The chip is designed for in-car navigation and infotainment systems running QNX, Linux, and Android.  It has wireless capabilities and can connected to your phone.  The LTE version will link to the Internet.

They can manage multiple displays to run the screen in your dashboard  and an infotainment screen in the back seat. It also offers support for high-resolution 4K displays for when some company inevitably decides to cram a high-res, high-density screen into one of its cars.

The 820A chips are close cousins ofthe the Snapdragon 820 SoCs that will start shipping in phones later this year and use Qualcomm’s custom-made 64-bit Kryo CPU cores, an Adreno 530 GPU, a  Hexagon 680 DSP all cooked up with a 14nm manufacturing process. They will also use the Snapdragon X12 LTE which can manage 600Mbps down and  150Mbps up when the wind is behind it and it is going downhill. There are all the usual 802.11ac Wi-Fi, Bluetooth, and other features.

Qualcomm said that it used a “modular approach” in designing the chip, which  means that the cars infotainment system can be upgraded with hardware and software updates, thereby enabling vehicles to be easily upgraded with the latest technology.

Car makers could theoretically swap out the chip or the entire package without needing to worry about software changes. Qualcomm specifically mentions upgrading LTE connectivity over the lifetime of the car to keep up with the capabilities of cellular networks.

Qualcomm says the 820A family will begin sampling in Q1 of 2016.

Courtesy-Fud

The next generation SoC from Qualcomm, let’s call it Snapdragon 8×0, will use ARM Cortex cores. Our industry sources are confident that company’s leadership has put a great deal of pressure on Qualcomm QTI to reduce the cost of R&D and custom CPU core costs an arm and a leg. Using Cortex Cores is cheaper than developing a custom ARM based CPU such as Kyro.

Creating a custom ARM based CPU core is intensive too and Qualcom still has to build a Modem, GPU, DSP, camera ISP, Video processing unit as well connectivity inside of the SoC to provide the differentiating factor to the competition. It just appears that the Core itself probably does not need looking at.

But the move will hardly help Qualcomm compete in hostile and aggressive mobile SoC manufacturers’ competition.

Apple and Samsung have their own CPU cores. Huawei uses Cortex architecture but has its own SoCs for the 100 million phones it sold this year. These are businesses that are either very hard or impossible for Qualcomm QTI SoCs to get. Every Samsung SoC manufactured and sold in Samsung phones is one less for Qualcomm.

MediaTek might be the winner in this case, as MediaTek makes rather unique processors that are designed to compete well against those who use close-to-reference Cortex ARM solutions. MediaTek is the only deca core in three cluster architecture but we still have to see it in action before we pronounce anyone winner or loser.

Qualcomm will have to focus on its strengths of its late 2016 successor to Snapdragon 810. The strengths of Qualcomm lay in superior modem performance and a great Adreno GPU. However they will lose an advantage of a custom core that might bring a bigger difference from the competition.

This is certainly not something we expected but it is happening.

Source-http://www.thegurureview.net/computing-category/is-qualcomm-dropping-kryo.html

But after years of fantastic growth in smartphone sales, the pace of growth is slowing overall, including for the two smartphone giants. Market research firm IDC recently said that 2016 will be the first year that overall smartphone growth will slow to below 10%.

There is even talk among analysts that the latest models don’t have enough compelling new features to lure customers to a competitor’s device. Others say smartphone buyer’s fatigue has set in.

Buyer’s fatigue is a concern in the U.S. and other developed countries where the smartphone market is viewed as a “replacement” market because the market is already saturated: Nearly everyone already owns a smartphone. A focus on emerging countries by Apple and Samsung still requires them to find low-cost alternatives to compete with the likes of Huawei and others.

“Consumers are fatigued about new phone features that they can’t easily relate to any improvement in their personal use cases,” said Patrick Moorhead, an analyst at Moore Insights & Strategy. “Samsung has been one of the worst offenders of this in the last few years. If consumers can’t relate, then they need to be educated.”

Most recently, reports that Samsung would add a pressure-sensitive displayand high-speed charging port to its Galaxy S7 phone drew a few yawns. That’s because Apple added the pressure-sensitive display to the iPhone 6S last summer, and a new USB Type-C fast charging port is already available in LG and Huawei smartphones.

While it is to Samsung’s advantage to keep up with Apple and others rivals, analysts disagree over whether these latest improvements will provoke an iPhone user to switch to a Galaxy.

