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AMD Goes 16 Core Snowy Owl
Naples is a 32 Zen core Opteron with 64 threads. The 16 core Zen version with a BGA socket is codenamed Snowy Owl. AMD thinks that Snowy Owl will be a great match for the communication and network markets that needs a high performance 64-bit X86 CPU.
Snowy Owl has 16 cores and 32 threads, all based on 14nm FinFET Zen transistors. The processor supports up to 32MB of shared L3 cache. We also mentioned a processor cluster codenamed Zeppelin. This seems to be the key to the Zen architecture as more Zeppelin clusters are creating more core Opterons.
Each Zeppelin has eight Zen cores and each Zen core has 512KB dedicated L2 cache memory. Four Zen cores share 8MB of L3 memory making the total L3 cache size 16MB. Zeppelin (ZP) comes with PCIe Gen 3, SATA 3, 10GbE, sever controller Hub, AMD secure processor as well as the DDR4 Memory controller. AMD is using a super-fast coherent interconnect to create more than one Zeppelin core.
One Zeppelin cluster would make an 8 core, 16 thread CPU with 4MB L2 and 16MB L3 cache and in our case product codenamed Snowy owl has 16 cores, 32 threads 8MB of L2 (512KB x 16) and 32MB L3 (4x8MB).
The Snowy Owl with 16 cores uses a SP4 Multi Chip Module (MCM) BGA socket, while the Naples uses MCM based SP3. These two are not pin compatible but 16 and 8 core Zen based Opterons will fit in the same socket.
Snowy Owl has four independent memory channels and up to 64 lanes of PCIe Gen3. When it comes to storage, it supports up to 16 SATA or NVME storage channels and 8x10GbE for some super-fast networking solutions.
As you see, there will be plenty of Zen based Opteron possibilities and most of them will start showing up by mid-2017. The TDP Range for Snowy Owl is sub 100W and capable of sinking the TDP down to 35W. Yes, we do mean that there may well be a quad core Zen Opteron too.
Courtesy-Fud
AMD Goes After Intel’s Skylake With Bristol Ridge
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AMD has revealed the firm’s seventh-generation system-on-a-chip accelerated processing units (APUs).
Bristol Ridge and Stoney Ridge sound a little like locations in a Somerset version of Game of Thrones, but they both feature AMD’s Excavator x86 processor cores and Radeon R7 graphics, which AMD sees powering e-sports gaming on laptops.
Bristol Ridge is the more powerful of the two coming in 35W and 15W versions of AMD FX, A12 and A10 processors, offering up to 3.7GHz of processing power. The former two processors are paired with up to eight Graphics Core Next (GCN) cores in the R7 to provide a decent pool of graphics processing power.
Stoney Bridge offers less in the way of processor power, topping out at 3.5GHz, and versions include 15W A9, A6 and E2 processor configurations coupled with lower powered graphics accelerators.
AMD claimed that the new APUs offer a 50 per cent hike in performance over the previous generation Carrizo APUs. However, this rise is over APUs from the early part of Carrizo’s lifecycle, so performance gains over the most recent Carrizo APUs are likely to be 10 to 20 per cent.
AMD also said that its silicon is faster than rival chips from Intel, including the i3-6100U found in several ultraportable laptops.
Many of these tests are subjective and depend on how a hardware manufacture configures and sets up the APUs in a laptop or tablet, but AMD does have its graphics tech to draw on, such as the GCN architecture, which could give it the edge over Intel’s chips when it comes to pushing pixels.
The APUs will be aimed primarily at slim laptops that need low-power consumption chips, much like Intel’s Skylake line.
Bristol Ridge is currently available to end users only in the form of HP’s latest Envy laptop. But now that AMD has debuted the full range of the seventh-generation APUs we can expect to see them in other ultraportable machines before too long.
Courtesy-TheInq
Is nVidia Taking Qualcomm To Court?
Nvidia has dragged Qualcomm into court for allegedly crushing a $352 million chipset deal.
Nvidia claims it was forced to wind down its cellular mobile broadband chipset business, including its Icera unit just four years after buying it, because of Qualcomm’s anti-trust antics.
Qualcomm’s alleged tactics led to “unexplained delays in customer orders, reductions in demand volumes and contracts never being entered into, even after a customer or mobile network cooperating with a prospective customer has agreed or expressed a strong intention to purchase” Nvidia’s chipsets, the company moaned.
The claim for cash comes as European Union regulators step up antitrust investigations into Qualcomm sales tactics that officials said thwarted other designers of mobile-phone chip technology. This could result in fines or an EU order forcing a company to change its behaviour.
