Company co-CEO Mark Liu said that while the fourth quarter could be a bit rough as customers start their inventory adjustments, TSMC’s sales for the quarter will still outperform those for the third quarter.

Talking to Digitimes Lui said that smartphone demand was affected negatively by macroeconomic factors in the first half of 2016. But apparently smartphone chip clients are ordering again in the second half of the year.

TSMC previously estimated its 2016 revenues would grow 5-10 per cent. The foundry expects to meet the high end of the growth guidance, Liu said. In his speech at the CEO Forum of SEMICON Taiwan 2016. Liu claimed that the foundry industry growth is being driven by the markets for smartphones, HPC, automotive and IoT.

Apps like Pokemon G will require more silicon chips used in mobile devices that will be another growth driver in the future, Liu said.

Courtesy-Fud

Basically this means that the hardware can be used by the OPNFV collaborative open source community to accelerate the delivery of cloud-enabled networks and applications.

Nokia said the OPNFV Lab will be a testbed for NFV developers and accelerates the introduction of commercial open source NFV products and services. Developers can test carrier-grade NFV applications for performance and availability.

Nokia is making its AirFrame Data Center Solution available as a public OPNFV Lab with the support of Intel, which is providing Intel Xeon processors and solid state drives to give communications service providers the advantage of testing OPNFV projects on the latest and greatest server and storage technologies.

The Nokia AirFrame Data Center Solution is 5G-ready and Nokia said it was the first to combine the benefits of cloud computing technologies to meet the stringent requirements of the telco world. It’s capable of delivering ultra-low latency and supporting the kinds of massive data processing requirements that will be required in 5G.

Morgan Richomme, NFV network architect for Innovative Services at Orange Labs, OPNFV Functest PTL, in a release. “NFV interoperability testing is challenging, so the more labs we have, the better it will be collectively for the industry.”

AT&T has officially added Nokia to its list of 5G lab partners working to define 5G features and capabilities. It’s also working with Intel and Ericsson.

Courtesy-Fud

Digitimes’ deep throats claimed TSMC is expected to achieve certification on its 10nm process in the fourth quarter of 2016, and deliver product samples to the customer for validation in the first quarter of 2017.

This means that TSMC could begin small-volume production for Apple’s A11 chips as early as the second quarter of 2017 and building the chips will likely start to generate revenues at TSMC in the third quarter. The A11-series processor will power the iPhone models slated for launch in the second half of 2017.

TSMC is expected to get two-thirds of the overall A11 chip orders from Apple.

The company is officially refusing to comment on Digitimes’ story, but it does fit into what we have already been told about Jobs’ Mob’s plans for next year.

Google announced this week that it released an Android update to patch shedloads of vulnerabilities, but the advisory mentioned an information disclosure vulnerability in the Qualcomm tethering controller (CVE-2016-2060) that allows a malicious application to access user information.

FireEye said that this vulnerablity is “high severity,” but Google noted that it does not affect Nexus devices. The patch for the issue is not in the Android Open Source Project (AOSP) repository but might make it in the  latest driver updates for affected devices.

The security outfit said that researchers informed Qualcomm about the vulnerability in January and the vendor developed a fix by early March, when it started reaching out to OEMs to let them know about the issue. Now it’s up to the device manufacturers to push out the patch to customers. So probably a long time then.

The flaw exists in an open source software package maintained by Qualcomm and is related to the Android network daemon (netd).

“The vulnerability was introduced when Qualcomm provided new APIs as part of the ‘network_manager’ system service, and subsequently the ‘netd’ daemon, that allow additional tethering capabilities, possibly among other things,” FireEye said.

The flaw has been confirmed to affect devices running Android 5.0 Lollipop and earlier, which currently account for roughly three-quarters of Android devices. Researchers noted that the affected Qualcomm software package is used in a variety of projects, including the popular CyanogenMod, and the vulnerable APIs appear to have been around since at least 2011.

The vulnerability can be exploited to escalate privileges to the built-in “radio” user, which has permissions that are normally not available to a third-party app. The most efficient way to exploit CVE-2016-2060 is via a malicious application that is granted the “ACCESS_NETWORK_STATE” permission.

Courtesy-Fud

For TSMC, Q1 2016 was marked by a reduction of demand for high-end smartphones, while smartphone demand in China and emerging markets had upward momentum. Beginning Q2 2016 and onward, the company expect to get back onto a growth trajectory and is projected to hit a 5 to 10 percent growth rate in 2016.

“Our 10-nanometer technology development is on track,” said company president and co-CEO Mark Liu during the company’s Q4 2015 earnings call. “We are currently in intensive yield learning mode in our technology development. Our 256-megabit SRAM is yielding well. We expect to complete process and product qualification and begin customer product tape-outs this quarter.”

“Our 7-nanometer technology development progress is on schedule as well. TSMC’s 7 nanometer technology development leverage our 10-nanometer development very effectively. At the same time, TSMC’s 7-nanometer offers a substantial density improvement, performance improvement and power reduction from 10-nanometer.