Source-http://www.thegurureview.net/mobile-category/smartphone-buyer-fatigue-seen-hampering-growth.html

Apparently the fruity cargo cult Apple has already signed up to adopt the technology, which means that the rest of the world’s press will probably notice.

According to the Commercial Times TSMC will have 85,000-100,000 wafers fabricated with the foundry’s in-house developed InFo packaging technology in the second quarter of 2016.

TSMC has disclosed its InFO packaging technology will be ready for mass production in 2016. Company president and co-CEO CC Wei remarked at an October 15 investors meeting that TSMC has completed construction of a new facility in Longtan, northern Taiwan.

TSMC’s InFo technology will be ready for volume production in the second quarter of 2016, according to Wei.

TSMC president and co-CEO Mark Liu disclosed the company is working on the second generation of its InFO technology for several projects on 10nm and 7nm process nodes.

Source-http://www.thegurureview.net/computing-category/tsmc-goes-fan-out-wafers.html

While large tablets like the Microsoft Surface Pro 4 and its expensive Apple knock-off the Apple iPad Pro, IDC thinks that tablet shipments will continue to decline this quarter.

But IDC also predicts a change in trends, with the market transitioning from standalone tablets over to detachable hybrids.

Users are demanding that tablets actually do something and the boundaries between laptops and tablets with keyboards are starting to blur.  Once just keyboardless netbooks, tablets are becoming netbooks with touchscreens.

IDC predicts that hybrids will be the tablets of the future and that this segment will grow by as much as 75 per cent in 2016 compared to this year.

These devices will be used more and more for productivity purposes more than just consumption. This productivity trend also has an impact on which tablets sizes and platforms will dominate the market.

Tablets are useless for this and these will start to die out. Sizes between 9 and 13 inches are almost perfect, while 13 to 16 inches, though unwieldy, will also more than double its share, IDC said.

IDC predicts Windows will snatch a bigger market share by 2019, almost 20 per cent. These growths will come at the expense of Android, however, who will continue to see a decline in its market share in the next few years.

Source- http://www.thegurureview.net/computing-category/will-declining-tablet-sales-hurt-android.html

A new report from ChosunBiz said that Samsung originally aimed to house around 10,000 personnel on the site. However the majority of the decreases will be applied to Samsung’s Digital Media & Communication (DMC) and Media Solutions Centre (MSC).

The campus will instead house about 3,500 staff who have master and PhD degrees and specialise in software, design and digital media development.

The move is odd as it is coming at a time when Samsung is really desperate for killer innovation to steal the march on the competition. However reading between the lines it looks like it is reducing work in its content creation side.

We are surprised that it is doing anything with its Media Solutions centre. Originally, it was established to operate as a Korean version of the App Store. But the company announced on December 10 last year that it was dissolves the organisation.

At the time it was admitted that the content business has not been as successful as the hardware business. Moreover, the worsening performance of the smartphone business arising from the increasingly saturated market forced the company to speed up the break-up process.

Source-http://www.thegurureview.net/computing-category/samsung-boots-two-thirds-of-its-rd-staff.html

Revenues for the last part of the year will be adversely affected by an about one per cent drop in wafer ASPs and capacity at its plants will slide to 81-83 per cent in the fourth quarter from 89% in the third.

UMC’s had already lowered capacity in the third quarter. At the beginning of the year it was running at 94 percent.

The company’s revenues decreased 7.1 per cent to $1.07 billion in the third quarter, with gross margin slipping below 20 per cent.

UMC net profits were down 62.9 per cent on quarter, as both operating and non-operating income eroded. This is bad news because in the first three quarters of 2015, UMC’s net profits increased 35.8 per cent from a year earlier.

However UMC is continuing to invest in new capital and will spend $1.8 billion.

CEO Po-Wen Yen said that the continuing IC inventory adjustment will dampen fourth quarter wafer shipments, but UMC continues on the path towards long-term growth.

“Throughout 2015, UMC engineers and Fab12A have worked tirelessly to bring several new 28nm product tape-outs into volume production. “UMC is working to bring a timely conversion of new 28nm requirements into production, which will strengthen our business.”
Courtesy-http://www.thegurureview.net/computing-category/will-umc-chip-shipments-drop-in-the-fall.html

Intel plans to invest up to $5.5 billion over the coming years to use its Dalan, China, facility to expand its NAND manufacturing capacity. Initial 3D NAND production is expected to commence in second-half 2016 in Dalan.