The EU thinks Qualcomm may have charged below-cost fees for chips used in mobile Internet modems known as dongles from 2009 to 2011 to thwart smaller competitor Icera. Regulators are separately probing what they say are exclusivity payments Qualcomm paid to a phone and tablet manufacturer for using its designs.
Qualcomm is “confident” it would prevail in both the EU investigation and the lawsuit.
Nvidia is seeking a declaration from the judge that Qualcomm’s conduct was an abuse of a dominant position, compensation, and an account of the profits it says Qualcomm gained from unlawful conduct, according to the court filings.
Courtesy-Fud
AMD’s Vegas GPU Details Spotted
Details of AMD’s Vega GPU were leaked and then taken down from AMD R&D Manager’s LinkedIn profile page over Easter.
Hexus spotted Yu Zheng, an R&D Manager at AMD Shanghai had listed the work on Project Greenland as a work experience highlight on his LinkedIn profile page. Greenland is described as “A leading chip of the first graphics IP v9.0 generation, it has full capacity of 4096 shader processor along with whole new SOC v15 architecture.”
The Graphics IP v9.0 designation is thought to signify a Vega GPU in the making. Zheng mentions this is an SOC, but then Hawaii and Fiji chips were described the same. Fiji is part of the graphics IP v8.0 family, as will be Polaris.
Vega following after Polaris, and designated as a ‘HMB2′ GPU by AMD, it looks like Vega based graphics cards will be the successors to the HBM equipped Fiji range such as the Radeon Fury and Nano. Fiju can manage 4096 stream processors, but with an upgrade to HBM2, 14nm process and other optimisation it is estimated that a Greenland/Vega GPU based graphics cards will offer 20 to 30 per cent better performance.
So with Greenland/Vega sporting HBM2 memory Hexus thinks that Polaris packing graphics cards will therefore feature GDDR5/X memory.
Courtesy-Fud
Russia Banking On Home Grown CPUs
A Russian firm announced its intention to build its own homegrown CPUs as part of a cunning plan to keep the Americans from spying on the glorious Empire of Tsar Putin and oil oligarchs.
Moscow Centre of SPARC Technologies (MCST) has announced it’s now taking orders for its Russian-made microprocessors from domestic computer and server manufacturers.
Dubbed the Elbrus-4C, it was fully designed and developed in MCST’s Moscow labs. It’s claimed to be the most high-tech processor ever built in Russia. They claim it is comparable with Intel’s Core i3 and Intel Core i5 processors, although they do not say what generation as one spec we found claimed it could manage a blistering 1.3 GHz which is slightly less than an average mobile phone.
MCST unveiled a new PC, the Elbrus ARM-401 which is powered by the Elbrus-4C chip and runs its own Linux-based Elbrus operating system. MCST claimed it can run Windows and Linux distributions. Yhe company has built a data centre server rack, the Elbrus-4.4, which is powered by four Elbrus-4C microprocessors and supports up to 384GB of RAM.
MCST said the Elbrus-4.4 is suitable for web servers, database servers, storage systems, servers, remote desktops and high-performance clusters.
Sergei Viljanen, editor in chief of the Russian-language PCWorld website said that the chip was at least five years behind the west.
“Russian processor technology is still about five years behind the west. Intel’s chips come with a 14nm design, whereas the Elbrus is 65 nm, which means they have a much higher energy consumption.”
MCST’s Elbrus-4C chips are powered by a 4-core processors, and come with an interface for hard drives and other peripherals. The company finalized development of Elbrus-4C in April 2014, and began mass production last autumn.
Dell Goes Plastic
Dell is manufacturing a line of PCs using plastics obtained by expanding its recycling program.
The company has expanded the hardware take-back program to more places worldwide, aiming to collect and reuse more extracted plastic and metals in PCs, monitors, hardware panels and other products.
Dell’s OptiPlex 3030 all-in-one, which will ship next month, will be the first product of that effort. Starting next year, more laptops, desktops and monitor back-panels will be made using recycled plastic, said Scott O’Connell, director of environmental affairs at Dell. The products will be certified as sustainable by UL (Underwriters Laboratories).
Dell will save money by reusing plastic, but O’Connell did not say whether the savings will be passed on to customers through lower prices. But it will be easier for more people to recycle electronics and Dell will also provide a PC mail-back option, O’Connell said.
Dell’s plan to establish a recycling chain internally could reduce the need for “virgin” plastics, which can be environmentally damaging to make, said Gary Cook, senior IT analyst at Greenpeace International.
Incineration of plastic from disposed computers can be toxic and reusing plastics in new computers or other parts reduces “dirty energy,” Cook said.
