wireless G3 and Wireless Pro. The G3 offers a 5600mAh onboard battery to charge mobile devices via the mobile app, and makes it even easier to transfer to and from mobile devices.

Both offer wireless 802.11ac connectivity, while the Pro edition adds an extra little something in the form of a 64GB flash storage option. Both have USB 3.0 and SD card slots, with an adapter for microSD. There’s also an Ethernet port so you can use it as a hotel room hotspot.

Last up, following on from the success of the HyperX CloudII headset, Kingston has released a special edition for Xbox One users which has garnered the moniker of ‘official’. It adds an inline volume control and comes in a hard-shell case.

This year’s offerings are less focused on the traditional Kingston flash product lines, and once again don’t increase capacities.

Courtesy-TheInq

Based on the firm’s fourth generation Graphics Core Next (GCN) architecture and built using a 14nm FinFET fabrication process, the upcoming architecture is a big jump from the current 28nm process.

AMD said that it expects shipments of Polaris GPUs to begin in mid-2016, offering improvements such as HDR monitor support and better performance-per-watt.

The much smaller 14nm FinFET process means that Polaris will deliver “a remarkable generational jump in power efficiency”, according to AMD, offering fluid frame rates in graphics, gaming, virtual reality and multimedia applications running on small form-factor thin and light computer designs.

“Our new Polaris architecture showcases significant advances in performance, power efficiency and features,” said AMD president and CEO Lisa Su. “2016 will be a very exciting year for Radeon fans driven by our Polaris architecture, Radeon Software Crimson Edition and a host of other innovations in the pipeline from our Radeon Technologies Group.”

The Polaris architecture features AMD’s fourth-generation GCN architecture, a next-generation display engine with support for HDMI 2.0a and DisplayPort 1.3, and next-generation multimedia features including 4K h.265 encoding and decoding.

GCN enables gamers to experience high-performance video games with Mantle, a tool for alleviating CPU bottlenecks such as API overhead and inefficient multi-threading. Mantle, which is basically AMD’s answer to Microsoft’s Direct X, enables improvements in graphics processing performance. In the past, AMD has claimed that Kaveri teamed with Mantle to enable it to offer built-in Radeon dual graphics to provide performance boosts ranging from 49 percent to 108 percent.

The new GPUs are being sampled to OEMs at the moment and we can expect them to appear in products by mid-2016, AMD said. Once they are in the market, we can expect to see much thinner form factors in devices thanks to the much smaller 14nm chip process.

Courtesy-TheInq

The smartphone is being made available as a reference device for anyone interested in discovering new uses for 3D cameras in handsets. The 3D camera is a smaller and more advanced version of the RealSense cameras in PCs and tablets.

For $399, users will get an Android smartphone with a 6-inch screen that can display images at a 2560 x 1440-pixel resolution. The RealSense ZR300 depth camera, which is placed at the edge of the phone, can capture 10 million points per second. The phone also has a 2-megapixel front camera and 8-megapixel rear camera.

The phone isn’t for daily use, but more for capturing 3D images, taking cool selfies and experimenting with the RealSense camera. It has only 3G connectivity, so aside from the camera features it isn’t very useful beyond making basic phone calls. It has an Intel Atom x7-Z8700 processor, which is in Microsoft’s Surface 3, so don’t expect long battery life. It has 64GB of storage, Bluetooth, Wi-Fi and an HDMI port.

Users can reserve the smartphone; Intel did not provide a shipping date. It will only ship to U.S. customers.

Source- http://www.thegurureview.net/mobile-category/intels-3d-smartphone-to-go-on-sale-for-399.html

IBM has announced a major expansion in Europe with the establishment of a new HQ for Watson Internet of Things (IoT).

The Munich site establishes a global headquarters for the Watson IoT program which is dedicated to launching “offerings, capabilities and ecosystem partners” designed to bring the cognitive powers of the company’s game show winning supercomputer to billions of tiny devices and sensors.