Barrons has said that with pricing pressure already present in DRAM, Intel’s move puts Micron in a state of uncertainty.

This is a little odd given that Intel and Micron are chums, but Barron’s Rajvindra Gill said that the move will reduce Chipzilla’s dependence on Micron.

More than half of output is expected to use 3D NAND in the next two to three years and Intel’s focus on the technology reduces its reliance on Micron as a supplier while transforming it into a competitor, Gill said.

Micron be the last one standing when the mergers and acquisitions the industry is seeing and be an industry also ran.

Intel’s focus on the non-volatile memory market could put the pricing and supply/demand environment under pressure.

Micron has already had difficulties setting up 3D NAND versus its peers and now has another significant challenger entering the market, Gill said.

Intel’s move to NAND places a major Micron customer at risk. While Intel noted that its relationship with Micron remains strong and that it will continue to focus on 3D Xpoint, we believe the IM Flash Agreement could be at risk.

With Intel producing more NAND on its own, it could look to lower its reliance on the joint venture.

Intel has a right to sell its portion of the joint venture to Micron. If Intel elects to do so, a closing date would be set within two years. Sales to IM Flash sales to Intel were $101 million in the third quarter, or 8 per cent of trade NAND revenue.
Courtesy-http://www.thegurureview.net/computing-category/is-intel-trying-to-destroy-micron.html

According to EETimes Paul Boudre, who claimed that SOI is already being used by Apple and Intel even though neither company is broadcasting it. SOI appears to be on track to major market penetration even while the rest of the industry is talking FinFETs.

GlobalFoundries general manager Rutger Wijburg told the SEMICON Europa 2015 that his outfit’s 22-nanometer “22FDX” SOI platform delivers FinFET-like performance but at a much lower power point and at a cost comparable to 28-nanometer planar technologies.

The 300-millimeter $250 million FD-SOI foundry here in the “Silicon Saxony” area of Germany, builds on 20 years of GlobalFoundries’ investments in Europe’s largest semiconductor fabs.

GlobalFoundries said it will extend Moore’s Law by using fully-deleted silicon-on-insulator (FD-SOI) transistors on wafers bought from Soitec.

Many had thought that if GloFlo’s FD-SOI gamble paid off then it would be a while before FinFET would have a serious rival. But Boudre’s claims suggests that SOI is already being used.

Customers like Intel and OEMs supplying fully-deleted silicon-on-insulator (FD-SOI) RF transistors to Apple proves that SOI and Soitec are past the cusp of the growth curve, destined to ramp up exponentially.

The problem for Soitec is no one is really talking about it. Chipzilla is committed to the FinFET, because it is higher performance than FD-SOI, even though it is higher power too.
Boudre said that it was supplying SOI wafers to Intel for other applications that don’t require high-performance. For instance, our wafers are very good for their silicon photonics projects.

Apple is already using SOI for several radio frequency (RF) chips in their front-ends, because they use 20-times less power. The iPhone is still using gallium arsenide (GaAs) for its power amplifier (PA) because it needs the high-power device for good connections, but for other RF front-end chips, and in fact for all the chips that they want to keep “always on,” the lower power consumption of FD-SOI is pushing the smartphone makers to Soitec, Boudre said.

SOI wafers cost three-times as much as bulk silicon but the cost per die is less because of the simplified processing steps including fewer masks.

Normally GPS chips run on 0.8 volts and consume over 20 milliamps, so they must be turned off most of the time. But when they are made with SOI wafers, they can run on 0.4 volts and consume only 1 milliamp. The mobile device to leave them on all the time and new and more accurate location sensing and new kinds of location-based applications can be developed.

What is amusing then is that Intel’s reason for going with FinFETs was that SOI wafers were too expensive but it did find a use for it.

GlobalFoundries’ Saxony fab will offer four varieties of its 22FDX process.

FDX-ulp for the mainstream and low-cost smartphone market. This will use body-biasing to beat FinFETs on power, but equal them in performance.

FDX-uhp for networking applications using analogue integration to match FinFETs while minimizing energy consumption

FDX-ull for ultra-low power required by wearables and Internet of Things applications. This will have a 1 picoamp per micron leakage

DDX-rfa for radio frequency (RF) analogue applications delivering 50 percent lower power and reduced system costs for LTE-A cellular transceivers, high-order multiple-input/multiple-output (MIMO) WiFi combo chips and millimeter wave radar.

Courtesy-http://www.thegurureview.net/computing-category/ibm-and-intel-going-goflo-soi.html