“We need to see plastics last longer,” Cook said.
Companies like Apple have helped raise expectations of sustainability in computers and others are following suit, Cook said. PC makers are using more metals in computer chassis and handset makers are using more nonpetroleum plastics.
Dell was criticized last year by Greenpeace for veering away from its carbon-neutral goals and sustainability advocacy. The company ranked 14th among most green IT companies, behind Microsoft, IBM, Hewlett-Packard, Wipro, Fujitsu and Google, among others.
Dell curbed its sustainability strategy when it was trying to go private last year, but has now reinvigorated that effort.
“They are trying to show some initiative,” Cook said.
AMD Gives Opteron A Boost
AMD has shown there is a little life left in its Bulldozer Opterons by bumping up the clock speed of five Opteron models.
AMD launched its Bulldozer Opteron processors last November amid widespread anticipation that its brand new Bulldozer architecture would once again make it competitive with Intel. Its new architecture failed to impress, but the company has managed to eek out another 100MHz from five Opteron processors in what is likely to be a last hurrah before Piledriver Opterons make their appearance.
AMD bumped up the clocks by 100MHz on the 16-core Opteron 6284 SE and Opteron 6278 to 2.7GHz and 2.4GHz, respectively, while keeping TDPs the same as before, at 140W and 115W, respectively. The firm gave four Opteron 4200 series chips the same 100MHz bump, including the eight-core Opteron 4276HE to 2.6GHz, the six-core Opteron 4240 to 3.4GHz and the Opteron 4230 to 2.9GHz.
AMD was keen to point out that its speed bumped Opteron chips have been picked by Dell and by HP for 11 of its servers. Although the firm has not been able to compete with Intel’s Xeon chips on perfermance, its chips are considerably cheaper, a fact that AMD is using to win customers.
Although AMD’s 100MHz speed bump isn’t going to set the world on fire, every little bit of performance will help the firm as Intel ploughs on with its hugely impressive Sandy Bridge E and Ivy Bridge Xeon chips. AMD’s answer to Intel’s latest Xeon chips is expected to be the Piledriver Opterons.
AMD Aims For The Cloud
Advanced Micro Devices on Tuesday is expected to announce new Opteron 3200 series chips for low-end servers, which the company believes will give it a competitive edge over Intel in the cloud server arena.
The three Opteron 3200 chips are for use in single-socket servers for Web hosting and cloud applications, according to a company presentation. The chips have up to eight processor cores, clock speeds of up to 3GHz, and draw between 45 watts and 65 watts of power.
The new chips are based on the Bulldozer processor architecture, which is also in the Opteron 6200 16-core processors and FX-series gaming chips. The Opteron 3200 launch comes after AMD in late February announced it would pay US$334 million to acquire SeaMicro, which offers dense and power-efficient servers for cloud computing environments.
AMD’s chips will likely compete against Intel’s Xeon E3 series chips, which are used in SeaMicro’s SM10000-XE server. Intel worked with SeaMicro on the server, but analysts have said that AMD will ultimately swap Intel’s chips with its own chips.
AMD is pitching the Opteron 3200 as a “low-cost-per-core” product. The chips are priced between US$99 and $129, while Intel’s E3 chips are priced between $189 and $885. MSI, Tyan, Fujitsu and Dell are expected to launch Web servers and dense systems based on the chips.
AMD’s expanded product line provides an entry point to new markets, said Jim McGregor, chief technology strategist at In-Stat.
But the Opteron 3200 could be a misfit in servers if competing on price versus performance-per-watt, McGregor said. There is a growing interest in deploying low-power servers in data centers to cut energy costs, but the Opteron 3200 chips are comparatively power-hungry for such installations.
HP Makes Changes At The Top
HP has appointed former Boeing Company executive John Hinshaw as CIO.
In the newly created role of EVP of Global Technology and Business Processes, Hinshaw will oversee IT and shared and administrative services, including indirect and services procurement. Hinshaw also will be in charge of optimising business processes across the company.
Hinshaw was previously VP and general manager of Boeing Information Solutions at The Boeing Company, where he was responsible for running a new business.
Prior to Boeing, Hinshaw was SVP and CIO at Verizon Wireless. Earlier in his career he also served as a consultant with Accenture.
Hinshaw will join HP as a member of its executive council on 15 November, reporting to HP president and CEO Meg Whitman.
Meanwhile, HP also announced that Craig Flower has been promoted to SVP and CIO. Flower will be responsible for data management, application architecture, global business intelligence, sales, and product development and engineering applications. Flower has held a wide range of IT management positions within HP since 1984.