These two technologies, 10-nanometer and 7-nanometer, will cover a very wide range of applications, including application processors for smartphone, high-end networking, advanced graphics, field-programmable gate arrays, game consoles, wearables and other consumer products.”

In Q1 2016, TSMC reached a gross margin of 44.9 percent, an operating margin of 34.6 percent and a net profit margin of 31.8 percent respectively. Going forward into Q2 2016, the company is expecting revenue between ~$6.65 billion and ~$6.74 billion USD, gross margins between 49 and 51 percent, and operating profit margins between 38.5 and 40.5 percent, respectively.

Chips used for communications and industrial uses represented over 80 percent of TSMC’s revenue in FY 2015. The company was also able to improve its margins by increasing 16-nanometer production, and like many other semiconductor companies, is preparing for an expected upswing sometime in 2017.

In February, a 6.4-magnitude earthquake struck southern Taiwan where TSMC’s 12-inch Fab 14 is located, a current site of 16-nanometer production. The company expected to have a manufacturing impact above 1 percent in the region with a slight reduction in wafer shipments for the quarter.

“Although the February 6 earthquake caused some delay in wafer shipments in the first quarter, we saw business upside resulting from demand increases in mid- and low-end smartphone segments and customer inventory restocking,” said Lora Ho, Senior Vice President and Chief Financial Officer of TSMC.

“We expect our business in the second quarter will benefit from continued inventory restocking and recovery of the delayed shipments from the earthquake.”

In fiscal year 2016, the company will spend between $9 and $10 billion on ramping up the 16-nanometer process node, constructing Fab 15 for 12-inch wafers in Nanjing, China, and beginning commercial production of the 10-nanometer FinFET process at this new facility. Samsung and Intel are also expected to start mass production of 10-nanometer products by the end of 2016.

During its Q4 2015 earnings call, company president and co-CEO Mark Liu stated the company is currently preparing and working on a 7-nanometer process node and plans to begin volume production sometime in 2018. Meanwhile, since January 2015, a separate research and development team at TSMC has been laying the groundwork for a 5-nanometer process which the company expects to bring into commercial production sometime in 1H 2020.

So far in Q1 2016, shipments of 16 and 20-nanometer wafers have accounted for around 23 percent of the company’s total wafer revenues.

Courtesy-Fud

Bernstein Research’s senior analyst Mark C. Newman said that the competitive dynamic in the memory chip industry is not as good as we thought due to Samsung’s aggressive and opportunistic behavior. This is analyst speak for Samsung is engaging in a supply and price war with the other big names in the memory chip marking business – SK hynix and Micron.

“Rather than sit back and enjoy elevated profit margins with a 40 percent market share in DRAMs, Samsung is intent on stretching their share to closer to 50 percent,” he said.

Newman said the company is gaining significant market share in the NAND sector.

“Although Samsung cares about profits, their actions have been opportunistic and more aggressive than we predicted at the expense of laggards particularly Micron Technology in DRAMs and SK hynix in NANDs,” he said.

SK hynix is expected to suffer. “In NAND, we see Samsung continuing to stretch their lead in 3D NAND, which will put continued pressure on the rest of the field. SK hynix is one of the two obvious losers.”

Newman said that Samsung’s antics have destroyed the “level of trust” among competitors, perhaps “permanently,” as demand has dropped drastically with PC sales growth down to high single digits in 2015 with this year shaping up to be the same.

“Sales of smartphones, the main savior to memory demand growth have also weakened considerably to single digit growth this year and servers with datacenters are not strong enough to absorb the excess, particularly in DRAM,” Newman said.

He is worried that Samsung could create an oversupply in the industry.

“The oversupply issue is if anything only getting worse, with higher than normal inventories now an even bigger worry. Although we were right about the shrink slowing, thus reducing supply growth, the flip side of this trend is that capital spending and R&D costs are soaring thus putting a dent in memory cost declines,” he said.

China’s potential entry into the market and new technologies will provide further worries “over the longer term.”

“Today’s oversupply situation would become infinitely worse if and when China’s XMC ramps up big amounts of capacity. New memory technologies such as 3D X-point, ReRAM and MRAM stand on the sidelines and threaten to cannibalize part of the mainstream memory market,” he said.

Courtesy-Fud

Revealed back during the 2015 Flash Memory Summit in August last year, the now available Samsung PM1633a enterprise SSD series is based on a standard 2.5-inch form factor and features a 12Gbps Serial Attached SCSI (SAS) interface. It also uses Samsung new controller as well as Samsung’s own 3rd generation 256Gb 48-layer TLC V-NAND.

As noted, the Samsung PM1633a lineup is based on Samsung’s 256Gb V-NAND flash chips. The 256Gb dies are stacked in 16 layers to form a single 512GB package and by adding up a total of 32 NAND packages, you get the 15.36TB model. According to Samsung, the 3rd generation 256Gb V-NAND will provide both significant performance as well as reliability improvements compared to the PM1633 drive which used 2nd generation 32-layer 128Gb V-NAND flash.