Some 1,000 IBM developers, consultants, researchers and designers will join the Munich facility, which the company describes as an “innovation super center”. It is the biggest IBM investment in Europe for over 20 years.

IBM Cloud will power a series of APIs that will allow IoT developers to harness Watson within their devices.

“The IoT will soon be the largest single source of data on the planet, yet almost 90 percent of that data is never acted on,” said Harriet Green, general manager for Watson IoT and Education.

“With its unique abilities to sense, reason and learn, Watson opens the door for enterprises, governments and individuals to finally harness this real-time data, compare it with historical data sets and deep reservoirs of accumulated knowledge, and then find unexpected correlations that generate new insights to benefit business and society alike.”

The APIs were first revealed in September and new ones for the IoT were announced today.

These include the Natural Language Processing API, which contextualizes language from context and is able to respond in the same simple way; Machine Learning Watson API, which can establish patterns in order to perform a repeated task better each time or change the method to suit; Video and Image Analytics API, which can infer information from video feeds; and Text Analytics Watson API, which can glean information from unstructured text data such as Twitter feeds.

The company will also open eight regional centres across four continents to give customers in those territories the opportunity to access information and experiences.

Courtesy-TheInq

The lab was used by Qualcomm to develop Interferometric Modulator Display and Apple Insider claims it is now being used to develop thinner, lighter, brighter and more energy-efficient screens.

The lab employs at least 50 engineers and has recruited talent from display maker AU Optronics and Qualcomm. Outside the lab there is no signage or much to indicate that the Fruity Cargo Cult has assumed control.

Government records show that the building is registered to Apple Taiwan, and a staff in the building were observed wearing Apple ID badges.

Bloomberg thinks Apple wants to “reduce reliance on the technology developed by suppliers such as Samsung, LG, Sharp and Japan and instead “develop the production processes in-house and outsource to smaller manufacturers such as Taiwan’s AU Optronics or Innolux.

Apple currently uses LCD screens in its Macs and iOS devices and an OLED display for Apple Watch and the new lab was where Qualcomm tried to develop to develop its own Mirasol displays.

Mirasol use a different technology to backlit LCDs or OLED. It uses an array of microscopic mirror-like elements that can reflect light of a specific colour. It does not need a backlight and only uses energy when being switched on or off, like E-Ink.

The downside to IMOD has historically been that it reproduces flat, unsaturated colours, a problem that may be possible to fix. Qualcomm introduced a Toq smartwatch with an IMOD screen, but the device flopped.

Qualcomm took a $142 million charge on its Mirasol display business and a year ago there were rumours Qualcomm was selling off its Longtan Mirasol panel plant to TSMC.

What appears to have happened is that Jobs Mob might have bought more than just the facility, and instead has some interest in using Mirasol IMOD technology which could offer an advanced technological breakthrough in enabling a new class of low-power displays for use in phones, tablets or wearables.

Courtesy-Fud

According to Ars Technica Under the handle “GPUOpen” AMD is releasing a slew of open-source software and tools to give developers of games, heterogeneous applications, and HPC applications deeper access to the GPU and GPU resources.

In a statement AMD said that as a continuation of the strategy it started with Mantle, it is giving even more control of the GPU to developers.

“ As console developers have benefited from low-level access to the GPU, AMD wants to continue to bring this level of access to the PC space.”

The AMD GPUOpen initiative is meant to give developers the ability to use assets they’ve already made for console development. They will have direct access to GPU hardware, as well as access to a large collection of open source effects, tools, libraries and SDKs, which are being made available on GitHub under an MIT open-source license.

AMD wants GPUOpen will enable console-style development for PC games through this open source software initiative. It also includes an end-to-end open source compute infrastructure for cluster-based computing and a new Linux software and driver strategy

All this ties in with AMD’s Boltzmann Initiative and an HSA (Heterogeneous System Architecture) software suite that includes an HCC compiler for C++ development. This was supposed to open the field of programmers who can use HSA. A new HCC C++ compiler was set up to enable developers to more easily use discrete GPU hardware in heterogeneous systems.