The controller has also been upgraded to concurrently access large amounts of high-density NAND flash and the PM1633a 15.36TB model comes with no less than 16GB of cache.

When it comes to performance, the Samsung PM1633a provides sequential read and write performance of up to 1,200MB/s while random 4K performance is set at up to 200,000 IOPS for read and up to 32,000 IOPS for write. The new Samsung PM1633a enterprise SSD also offers high high reliability date with 1DWPD (drive writes per day), adding up to 15.36TB that can be written every day without failure, which is quite important in the enterprise market.

While the 15.36TB model of the Samsung P1633a is already shipping to select enterprise customers, Samsung is also promising a wide range of capacities, including 480GB, 960GB, 1.92TB, 3.84TB and 7.68TB. According to Samsung, enterprise managers can now fit twice as many drives in a standard 19-inch 2U rack compared to a 3.5-inch storage drive.

Unfortunately, Samsung did not reveal any details regarding the price but we doubt that such high capacity and performance will have a low price tag.

Courtesy-Fud

It is starting to look sales teams for the pair are each trying to show that they can use the technology to reduce the most electricity consumption and production costs.

In its yearly result for 2015, TSMC made an announcement that it is planning to enter mass-production system of chips produced by 16-nano FinFET Compact (FFC) process sometime during 1st quarter of this year. TSMC had finished developing 16-nano FFC process at the end of last year. During the announcement TSMC talked up the fact that its 16-nano FFC process focuses on reducing production cost more than before and implementing low electricity.

TSMC is apparently ready for mass-production of 16-nano FFC process sometime during 1st half of this year and secured Huawei’s affiliate called HiSilicon as its first customer.

HiSilicon’s Kirin 950 that is used for Huawei’s premium Smartphone called Mate 8 is produced by TSMC’s 16-nano FF process. Its A9 Chip, which is used for Apple’s iPhone 6S series, is mass-produced using the 16-nano FinFET Plus (FF+) process that was announced in early 2015. By adding FFC process, TSMC now has three 16-nano processors in action.

Samsung is not far behind it has mass-produced Gen.2 14-nano FinFET using a process called LPP (Low Power Plus). This has 15 per cent lower electricity consumption compared to Gen.1 14-nano process called LPE (Low Power Early).

Samsung Electronics’ 14-nano LPP process was seen in the Exynos 8 OCTA series that is used for Galaxy S7 and Qualcomm’s Snapdragon 820. But Samsung Electronics is also preparing for Gen.3 14-nano FinFET process.

Vice-President Bae Young-chang of Samsung’s LSI Business Department’s Strategy Marketing Team said it will use a process similar to the Gen.2 14-nano process.

Both Samsung and TSMC might have a few problems. It is not clear what the yields of these processes are and this might increase the production costs.

Even if Samsung Electronics and TSMC finish developing 10-nano process at the end of this year and enter mass-production system next year, but they will also have to upgrade their current 14 and 16-nano processes to make them more economic.

Even if 10-nano process is commercialized, there still will be many fabless businesses that will use 14 and 16-nano processes because they are cheaper. While we might see a few flagship phones using the higher priced chips, it might be that we will not see 10nm in the majority of phones for years.

Courtesy-Fud

A big focus of the AT&T discounts is special deals on Samsung’s Galaxy smartphones and Gear S2 smartwatches. Analysts interpreted that focus on Samsung devices as a way to clear out inventory prior to expected upgrade announcements coming in late February at Mobile World Congress in Barcelona.

AT&T is also facing pressure to add more subscribers, as analysts — including Evercore ISI this week– have predicted AT&T’s fourth-quarter postpaid subscriber loss will be more than 300,000. That comes amid reports that T-Mobile added 4.5 million net subscribers for the fourth quarter and Verizon Wireless added 525,000.

All the major carriers, including AT&T, hit the December holidays with special device deals, but AT&T apparently didn’t feel enough impact on its inventory from those offers, analysts said.

AT&T and Samsung are motivated to get rid of all the old inventory before new models arrive, said Patrick Moorhead, an analyst at Moor Insights & Strategy. “Retailers won’t run such an aggressive promotion unless they have a lot of stock.”

An AT&T spokeswoman provided a different explanation: “Due to popular demand, AT&T is bringing back some of its holiday promos.”

Those promos — available to both consumers and business customers at AT&T retail stores — include a free Samsung Gear S2 smartwatch for a limited time to any customer buying a Samsung Galaxy smartphone, or a free Samsung Galaxy Tab 4 for buying a Galaxy smartphone on an AT&T Next wireless plan. AT&T is also offering an iPad mini 2 for $99 when a customer buys a new iPhone on the Next plan.

For business customers, the 2-for-1 smartphone deal is new. It allows business customers to buy a new smartphone and then get another smartphone, valued at up to $650, for free.

Source-http://www.thegurureview.net/mobile-category/att-facing-pressure-offers-aggressive-smartphone-discounts.html