It also allows developers to convert CUDA code to portable C++. According to AMD, internal testing shows that in many cases 90 percent or more of CUDA code can be automatically converted into C++ with the final 10 percent converted manually in the widely popular C++ language. An early access program for the “Boltzmann Initiative” tools is planned for Q1 2016.

AMD GPUOpen includes a new Linux driver model and runtime targeted at HPC Cluster-Class Computing. The headless Linux driver is supposed to handle high-performance computing needs with low latency compute dispatch and PCI Express data transfers, peer-to-peer GPU support, Remote Direct Memory Access (RDMA) from InfiniBand that interconnects directly to GPU memory and Large Single Memory Allocation support.

Apparently the fruity cargo cult Apple has already signed up to adopt the technology, which means that the rest of the world’s press will probably notice.

According to the Commercial Times TSMC will have 85,000-100,000 wafers fabricated with the foundry’s in-house developed InFo packaging technology in the second quarter of 2016.

TSMC has disclosed its InFO packaging technology will be ready for mass production in 2016. Company president and co-CEO CC Wei remarked at an October 15 investors meeting that TSMC has completed construction of a new facility in Longtan, northern Taiwan.

TSMC’s InFo technology will be ready for volume production in the second quarter of 2016, according to Wei.

TSMC president and co-CEO Mark Liu disclosed the company is working on the second generation of its InFO technology for several projects on 10nm and 7nm process nodes.

Source-http://www.thegurureview.net/computing-category/tsmc-goes-fan-out-wafers.html

Most of the entry level, mainstream and even performance graphics cards from both Nvidia and AMD will rely on the GDDR5. This memory has been with us since 2007 but it has dramatically increased in speed. The memory chip has shrunken from 60nm in 2007 to 20nm in 2015 making higher clocks and lower voltage possible.

Some of the big boys, including Samsung and Micron, have started producing 8 Gb GDDR5 chips that will enable cards with 1GB memory per chip. The GTX 980 TI has 12 chips with 4 Gb support (512MB per chip) while Radeon Fury X comes with four HMB 1.0 chips supporting 1GB per chip at much higher bandwidth. Geforce Titan X has 24 chips with 512MB each, making the total amount of memory to 12GB.

The next generation cards will  get 12GB memory with 12 GDDR5 memory chips or 24GB with 24 chips. Most of the mainstream and performance cards will come with much less memory.

Only a few high end cards such as Greenland high end FinFET solution from AMD and a Geforce version of Pascal will come with the more expensive and much faster HMB 2.0 memory.

GDDR6 is arriving in 2016 at least at Micron and the company promises a much higher bandwidth compared to the GDDR5. So there will be a few choices.

Source-http://www.thegurureview.net/computing-category/will-gddr5-rule-in-2016.html

While large tablets like the Microsoft Surface Pro 4 and its expensive Apple knock-off the Apple iPad Pro, IDC thinks that tablet shipments will continue to decline this quarter.

But IDC also predicts a change in trends, with the market transitioning from standalone tablets over to detachable hybrids.

Users are demanding that tablets actually do something and the boundaries between laptops and tablets with keyboards are starting to blur.  Once just keyboardless netbooks, tablets are becoming netbooks with touchscreens.

IDC predicts that hybrids will be the tablets of the future and that this segment will grow by as much as 75 per cent in 2016 compared to this year.

These devices will be used more and more for productivity purposes more than just consumption. This productivity trend also has an impact on which tablets sizes and platforms will dominate the market.

Tablets are useless for this and these will start to die out. Sizes between 9 and 13 inches are almost perfect, while 13 to 16 inches, though unwieldy, will also more than double its share, IDC said.

IDC predicts Windows will snatch a bigger market share by 2019, almost 20 per cent. These growths will come at the expense of Android, however, who will continue to see a decline in its market share in the next few years.

Source- http://www.thegurureview.net/computing-category/will-declining-tablet-sales-hurt-android.html